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Overview of GIGABYTE AORUS X570 PRO: time to gather a powerful PC Ryzen

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So lately into my hands from time to time fall GIGABYTE, the title of which is the word PRO. In 2018 my authorship out related models such as the AORUS PRO B450 and Z390 AORUS PRO. And you know what? In both cases we were dealing with a sturdy “workhorses” cards, which perfectly showed themselves in the coordinate system of “price — quality”. The character of today’s review — GIGABYTE model AORUS X570 PRO — fits into the designated category.

GIGABYTE X570 AORUS PRO

GIGABYTE AORUS PRO X570

#Specifications and packaging

At the time of writing, on the official GIGABYTE website was listed just nine motherboard models based on the new chipset X570. While X570 AORUS PRO exists in two versions — if you need a device with a preinstalled wireless module, look at the selling option called X570 AORUS PRO WIFI. Otherwise the versions are identical. Main technical characteristics of the device shown in the table below.

GIGABYTE AORUS PRO X570
Supported processors AMD Ryzen 3rd Generation
AMD Ryzen 2nd Generation
Ryzen with AMD Radeon Graphics Vega
Chipset AMD X570
Memory subsystem 4 × DIMM slots, up to 128 GB DDR4-2133-4400 (OC), for Ryzen 2000 — up to DDR4-3600 (OC)
Expansion slots 3 × PCI Express x16
2 × PCI Express x1
The storage interface 1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
6 × SATA 6GB/s
RAID 0, 1, 10
LAN Intel I219V, 10/100/1000 Mbps
Audio Realtek ALC1220-VB 7.1 HD
Interfaces on the rear panel 1 × HDMI
1 × RJ-45
1 × optical S/PDIF
3 × USB 3.1 Gen1 Type A
1 × USB 3.1 Gen2 Type C
2 × USB 3.1 Gen2 Type A
4 × USB 2.0 Type A
5 × 3.5 mm audio
Form factor ATX
Price 19 500 RUB.

I note that details about the set logic X570 you can read in the article “AMD Ryzen 7 3700X: Zen 2 in all its glory, “although the hereafter will necessarily be distinctive features of the new boards for the platform AM4.

The device is Packed in a small but colorful cardboard box. The packaging has a quite recognizable appearance, but the main thing is, of course, its contents. In addition to the Board, it was a lot of accessories, both useful and not:

  • user manual;
  • sticker with the logo AORUS;
  • disk with software and drivers;
  • four SATA cable;
  • the screws for fastening the M. 2 drives;
  • extension cable RGB tape;
  • adapter G Connector to facilitate connection of the bodies of management of the case.

In General, we have everything you need in order to start the Assembly of the system unit.

#Design and capabilities

So, we have motherboard form factor ATX. The manufacturer uses a full size PCB, that is, its dimensions are 305 × 244 mm. Many know the consequences of application of the PCB smaller. So, when attaching the circuit Board in the housing the right side will SAG and can be deformed upon connection of the memory modules or the main connector of the power supply. In the case of the AORUS PRO X570 unexpected “twists of fate” of this kind should not happen.

GIGABYTE X570 AORUS PRO

GIGABYTE AORUS X570 PRO: five PCI-E connectors

Since we are talking about the form factor ATX, the manufacturer may place on the motherboard up to seven expansion slots. However, X570 AORUS PRO boasts only five PCI Express slots. In the photo above, we see that the part of space occupied by the M. 2 ports required for installing SSDs. Well, cry about it just not worth it.

Motherboard supports technologies such as AMD CrossFire (hardware manufacturers, as we still use this term, although it is slowly disappearing) and NVIDIA SLI. When connecting two digital devices to the PCI Express x16 slots they will work according to the scheme x8+x8. If you read the review Ryzen 7 3700X, you know that now we are talking about PCI Express 4.0. Of course, this would require the processor family Ryzen 3000 (not the G-version, as it uses the now outdated architecture Zen+). In the case of “stones” Ryzen 2000, all the expansion slots will work according to the standard number 3.0.

The third PCI Express x16 slot always runs at x4 speed — these lines are provided directly by the chipset. They also — depending on the generation of processor Ryzen — will work with bandwidth or standard 4.0, or 3.0. And on the PCB X570 AORUS PRO has two PCI Express x1 4.0/3.0.

In my opinion, the location of the expansion slots at the test Board as a whole was successful. Firstly, the main PEG port is noticeably removed from the socket. In the end, X570 AORUS PRO will allow you to set any, even the largest air cooler. We also without any problems, without removing the video card, can install RAM modules.

Secondly, between the main PEG-ports a decent distance — such that we can combine in SLI/CrossFire arrays, even video cards with translatewiki coolers. I believe that in 99.9% of cases in the system will still use a single graphics accelerator, and therefore with one port PCI-Express x1 have to say goodbye. And another point: the graphics card will block the fan of system of cooling of the chipset and translateby 3D accelerator still soldered below the M. 2 slot.

Please note that the main PEG ports and DIMM slots are reinforced. Ports also have additional fixation and increased the number of soldering points on the PCB. In total, according to the manufacturer, these design solutions strengthen connectors 1.7 times when the load on the fracture, and 3.2 times when the load on the pulling.

When you install the DLC NZXT KRAKEN X62 I had to part with one DIMM slot — the ones closest to the CPU socket. This point is important to consider if you want to build a system with a liquid cooling system similar designs (when hoses “dropsy” are attached to the waterblock on the right) and if you plan to install into the system four memory modules.

GIGABYTE AORUS PRO X570 soldered seven 4-pin connectors for fans connection. The fee traditionally GIGABYTE allows you to control the impeller with shim and without it (fan with 3-pin connectors). Thanks for this Smart Fan 5. It supports even the fans power up to 24 watts. In General, the connectors for the “Carlson” is located successfully. I’d only moved to the side of the CPU socket connector SYS_FAN5_PUMP, which is the closest to 24-pin power port. The fact that connecting it to the pump maintenance-free DLC, not so easy to hide the protruding wire. Still want to collect a beautiful system units.

But SYS_FAN6_PUMP connector is successful. It will be useful to you if you are going to install in PC full custom “dropsy”. In Tower-building, as a rule, a tank of refrigerant and a pump mounted in the front portion thereof.

Speaking of beauty. At the top right of X570 AORUS PRO has just two ports for connection of led strips: one is designed for 12-volt RGB accessory, one for the 5V addressable strip. Exactly the same “sweet couple” and soldered at the bottom of the PCB. Another 12-volt plug is located next to the socket AM4. Is connected to the backlight of the cooler.

The Board highlighted left edge and a small strip on the plastic housing. Note that when using RGB Fusion 2.0 the user has the option to install 11 modes of illumination.

The disk subsystem includes six SATA 6 GB/s and two M. 2 slots. Now they do not share bandwidth with each other. The primary M. 2 connector allows you to install SSD sizes 2242, 2260, 2280 and 22110. It supports both SATA mode and in the mode PCI Express. The second option involves the CPU of the line: in the case of Ryzen 3000 we are talking about the 4.0 standard, in the case of Ryzen 2000 — on 3.0. The second M. 2 slot has the same features, but only in this case the PCI Express coming from the chipset.

In my opinion, the main M. 2 port is successful. It will not be covered by the graphics card, and if using an air CPU cooler installed this SSD socket will be additionally Abdovitsa. And here is an additional M. 2, I think, it was better to unsolder the lower PEG of the second port near the PCI Express x1 and chipset. With this arrangement, the SSD will not (even partially) covered by the video card, if the system has only one graphics accelerator. We can safely say that the era of NVMe drives come in fully — consequently, the presence in PC of two M. 2 SSD doesn’t look like something outlandish.

GIGABYTE AORUS X570 PRO features a high-quality Gigabit network controller Intel I219-V and sound chip Realtek ALC1220-VB. The audio codec has a ratio of “signal to noise” of 120 dB and an intelligent amplifier that automatically determines the impedance of the connected headphones. Separately, the manufacturer notes that the new controller enables us to convey to the Network the voice with a microphone connected to the 3.5 mm Jack on the front or on the rear panel. In addition, the tract is equipped with special capacitors WIMA FKP2. Here we see a complete copy of the audio subsystem used in the AORUS PRO B450.

The I/O panel GigX570 AORUS PRO you’ll find two USB 3.1 Gen2 A-type and another of the same, but C-type. Three USB connectors meet the USB 3.1 Gen1, and four 2.0. From video outputs there are HDMI only. The rest of the space on the rear panel is a RJ-45, optical S/PDIF output and five 3.5-mm mini-jacks.

As for the internal I/O ports X570 AORUS PRO on the edges of the PCB are soldered device from a single USB 3.1 Gen2, two USB 3.1 Gen1, two USB 2.0, TPM and F-audio.

From pleasant trifles I note the presence on Board button Q-Flash with which BIOS matplot you can upgrade, not even including the computer.

According to the manufacturer, Converter power X570 AORUS PRO has 12+2 phases — sounds impressive, agree. Controls the lines VRM PWM controller Infineon IR35201, which, as you know, works according to the scheme 6+2. This means that in reality the power subsystem X570 AORUS PRO, responsible for the operation of the computational cores has six phases — they simply double (on the reverse side we see the PWM-doubles Infineon IR3599). Each such channel comprises two inductors and two MOSFET Infineon IR3553, each of which can withstand a load of 40 A. Each of the two phases responsible for the SoC component of the CPU consists of one inductor and four MOSFETs ON Semiconductor — two transistor 4C10N and 4C06N.

In General, the power Converter X570 AORUS PRO inspires confidence. Moreover, field-effect transistors therein are cooled by two large aluminum radiators, connected by a copper deplorable. Details about the efficiency of the power Converter of this Board I’ll explain in a second part of the review.

Please note that the chipset of the device is cooled by an active cooler. We’ll get used to this state of Affairs, because many X570-the motherboard uses a similar cooling system. The fact that the level of heat the chipset up to 14 watts. As you know, AMD is, in fact, uses a modified I/O-chiplet, which is used in server processors EPYC Rome. It is produced using 14-nanometer technology and, as you can see, needs active cooling.

I have already noted that in some cases chipsetov fan of the cooler will be covered with a graphics card. This leads to the fact that the chipset if you use temperature sensors the Board is heated to 55-60 degrees Celsius. The fan is quite loud only when turning on the computer, and then it takes a few seconds and it ceases to be heard.

Of course, over time the impeller gets clogged with dust and may begin to make other sounds. However, we must understand that for the “health” of the system unit entirely meets its owner — don’t be lazy as often as possible to clean your PC from dust.

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Review AMD Ryzen Ryzen 5 and 3600X 3600 5: shestiyadernik healthy person

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AMD Ryzen 3900X 9: a split personality

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Last week AMD gave the press a computer a nightmare. The company’s desire to release their new 7-nm products certainly in “beautiful” date July 7 (7.07) led to the fact that the preparation for their announcements was carried out in a wild rush and very messy. For example, samples Ryzen 3000 arrived in our lab just five days before the “hour X”, but even during these five days we have been updating the BIOS of the test motherboard based on set logic X570, which not only corrected mistakes and added platform stability, but also seriously affect performance.

Because of this, we were faced with a difficult choice: either to engage in continuous retesting of the new processors at the next firmware versions and abandon any attempt to catch with the publication of the review of the first media micro Zen 2 at the end of information embargo, or for use in publications are not the most current performance data. But in the end was chosen as a compromise: the review was divided into two parts. The first part, which is dedicated to eight Ryzen 7 3700X, you most likely have already read – it appeared on our website in the very moment when the world started selling Ryzen 3000. And this article is the second part, and it will focus on the older 12-core representative of a new family, the processor Ryzen 9 3900X.

This separation allowed us again to recheck all the results on the last (at the current moment) version of firmware for the motherboard and ensure that the first buyers Ryzen 3000 will have at its disposal is the level of performance, referred to in this material.

However, no certainty that this performance level does not undergo regular adjustments in the very near future, we have. The fact that the five different versions of the BIOS of our test motherboard that we have tested for five days of experiments, change in the system is quite fundamental. Them AMD not only in optimizing memory controller, but “tighten up” the variable Boost 2 technology Precision, increasing the real frequency of the processor at the expense of efficiency. It is quite possible that later the company will want to change the operating parameters of their processors again. In other words, today’s tests Ryzen 3000 is only a preliminary acquaintance, which occurs at an early stage in the life cycle of new products.

Perhaps in the circumstances it would be right to wait a few weeks and thoroughly test the new chips, when the situation with them already ustakanilos: motherboard manufacturers will prepare a stable version of firmware, based on the AGESA libraries that have all the essential optimization and AMD will come to a final understanding, a balance between performance and energy efficiency it wants to achieve in the end.

However, to do so would be not too rational. The hype created around the new version of the microarchitecture of authorship and the first AMD desktop processors based on it, is so great that the computer community is ready to swallow any information, even if it is in the nature of rough estimates. Therefore, the review Ryzen 9 3900X still goes on our website after the review Ryzen 7 3700X, despite the clear “dampness” of these products. Later, to put the final point in the subject’s performance of new products, we’ll just test them again.

#Of eight — twelve: topology Ryzen 9 3900X

Together with new microarchitecture Zen 2 AMD introduces into use the new topology. Processors now are not a monolithic crystal, and are assembled from several components. This allows the company under the old ecosystems Socket AM4 to offer a new powerful CPU, with 12 and 16 cores. The budget for such multi-core processors consists of nearly 10 billion transistors, but they are distributed over several semiconductor crystals, similar to the way it was done in the HEDT CPUs Ryzen Threadripper.

However, unlike Threadripper desktop CPUs are not constructed of the same components, they use semiconductor crystals of two different types. First, it is OCTA-core “computing” CCD chipley produced for 7-nm process at TSMC companies. Each chipset combines two CCX-complex, containing four cores and 16 MB cache in the third level. Second, an additional 12-nm I/O-chipset controller memory controller, PCI Express 4.0 and elements of the SoC, which is responsible for input / output.

Given the fact that Ryzen 9 3900X – dwenadzatiperstnuu processor, it is constructed from three semiconductor crystals: two 7-nm CCD-chipsetov, with 3.9 billion transistors with an area of 74 mm2, and 12-nm I/O chiplet area of approximately 125 mm2, consisting of 2.09 billion transistors. Connect chipley tyre Infinity Fabric, the same as that used for communication between CCX-complexes within a single CCD chiplet. And, most importantly, chipley nuclei have no direct link connecting them, and all internuclear interaction, is constructed using the I/O-ciplet, who also plays the role of the switch.

It is easy to calculate that a 12-core CPU Ryzen 9 3900X needs to be active not all the cores available. And it’s true: one computational kernel in each CCX available-complex hardware locked, which makes any of the initial 16-core stock CPU with 12 cores. In this case, limiting the number of cores is partly a forced measure, as 16 cores hard enough to enter in a valid Socket AM4 limits energy consumption. But AMD does not abandon the idea of release and 16-core Socket AM4 product. This project is scheduled for the autumn, it will be released under the name Ryzen 7 3950X, but the manufacturer will have to resort to a special education careful selection of semiconductor crystals.

Chipley approach allows to obtain several advantages. First, it allows to simplify the design and production of processors, but also offers ways for easy scalability of the products. Second, because of the separation of functions chiplets different types of AMD had the opportunity to avoid duplicating nodes, we need in a single number, for example, memory controller or bus controller PCI Express 4.0. Due to the fact that all these blocks are put into a single I/O-chiplet to which the CCD chipley have equal access, a logical processor is a monolithic structure with centralized mechanisms of memory accesses and to external devices. Any hints on the usual users Threadripper NUMA-modes in the AM4 Socket system, all cores in 12 – and 16-core processors have exactly the same access to the array RAM.

Everything said is illustrated by the results of practical measurements. As for memory access, then it is all really OK. Ryzen 9 3900X shows approximately the same latency that OCTA-core processor Ryzen 7 3700X. This means that the connection to the I/O chiplet with the memory controller not one, but two CCD chipsetov does not entail any negative effects. Thanks cipitol the layout of memory for all cores do seem to be a single array with the same delay.

And by the way, please note, Ryzen 9 3900X is not subject to the same problem with lower half-bandwidth of the recording, which we found Ryzen 7 3700X. It turns out that the memory controller I/O coplete Ryzen 3000 just optimized to work with two CCD chipsetati and when you connect one chiplet full performance can not give.

But much more disturbing than the speed of the memory cause a latency of internuclear interaction. It seems that the location of the nuclei in different CCD-chiplet should impose a substantial penalty in data transfer between them. For example, the latency in the exchange of information between cores in different crystals in the processors Threadripper, one and a half times higher than when transfers between different cores CCX-complexes within a single crystal. However, surprisingly, such problems have Ryzen 9 3900X does not exist. Here the internuclear interaction between the nuclei belonging to different CCX-complexes, leads to the same delays regardless of whether we are talking about the CCX in the same or in different CCD-chiplet.

And this is a really serious achievement. Thanks to the centralized scheme of the mutual connection of cores, multi-processor Ryzen 9 3900X from the side looks like a completely solid solution. No additional penalties for mercapital communication do not. And therefore, there is no reason to compare Ryzen 9 3900X with Threadripper. What AMD offers at this time – a full 12-core processor, not the Assembly of the two shestiyaderny in a single housing.

#Read more about the characteristics of Ryzen 9 3900X

The review Ryzen 7 3700X we compare it with the older LGA1151-Intel. It was logical, based on the number of cores and threads: Ryzen 7 3700X – shestnadtsatiletnij and OCTA-core CPU, like Core i9-9900K. In fact, however, AMD continues to follow his principle “we will have more cores for the same money than the competitor” and contrasts the Core i9-9900K completely different your processor. The recommended price of $499 in the new lineup got a 12-core, 24-threaded Ryzen 9 3900X, and it is positioned as alternatives to the five hundred-dollar osmeteria Core i9-9900K.

Cores/ Threads Base frequency, MHz Turbocheetah, MHz L3 cache MB TDP, watts Chipley Price
Ryzen 9 3950X 16/32 3,5 4,7 64 105 2×CCD + I/O $749
Ryzen 9 3900X 12/24 3,8 4,6 64 105 2×CCD + I/O $499
Ryzen 7 3800X 8/16 3,9 4,5 32 105 CCD + I/O $399
Ryzen 7 3700X 8/16 3,6 4,4 32 65 CCD + I/O $329
Ryzen 5 3600X 6/12 3,8 4,4 32 95 CCD + I/O $249
Ryzen 5 3600 6/12 3,6 4,2 32 65 CCD + I/O $199

Already in the simple comparison of the characteristics Ryzen 9 3900X against the Core i9-9900K AMD processor looks very impressive. Time and a half because in addition to the superiority in number of cores and threads Ryzen 9 3900X can offer and huge L3 cache with a total capacity of 64 MB, while in a competing processor, the cache memory of the third level less than four times. In addition, Ryzen 9 3900X can boast official support for DDR4-3200 and accelerated version of PCI Express 4.0.

The only thing Ryzen 9 3900X has not yet been able to surpass Intel CPUs is the clock frequency. They are for 12-core are declared in the range of 3.8-4.6 GHz, although in reality it will strive to get closer to its upper bound due to aggressive technology Precision Boost 2. However, lower frequencies are quite Ryzen 3000 kompensiruet his outstanding IPC (the number of executable per clock instruction): as we have seen, in many cases at the same frequency core 2 Zen work even faster cores Coffee Lake Refresh.

In the end, to find in the camp of Intel suitable opponent for Ryzen 9 3900X with the same number of cores, we will inevitably have to turn to heavy HEDT platform LGA2066. Only in its composition there are 12-core Core i9-9920X, but it is estimated at $1 199, that is 2.4 times more expensive than AMD’s flagship news related to the mass platform Socket AM4. Here, of course, one could argue that the HEDT platform offering Quad-channel memory controller and more PCI Express, however, such possibilities can hardly be attributed to the vital for most users things. And that means Ryzen 9 3900X actually blurs the line between HEDT and Socket AM4. Thanks to this gift from AMD users conventional bulk systems can now get the level of multithreading, which recently was only available to owners of heavy and expensive platforms LGA2066 or Socket TR4.

Ryzen 9 3900X Core i9-9920X Core i9-9900K Threadripper 2920X
Platform Socket AM4 LGA2066 LGA1151v2 Socket TR4
Manufacturing process, nm 7/12 14 14 12
Cores/ threads 12/24 12/24 8/16 12/24
Frequency (nominal/turbo) GHz 3,8/4,6 3,5/4,4 3,6/5,0 3,5/4,3
L3 cache MB 64 19,25 16 32
TDP, watts 105 165 95 180
Memory 2 × DDR4-3200 4 ×DDR4-2666 2 ×DDR4-2666 4 ×DDR4-2933
Lines PCIe 24 ×Gen4 44 ×Gen3 16 ×Gen3 64 ×Gen3
Price $499 $1 199 $488 $625

Let’s look at the characteristics of Ryzen 9 3900X more. Among the processors in the consumer segment this processor looks like an alien from another world. So it turns out due to the increased number of cores and huge cache, and these features are acquired thanks to the introduction of kiplenge design. In other words, it is legitimate to say that Ryzen 9 3900X – a vivid demonstration of the correctness of the course taken by AMD. The company’s engineers “flick of the wrist” collected from the two CCD-chipsetov mass processor to catch up with that in the baseline characteristics of the Intel in the near future obviously will not be able to.

 

Another feature Ryzen 9 3900X – relatively good frequency. Typically processors with more cores, lower clock frequency, but in this case the opposite happened. And nominal, and maximum frequency Ryzen 9 3900X superior cosmedent Ryzen 7 3700X, and even ahead of eight Ryzen 7 3800X terms of the maximum frequency. This means that Ryzen 9 3900X will be as good in multithreaded applications or when a more simple load on a limited number of cores. That is, the processor must be universal, not a niche solution for demanding work loads, this is technology Precision Boost 2 in aggressiveness which Ryzen 3000 we have already seen.

For example, look how are real working frequency Ryzen 9 3900X in Cinebench R20 load on different number of cores. The minimum frequency observed at full load CPU rendering, start from 4,025 GHz.

And for example, when OCTA core load, the processor is capable of operating at a frequency of 4.1 GHz, that is at least not slower than Ryzen 7 3700X. In the case of downloading a small number of cores Ryzen 9 3900X comes on frequencies above a 4.3-4.4 GHz.

When meeting with Ryzen 7 3700X we drew attention to its high operating temperatures. Ryzen 9 3900X, in which nuclei and a half times more, was also affected by this issue, and even more.

The stress load is received by the utility Prime95 29.8, raises the temperature of the CPU in the nominal mode up to 95 degrees (with the cooler Noctua NH-U14S) and the Converter power the motherboard reports the CPU consumption of about 190 watts of electricity.

It looks somewhat normal, and we were able to get unofficial confirmation that in the latest versions of the BIOS that came for X570-motherboard before the announcement of Ryzen 3000, technology of Precision Boost 2 is configured with a strong overestimation of the allowable limits for the consumption and heat dissipation that automatically provides an additional increase of operating frequencies. However, apparently, the initiator of this “overclocking out of the box” is the AMD, and it is unclear whether this mode will now become standard, whether it is imposed only on the output time of the first wave of reviews to get more positive reviews in the press, and will be removed.

#Acceleration

About acceleration Ryzen 9 3900X not much to tell. Here everything is done to us. Technology parameters Precision Boost 2 12-core unscrewed to the limit, and this CPU works at the maximum possible under dynamic acceleration frequencies without any additional configuration.

If to speak about static acceleration, the power voltage setting To 1.2, it was possible to achieve stable operation at a frequency of 4.0 GHz. Unfortunately, the processor is strongly heated, and it almost completely ties the hands of overclocking.

It is doubtful that in this static acceleration there is some practical sense. Technology Precision Boost 2 even at 100% load on CPU provides a slightly lower frequency, but when loaded by the operation of a part of cores it is able to provide for Ryzen 9 3900X noticeably better performance.

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AMD Ryzen 7 3700X: Zen 2 in all its glory

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The first processor microarchitecture Zen was released in March 2017. Since it’s only been two and a half years, but today, AMD is updating the lineup of its desktop processors that inherit this microarchitecture for the second time. Moreover, it is not about the formal updates. Let appeared in last year Ryzen second generation and can be calculated by a simple translation of the initial design on rails for a more advanced technological process, but now we are talking about much more significant change. New Ryzen third generation, we are talking about today, is not just advanced technological process, but also significant changes in the topology and microarchitecture.

AMD acts decisively and quickly: time after time she makes strides toward improving their proposals. And the results are not forced himself to wait. The company is steadily increasing its share of the processor market, and Ryzen second generation deservedly reputed to be the best proposals for the mass market on a combination of price and performance. And even the skeptics now believe that AMD has managed to seriously shake up the CPU market and make at least so that announcements of new processors from mediocre updates turned into the main events in the computer industry.

However, now the company wants even more. While Intel continues to torment the 14-nm process technology and microarchitecture Skylake come from 2015, AMD is going to finally seize the initiative. At Ryzen third generation has the mission to demonstrate the technological superiority of AMD and translate it from second place to first. But will the third attempt improved AMD to create the best in recent history processor for desktop systems successful?

We write these lines, when you already know the test results. And I can say for sure, Ryzen in 3000 there is a lot of positive changes that put them head and shoulders above its predecessors. However, challenges remain, which subject the story of the novelties turns out not too simple.

For this reason, the material on testing Ryzen 3000 we broke into two parts. In the first part we talk about the new osmeteria Ryzen 7 3700X, the example which is easiest to analyse design compared Ryzen previous generation Intel Core. The second part, which will be released following the first, will be devoted to testing the 12-core flagship Ryzen 9 3900X with which AMD is going to put in the mass market segment a series of absolute records.

#What you should know about the new microarchitecture Zen 2

If the release of processors Ryzen first and second generation AMD wanted to convey the idea that she finally returned to the top League of developers and manufacturers of x86 processors, today’s announcement Ryzen 3000 brings already a completely different message. Now the company puts before itself a more ambitious goal – to become the leader of the processor market, which offers the fastest, most energy efficient and most technologically advanced chips.

And this task seems impossible. In the past year, AMD managed to build a very solid Foundation from which she is able to confidently start up. Thanks to the cooperation with one of the leading contract manufacturers of semiconductors, Taiwan’s TSMC, the first company in the PC industry shifted the production of its processors for the 7-nm technology, which allowed it to increase the density of the crystals to raise their operating frequencies and, in parallel, to improve energy efficiency. In addition to this, AMD has introduced another innovation and moved to a new mnogoshipovyh (cabletow) the layout of processors, which suggests the Assembly of final products of several semiconductor crystals, which allows to circumvent many manufacturing complexity and significantly reduce the cost of complex multi-core processors.

But Ryzen third generation mark so highly not only because they are able to offer the users a lot of working at high frequency cores for a relatively small amount. Something similar already was in the range of AMD before. But based on previous arm processors, there were many claims with low single-threaded performance with serious delays in the internuclear interaction and the inefficient memory controller. Now, all these deficiencies in varying degrees, should be eliminated. Speaking about the improvement of the performance of new Ryzen in comparison with the predecessors, AMD operates two-digit percentages, and it really seems very serious progress against the background of development in recent years Intel.

However, you need to understand that this major increase in performance Ryzen third generation is largely driven by the low base effect. The new processor microarchitecture is not something fundamentally new: 2 Zen is different from Zen/Zen+ is, in fact, carries with it a set of fixes for the most critical problems of its predecessors. But because of the problems of a different sort were many, and many of them caused considerable damage to the overall efficiency of the microarchitecture, their removal ultimately leads to significant productivity gains.

And yet, to belittle the merits of AMD, we would not like. The ultimate in Zen 2, there have been many positive changes: increased throughput on-chip all major highways, increased download of available processor cores of the computing resources become more amounts of data that the processor can operate locally, as well as significantly increased key performance indicator specific performance microarchitecture – the number of executable per clock instructions (IPC).

Detailed analysis the analysis of the architectural innovations and improvements in Ryzen 3000 we have dedicated a separate article in it about the structure of micro Zen 2 describes in great detail.

Here we only recall the main causes that determine the growth of the notorious figure of the IPC. They need to know at least in order to better understand the results of the tests representatives of the family Ryzen 3000. So this:

  • Increase the width of the block floating point unit (FPU) from 128 to 256 bits. Thanks Zen 2 can execute a 256-bit AVX2 instructions in one go, that is twice as faster than previously.
  • A two-fold increase in cache decoded micro-operations, which should reduce the downtime of the Executive part of the conveyor due to the lack of performance of the decoder of x86 instructions.
  • Significantly improved the prediction of transitions in the mechanism which is now used new TAGE predictor (Tagged geometric) and increased by the amount of buffers for the purposes of branchings of the first and second levels. All of this reduces the error probability of the branch prediction and minimizes the number of situations when the processor is forced to reset the pipeline state from-for incorrectly made predictions of branching code.
  • The appearance of an extra (third) of the block address generation (AGU), which allows the execution units more timely access to necessary data even at high loads.
  • Doubled bus width of the cache memory that also allows you to eliminate bottlenecks when handling the actuators to the data.
  • Double volume cache of the third level, the total amount of which made up 32 MB for each eight-chiplet.
  • Advanced algorithms pre-fetch data, enabling transfer of data from memory into the cache before they are requested during the execution of the program code.
  • Increased the size of the queue schedulers that allowed us to improve the efficiency of the SMT technology.
  • Increased the size of the register file, which gives the processor the ability to process more commands in parallel without any delay.
  • Additional fixes in microarchitecture that help to neutralize the attacks, the Spectre V4 without impacting performance.

To illustrate the micro-to improve the practical examples is quite simple. For this we usually use a simple synthetic benchmark test of AIDA64 utility: they allow you to see how performance has changed in the performance of certain standard algorithms. In the figures below we compare the past generation Ryzen (Pinnacle Ridge) with the current (Mattisse) for example shestnadcatiletnih and eight-core chips running at the same clock frequency of 4.0 GHz. In addition, the chart is placed the results of eight Lake Coffee Refresh, also clocked at 4.0 GHz.

In fact, all these results are very curious. First, they show that for some algorithms, microarchitecture Zen 2 provides almost two-fold performance increase, while in other cases, the performance remained at the same level. Second, they allow to say that in terms of a relatively simple computational algorithms, which are well rasparallelivanija and do not need in active work with external data from memory, microarchitecture Zen 2 has not only grown to the efficiency of the microarchitecture of Intel Skylake, but even surpassed it.

The most impressive progress Matisse shows in those algorithms which use floating point. Specifically, where used instructions AVX2, FMA3, and FMA4. After all, it is their performance in Zen 2 has doubled.

As for integer calculations, with them, no problems there in previous processors Ryzen. Now there was a small change in performance, associated primarily with changes in the caching and decoding of instructions with a decrease of the L1I cache and increase the cache decoded micro-operations. Not to mention the relatively poor result of Matisse in the CPU Photoworxx test. The fact that it is the only benchmark in which among other things plays a role in the performance of the memory subsystem. And with it a new Ryzen really is not as good as a class. But let’s not get ahead of ourselves.

#Bus Infinity Fabric and the speed of internuclear interaction

If we talk about osmeterium and shestiyaderny, the processors Ryzen third generation has retained its traditional basic structure – they are composed of two Quad-core complexes CCX (Core Complex), which are placed in one eight-core processor chip-Deplete CCD (Core Complex Die) and connected inside tire Infinity Fabric. However, the difference from previous processors is that the OCTA core CPU is no longer a single monolithic crystal. The memory controller, PCI Express controller and the SoC elements removed from the CCD chiplet in a separate I/O-chipset manufactured for 12-nm technology at GlobalFoundries companies. This double-crystal arrangement does not affect the communication between cores and L3 cache – everything here stays the same.

In processors with 12 and 16 cores all adds another level of hierarchy – they use the same OCTA core CCD chipley, but a double number. This direct connection with each other CCD chipley do not have. They are connected by bus Infinity Fabric only with I/O-capleton, so all the interaction between nuclei in different chiplet, going through the smart host – I/O chipset.

In the end, it turns out that even in the case of eight cores cores of unequal relative to each other: there is a “close” of the kernel (in one CCX-complex), and is – “distant” (located in different CCX and having the ability to communicate with each other only via Infinity Fabric). In processors based on CCD pair are still “very far” cores physically located in different crystals. For this specific delay when communicating between cores is different depending on, they are United in one CCX or are different. And it is quite disturbing moment: in the processors Ryzen past generations delay encountered when communicating cores from different CCX became quite noticeable and in some cases hindered the performance.

Ryzen in 3000, this issue should have been partially fixed. First, AMD worked with Microsoft and was able to ensure that the scheduler of the operating system now account for the topology of the processor and first loaded the kernel from one CCX-complex, moving to the next CCX, available only when the kernel is already loaded in the previous job. Such a strategy is inherent to the scheduler in the new version of Windows 10 May 2019 Update in relation to the processors Ryzen this allows to reduce the number of calls inter-core bus-Infinity Fabric high delays and focus calculations, if they do not load all the processor cores inside the CPU the smallest unit.

Secondly, the tyre Infinity Fabric Ryzen new generation of markedly accelerated by itself: its width is doubled from 256 to 512 bits. Much it improves the situation? Positive effect it is easy to check that, we did our traditional test delays when transferring data between cores. For comparison, the following are the results of the measurements made, not only for the OCTA-core processor Ryzen third generation, but also for osmeteria last generation (Pinnacle Ridge), and eight Coffee Lake Refresh. All processors during the test was reduced to a single clock frequency of 4.0 GHz, the memory of all CPU operated in the mode DDR4-3466, and that means the tire is Infinity Fabric to compare Ryzen used the same frequency 1733 MHz.

The situation in Ryzen 3000 really has improved markedly. Core belonging to the CCX-complex, is now able to exchange data 25% faster, and the kernel belonging to different CCX are “closer” to each other by a third. Thus, Ryzen 3000, at least if we talk about CPUs with cores not more than eight, problems with high latency inter-core cooperation will be subject to significantly lesser extent. Moreover, the speed of connections between nuclei belonging to the CCX-complex, new members of the family Ryzen has surpassed even Coffee Lake Refresh, which uses a ring bus, which is considered the most successful variant of the connection parts of the processor into a single unit.

The positive impact of high speed Infinity Fabric should be manifested not only when transferring data between cores. It is worth Recalling that each CCX-complex Ryzen processor has its own cache of the third level, and all the large 32 MB L3 cache in eight Ryzen 3000 actually represents two cache to 16 MB. Therefore, treatment using Infinity Fabric occur in the case when the kernel of the same CCX-complex need of data in L3-cache of the second CCX-complex. Therefore, the observed speedup Infinity Fabric should have a positive impact on performance in a wide range of situations, including when working with data.

However, another problem associated with the speed Infinity Fabric remained unresolved: the frequency of this bus continues to be associated with the frequency of the memory controller. Although the new AMD processors and implemented the asynchronous mode of operation Infinity Fabric, the frequency of this bus still can not exceed the frequency at which the memory controller and the DDR4 SDRAM will continue to have a significant impact on the performance of Ryzen 3000.

#Speed cache memory

If we talk about working with the data, then the subsystem of the cache memory in processors Ryzen 3000 has not changed. The cache memory of the first (L1D) and the second level will retain the same size, organisation and latency, and the only novelty is the increased cache of the third level. Due to the transition to the 7-nm technology AMD allowed themselves to significantly increase the transistor budget CCX-complexes, and thus the third level cache has been doubled to 16 MB for every four cores. But even this area, which Ryzen 3000 is a CCX-a set of 7-nm semiconductor crystal is only 31,3 mm2, while in the processors of the previous generation, which are produced at 12-nm technology, CCX-complex is a 60 mm2.

But the increase in L3 cache there was not so much from the generosity of the developers. This is partly a forced measure. The new processors chilenas layout memory controller “drifted away” from the cores, and cache as much data – a method is needed in order to try to reduce the number of situations when processor cores are idle waiting for data from memory. AMD representatives say that in the first place, this should help resolve performance issues in games, but we’ll see.

Now I want to talk about another point: the increase in the volume of the cache memory is always accompanied by an increase in its delay. So what happened this time, but in fairness it should be noted that the increase in latency was quite small, with 38-39 to 41-42 cycles.

In the graphs below, we compared the latency of the cache memory eight cores Ryzen second and third generations, as well as relevant representatives of the family of Intel Core. All processors during the measurement was reduced to a single frequency of 4.0 GHz.

The cache memory of the first and second level Ryzen 3000 in comparison with processors of the previous generation has not changed its key performance parameters. The latency L1 and L2 cache remains at 4 and 12 bars. However, to say that the nearest to the computing cores, the cache memory is not changed, it would be wrong. The first-level cache Ryzen in 3000 is actually faster, because now he is able to serve two 256-bit read and one 256-bit write each cycle, which means increased throughput compared with previous processor family Ryzen in half.

As a result, the speed of L1 and L2 cache Ryzen 3000 are fully comparable with the speed of the cache memory levels lower in the actual mass processors competitor. And the cache memory of the third level in the new Ryzen, though, and increased its latency can still offer lower latency compared to the L3-cache in Intel processors Coffee Lake Refresh. However, we should not lose sight of the fundamentally different algorithms L3 cache in processors from different manufacturers. Zen/Zen+ and Zen 2 cache of the third level is very simple and victimization, and also independent for each CCX-complex. At the same time, consumer Intel platform LGA 1151 implemented more intelligent of inclusive cache, with writeback that is shared between all cores. In other words, the practical efficiency of the L3 cache in AMD and Intel are very different.

However, graphs are given of the latency give some reasons for concern. Namely, the concern is the terminal part of the curve of latency to Matisse, which shows the characteristics of the memory subsystem. As you can see, there are no reasons for optimism: Ryzen third generation were worse than their predecessors and, as a consequence, really lost on memory latency processors competitor. What’s the matter?

#Work with memory

Implemented in Ryzen 3000 Chilena layout was shared between the computing cores and the memory controller. While CCX-complexes with cores and L3 cache are in the 7-nm CCD-chiplet, the memory controller along with a PCI Express controller and elements of the SoC issued in another I/O-chiplet. The connection between chipsetati mounted the processor on a single printed substrate, using tires Infinity Fabric, which means data path from memory to CPU core has an additional stage. Although AMD says that the external bus Infinity Fabric similar high-speed characteristics of the bus that bind CCX-complexes inside the CCD chiplet, all of this somehow had an impact on the delays that occur when accessing the memory.

In other words, when it was discovered that the latency of memory Ryzen 3000 became worse than before, we are not surprised. More interesting: how deteriorated the speed of the memory in the new AMD processors. Clearly the answer to this question indicators Cachemem test from the AIDA64 utility (for correct measurements, all processors have the same frequency of 4.0 GHz in all cases, the systems have dual channel DDR4-3466 SDRAM timings 16-16-16-36-1T).

As shown, worsening memory latency Ryzen in 3000 compared with the previous generation processor is about 11 %. In addition, deteriorated, and the throughput speed of the recording, which shows the memory controller Ryzen 3000, became one and a half times lower than they were before. In other words, miracles do not happen: just as occurred in the mid-2000s, years of moving the memory controller from the chipset into the processor to accelerate work with memory, reverse the separation of the memory controller from cores naturally led to the opposite result.

Moreover, for AMD processors, the increase in memory latency is not just annoying little thing, it is really a very unpleasant moment. Speed of work with memory Ryzen last generation and so much lost to competitor processors. Now, with the release of Ryzen 3000, the situation will only get worse. Although throughput when reading and copying data from Ryzen 3000 and Intel Refresh Coffee Lake remain comparable, the speed of entry and from the point of view of the latency of memory, the new AMD processors are inferior competitors in 1,6-1,8 times.

But not everything is so dramatic. For potential buyers Ryzen third generation there is good news. The most important – in the newer processors used significantly redesigned memory controller, which is not so capricious as its predecessor. This is reflected in the passport characteristics: new Ryzen 3000 has received official support DDR4-3200 SDRAM, which had not formally been proposed. Moreover, the performance of the memory in the mode DDR4-3200 is guaranteed for all pairs of modules, regardless of their organization and the component base.

In addition, if we talk about implemented in a new memory controller capabilities, it is worth mentioning a couple of important things. First, Ryzen 3000 will now be supported by 32 GB modules, which means that in a system based on the new processors can be installed in a total of 128 GB memory. Second, the memory controller supports ECC. However, the ability to use this feature will depend on the motherboard, and, as experience shows, in regular consumer platforms, manufacturers usually do not activate.

However, the main advantages of the new controller becomes clear when its practical use. It is no exaggeration to call it unproblematic: it is omnivorous in respect to the memory modules and much more stable, not requiring tedious selection of timings to achieve stability at a relatively high frequency. At the time, as with processors Ryzen in previous generations the memory modules rarely could run in the modes faster DDR4-3466, with the new controller does not cause the problem and run the memory in higher speed modes. Coupled with the increased volume cache of the third level, this largely offsets the increase in latency of the memory subsystem as a whole.

However, AMD wouldn’t be himself if positive change didn’t come with the list of limitations and reservations. So, despite the possibility of considerable acceleration of memory, the maximum a rational mode of operation of memory Ryzen 3000 supports DDR4-3600. In this case, achieving maximum productivity, a more rapid frequency modes is meaningless from the point of view of performance.

Ryzen 7 3700X c DDR4-3600

Ryzen 7 3700X c DDR4-3600

The reason is that relations between the frequencies of the memory, memory controller and bus Infinity Fabric. They have complicated the lives of fans of AMD before, and will continue to do the same in processors Ryzen 3000, although certain changes have occurred. The most important thing: AMD has been able to decouple the bus frequency Infinity Fabric from the frequency of the memory: they are in the newer processors can vary independently. However, there is an important caveat: frequency Infinity Fabric must be either equal to or lower than the frequency of the memory. This means that the choice of memory modules will continue to have a significant impact on the processor performance in General.

The second caveat concerns the fact that the maximum number Infinity Fabric Ryzen 3000 is 1800 MHz, and at higher values the processor can not function. Also there is a third caveat. It concerns the fact that when using faster memory modules DDR4-3600, the clock generator of the memory controller automatically switches to 2:1, that is, starts to operate at half the frequency.

The memory frequency (mclk) The frequency of the memory controller (uclk) Bus frequency is Infinity Fabric (fclk)
Up to DDR4-3600 To 1800 MHz uclk = mclk fclk = mclk
DDR4-3600 1800 MHz uclk = 1800 MHz fclk = 1800 MHz
After DDR4-3600 Above 1800 MHz uclk = mclk/2 fclk = 1800 MHz

All of this leads to the fact that the use of memory in the faster modes DDR4-3600 no practical sense: when crossing the border into the subsystem memory comprising asynchrony adds additional and very significant delays.

Ryzen 7 3700X c DDR4-3866

Ryzen 7 3700X c DDR4-3866

As you can see by the above screenshot, the latency of the memory in the mode DDR4-3866 is approximately 9 NS is higher than when you select DDR4-3600 with the same settings, timings. To compensate for this increase in delay with a further increase in the frequency of DDR4 SDRAM, if we talk about the usual non-extreme overclocking, almost unreal.

Little hope remains that the frequency at Infinity Fabric in the serial processor under some conditions still to be raised above 1800 MHz, because in theory the motherboard have the appropriate setting with a rich choice of frequency for this bus. In this case, the processor systems Ryzen 3000 can make sense to use and faster than the DDR4-3600 modules.

However, we cross the line in the 1800 MHz to Infinity Fabric failed: select higher values will inevitably lead to complete failure of the test system.

#X570 chipset and compatibility with old boards

Ryzen testing the 3000 we were armed with a platform based on the chipset X570. AMD has prepared this chipset specifically for the release of their processor microarchitecture Zen 2, however, the fee for X570 – dispensable companion to the new Ryzen. Like their predecessors, Ryzen 3000 is compatible with the usual socket Socket AM4, capable of working in boards, as issued during the first and second generation Ryzen.

However, it is not so simple. For the new CPUs in older boards needed their support at the BIOS level, but its implementation is not so smooth for marketing reasons. In fact, Ryzen 3000 will be probably compatible with any Board on the X470 and B450, with all other platforms the situation is at the mercy of motherboard manufacturers. Therefore, support for new processors in any specific motherboards with chipsets X370, B350 A320 and may or may not appear.

The criterion of compatibility is simple: to ensure that she or other fee to work with Ryzen 3000, its BIOS needs to be rebuilt using the libraries AMD AGESA PI Combo_AM4 1.0.0.1 or later. If the motherboard manufacturer has released an update to the firmware Plata Ryzen 3000 will fit.

However, to use now for testing the new processors the old boards, it would not be a good idea. The fact that the motherboard manufacturers put all the efforts on optimizing the BIOS fresh generation Socket AM4 platform and support Ryzen 3000 to older platforms is implemented by a residual principle. It appears that almost all of the available BIOS updates for old boards are based on the code AGESA version 1.0.0.1 or 1.0.0.2, and these versions do not disclose performance Ryzen 3000 in full.

For proper operation of the new CPU and achieve maximum performance in the BIOS code needs to be applied library Combo_AM4 AMD AGESA PI 1.0.0.3, and this condition is currently performed only for a few boards, mostly with the chipset X570. For this reason, the tests were conducted us to the X570 which is due to better optimizations to offer better performance in a pair of Ryzen 3000. However, this situation is temporary: as code updates the BIOS in old motherboards with their performance Ryzen 3000 will have to catch up to the same level, which today provide a fresh platform.

The chipset X570 are no particularly popular in this moment of opportunity in the platform Socket AM4 adds. The main reason why users should pay attention to is the appearance in boards based on PCI Express 4.0. If you use 3000 Ryzen in such fees this interface is supported both graphics PCIe x16 slots and slots M. 2 NVMe drives, but also any other PCIe slots. In addition, charges of new generation usually are equipped with a large number of ports USB 3.1 Gen2: processor and chipset X570 unable to provide up to 12 ports.

Processors Ryzen 3000 have 24 lines PCI Express 4.0. Four lines of that number are utilized to connect to the chipset, and four more lines are given to work with the system NVMe SSD. The remaining 16 lines is an interface with the graphics card.

Chipset X570 has at its disposal 20 PCI Express 4.0, four of which need to communicate with the processor. The remaining 16 lines of the manufacturer of the motherboard may allocate the PCIe, M. 2, or to configure them as additional SATA ports.

At this stage it all seems not so popular, although devices that support PCI Express 4.0 gradually penetrate into the market. So looking interface with twice as high throughput will use the graphics card Radeon 5700 RX and RX 5700XT. In addition, in the near future will begin to appear and SSD based on Phison controller PS5016-E16 (for example, the Gigabyte AORUS Gen4 NVMe SSD or Corsair Force Series MP600) that will also be able to take advantage of the increased bandwidth of the interface.

However, if you are thinking about purchasing motherboards X570, you should keep in mind that this chipset is very hot chip, the dissipation of which lies in the range of 11 to 14 watts under peak loads. Technically it is a reconfigured I/O-chiplet from server processors EPYC Rome, meaning it is based on a 14 nm chip manufactured at the facilities of GlobalFoundries. And so it is not surprising that she, as the processors need active cooling: the vast majority X570-motherboard used chipsety cooler with a fan.

In addition, Socket AM4-boards that use the X570 will be among the flagship platforms. And this means that they will cost a lot to expect that the price of the cheapest boards of the new generation will start from $200-$250.

#Read more about Ryzen 7 3700X

The range of processors Ryzen 3000 (code name Matisse) consists of six versions: two shestiyaderny, two osmeteria, dvenadtsatietazhnogo and shestnadtsatiyaderny processors. For the first trial review we chose the average model Junior OCTA core CPU Ryzen 7 3700X.

This was done primarily because it is easy to pick up competitors – OCTA core processor as a competitor, and among Ryzen past generations. In addition, Ryzen 7 3700X seems to be one of the most popular new products. It is possible to conclude, if you look at the composition of the lineup completely.

Cores/ Threads Base frequency, MHz Turbo frequency MHz L3 cache MB TDP, watts Chipley Price
Ryzen 9 3950X 16/32 3,5 4,7 64 105 2×CCD + I/O $749
Ryzen 9 3900X 12/24 3,8 4,6 64 105 2×CCD + I/O $499
Ryzen 7 3800X 8/16 3,9 4,5 32 105 CCD + I/O $399
Ryzen 7 3700X 8/16 3,6 4,4 32 65 CCD + I/O $329
Ryzen 5 3600X 6/12 3,8 4,4 32 95 CCD + I/O $249
Ryzen 5 3600 6/12 3,6 4,2 32 65 CCD + I/O $199

The attractiveness of Ryzen 3000 is due to four factors: high performance, affordable price, reasonable power consumption and heat and hope for a non-zero overclocking potential.

And indeed, Ryzen 7 3700X – a full eight-core Socket AM4 processor microarchitecture Zen 2, collected from a single 7-nm CCD-chiplet with a complete set of active cores and 12-nm I/O chiplet. It has a slightly lower frequency in comparison with the older osmeterium Ryzen 7 3800X, however, the difference in maximum frequency is only 100 MHz. No other fundamental differences have Ryzen 7 3700X in stock and a full-sized L3 cache for a total volume of 32 MB, and the L2 cache capacity of 512 KB per core.

That as the base frequency for the CPU is specified at 3.6 GHz, it is possible not to pay attention – in reality due to the technology of Precision avtoradgona Boost 2 CPU almost always comes at a much higher speed. For example, when testing in Cinebench R20 with load for different number of cores our instance showed real frequencies in the range from 4.1 to 4.4 GHz, which not only looks good, but exceeds the typical operating frequencies of last year’s flagship, Ryzen 7 2700X.

However, AMD is clearly disingenuous, speaking of energy efficiency Ryzen 7 3700X and relating it to 65-watt thermal package. To understand this, it helps to see how the system behaves with this CPU in the nominal mode in the stress tests, for example, in Prime95.

Raises questions are literally everything. And we should start with high operating temperature, which for our instance Ryzen 7 3700X test in Prime95 29.8 reached 90 degrees at that the AMD considers to be the maximum possible heating of CPU only to 95 degrees. But this picture in our case, there is not even a boxed Wraith Prism, but with much more powerful Noctua NH-U14S.

Of course, the processor crystal, performed on a 7-nm standards, has a very small “contact patch” with the heat-spreading lid, and therefore, cooling Ryzen 3000 really harder than the 12 – and 14-nm processors. However, the 90-degree heat CPU makes me doubt that this CPU under load shows the energy consumption at 53 W warn about all of its internal sensors. The impression is that AMD deliberately and very much lowers rates of consumption so that the processor is automatically overclocked to a higher frequency in the technology of Precision Boost 2, which for 65-watt Ryzen 7 3700X sets the upper threshold of consumption of 88 watts.

About what the real consumption Ryzen 7 3700X, to let the sensor Converter power the motherboard. According to their testimony, on the processor, which supposedly creates electrical load 53 W, current is supplied with a power of 106 watts plus about 15 watts per SoC. The system as a whole at this time shows consumption of the order of 185-190 watts, so that no doubt remains: 65-watt Ryzen 7 3700X under load can consume about twice the declared thermal package. In other words, energy efficiency Ryzen 7 3700X is a lie, slander and provocation.

Of course, this consumption can be attributed to misconfiguration technology Precision Boost 2 in the BIOS specific motherboard or AMD initiated by the most wilful disregard of the part of the heating package, but you need to understand that if the manufacturer and decide to return Ryzen 7 3700X promised energy efficiency, it will inevitably hurt its performance. Otherwise here is not given.

But then Ryzen 7 3700X not to take, it’s a very attractive price. Ryzen 7 3700X – not just the cheapest cosmedent architecture Zen 2, is also the processor with the lowest in the new model range of the specific value of the kernel. In addition, its cost is lower prices Junior OCTA core proposals of the competitor. All of this could easily be done by Ryzen 7 3700X “choice of millions”, despite any of its shortcomings.

#Acceleration

Ryzen 7 3700X – Junior cosmedent in the lineup of new products, and such induction usually means the processor is effective to disperse at least reach the frequency of senior representatives of the model range. Moreover, AMD traditionally did not repair any obstacles overclockers. Multipliers Ryzen in 7 3700X are not blocked and heat-dissipating cover continues to pripiats to the surface of semiconductor crystals, despite the fact that under it their is now two.

However, dispersal is still not about Ryzen 7 3700X. AMD in each new generation has steadily squeezed from the processor frequency potential all the juice, and to date has achieved this perfection. We can say that Ryzen 7 3700X operated close to the limit of their capabilities even in the nominal mode due to the technology of Precision Boost 2, which is clearly implying the observed operating temperatures.

Anyway, the maximum frequency we managed to “squeeze” when manually overclocking Ryzen 7 3700X, was only 4.2 GHz. If you increase the voltage to 1.4 V CPU at this frequency was stable and passed stress tests in Prime95, but temperatures under load increased to 105 degrees, which is hardly a normal operational mode.

The result is of more theoretical value, and to resort to such a crackdown on the practice makes no sense. The performance boost in multi-threaded load will be a few percent despite the fact that at partial load of cores the CPU will work even slower than in the nominal mode.

While AMD offers enthusiasts another way to increase performance – adjustment settings Precision Boost 2 so that the processor yourself out on the higher frequencies as a built-in algorithm avtoradgona. This technology allows you to change the key supporting constant – consumption limits current (PPT) and electric power (TDC and EDC), together with the increase in the upper limit frequency, and can be used for acceleration. However, some noticeable effect by changing these limits in the case of Ryzen 7 3700X us to achieve and failed. Even in the nominal mode Precision Boost 2 controls the frequency Ryzen 7 3700X very aggressive, and the main problem standing in the way of dispersal is not limiting, consumption and currents, and high temperatures.

SOURCE

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