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Overview of ASRock Z390 Steel Legend: simplicity is not to the detriment of

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Until April this year, the company ASRock has released 15 motherboard on chipset Intel Express Z390. One of them was as advanced level pattern Z390 Taichi Ultimate, and very simple and affordable kind of Z390 Pro4. In other words, fans of ASRock to pick up cost according to the specifications, form factor and the wallet did not work. However, in mid-April, the company announced a new model – ASRock Z390 Steel Legend, part of a series of “Steel of legends”, where now there are three boards, two of which are based on chipset Intel B450.

The company is positioning the boards in this series as the basis for gaming systems, since these products have improved reliability, improved cooling and is based on durable components. This warranty period is still limited to three years rather than five, as the products of competitors with similar positioning. Let’s see, why do we need ASRock Z390 Steel Legend, and to whom it is interesting?

#Specifications and cost

Supported processors Intel Core i9 / Core i7 / Core i5 / Core i3 / Pentium / Celeron
performed LGA1151v2 eighth and ninth generation microarchitecture Core
Chipset Intel Z390 Express
Memory subsystem 4 × DDR4 DIMM UN-buffered memory up to 128 GB;
dual channel mode memory;
support modules with frequency of 4266(O. C.)/4133(O. C.)/4000(O. C.)/3866(O. C.)/3800(O. C.)/
3733(O. C.)/3600(O. C.)/3200(O. C.)/3000(O. C.)/2933(O. C.)/2800(O. C.)/2666/2400/2133 MHz;
modules support for ECC UDIMM memory (does not work in ECC);
15-micron gold-plated contacts in the connectors;
support for Intel XMP 2.0 (Extreme Memory Profile)
GUI The integrated graphics core processor allows you to use the HDMI port is version 1.4 and Display Port version 1.2;
supports resolutions up to 4K inclusive (4096 × 2304 at 60 Hz);
supports Auto Lip Sync, Deep Color (12bpc), xvYCC and HBR (High Bit Rate Audio) via HDMI 1.4 Port (you need a compatible HDMI monitor is required);
support for the HDCP 2.2 with HDMI 1.4 and DisplayPort 1.2 Ports
Connectors for expansion boards 2 PCI Express 3.0 x16 modes x16, x16/x4;
3 PCI Express x1 slots, Gen 3
The scalability of the video AMD 2-way CrossFireX Technology
The storage interface Intel Z390 Express:
– 6 × SATA III throughput up to 6 Gbps (supports RAID 0, 1, 5 and 10, Intel Rapid Storage Technology 16, NCQ, AHCI and Hot Plug);
– 2 x Ultra M. 2, bandwidth of each up to 32 GB/s (both connectors support SATA and PCI Express drives, М2_1 length from 30 to 110 mm, М2_2 length from 30 to 80 mm);
– support Intel Optane Memory
Network
interfaces
Intel Gigabit LAN I219-V (10/100/1000 Mbps):
– supports Wake-On-LAN;
– protection from lightning and electrostatic discharges;
– supports energy efficient Ethernet 802.3 az;
– supports PXE
Audio 7.1 CH HD audio codec Realtek ALC1220:
– supports Premium Blu-ray audio;
– protection against power surges;
audio capacitors Nichicon Fine Gold Series;
– 110dB SNR DAC with Differential Amplifier;
– insulation of the printed circuit Board;
– separate layers on the PCB for the left and right channel;
gold – plated audio plugs
USB interface Intel Z390 Express:
– 5 USB 2.0/1.1 ports (2 on back panel, 3 connected to the connectors on the system Board);
– 6 ports USB 3.1 Gen 1 (2 on back panel, 4 connected to the connectors on the system Board);
– 2 ports USB 3.1 Gen 2 (rear panel, Type-A and Type-C).
All ports are protected against electrostatic discharges.
Connectors and buttons on the rear panel Two port USB 3.1 Gen 1 and a combined PS/2 port;
the HDMI and DisplayPort;
single port USB 3.1 Gen 2 Type-A and one USB 3.1 Gen 2 Type-C;
two USB 2.0/1.1 network LAN-socket RJ-45 with led (ACT/LINK LED and SPEED);
optical S/PDIF output interface;
five 3.5-mm 15-mm gold-plated audio connectors
Internal connectors on the PCB 24-pin ATX power connector;
8-pin ATX 12V power;
6 SATA 3;
2 M. 2;
4-pin connector CPU fan with PWM support power up to 1A (12 W);
4-pin connector for pumps DLC power up to 2A (24 W);
3 4-pin connectors for case fans with PWM support;
connector for addressable RGB LED-lines;
2 connector for RGB LED-lines;
a group of connectors for the front panel;
audio connector for the front panel;
SPI connector TPM;
COM connector;
the power led and speaker connector;
Thunderbolt AIC connector (5-pin);
2 USB 2.0/1.1 connection 3 ports;
2 USB 3.1 Gen 1 for connecting 2 ports
BIOS 128 Mbit AMI UEFI BIOS with multilingual interface and the graphical user interface;
ACPI 6.0 wake-up;
support SM BIOS 2.7;
DRAM, PCH 1.0 V, VCCIO, VCCST, VCCSA, VPPM
Controller I/O iTE I/O Controller Chip IT8688E
Corporate functions, technologies and features ASRock Super Alloy:
– XXL aluminum radiator;
– chokes Premium 60A Power Choke;
capacitors Nichicon 12K Black (100% Japan made polymer capacitors high quality and conductivity);
– shaped PCB Design;
black frosted printed circuit Board;
– High Density Glass Fabric PCB;
Technology ASRock Intel POOL (Planes on Outer Layers);
Steel socket ASRock;
ASRock Full sized radiator for M.2;
ASRock Ultra M. 2 (PCIe Gen3 x4 & SATA3) ASRock andthe indicator POST of the codes;
ASRock Full Spike Protection (all USB, Audio and LAN);
ASRock Live Update & APP Shop
Form factor, dimensions (mm) ATX, 305 × 244
Operating system support Windows 10 x64
The warranty of the manufacturer, years 3
The estimated retail value for you! ~10 000

#Packaging equipment

ASRock Z390 Steel Legend comes in a very large cardboard box, decorated mostly in dark colors. The front side of the package contains only the name of the Board and icons of supported technologies.

 

The reverse side talks about the key features of the product, there you can find the brief characteristics of the Board.

Inside colored sheath inserted box of cardboard, where the pallet is made of polyethylene foam fixed fee, additionally sealed in antistatic bag. On the bottom of the box there were a few screws in the bag, the cover on the rear panel, one SATA cable and instructions with DVD.

 

Of course, any bonuses are not included, since the Board belongs to the budget class and will cost about $ 150, or about ten thousand rubles at the current rate. Warranty – three years.

#Design and features

ASRock Z390 Steel Legend performed at almost black PCB on the front side of which there are three silver radiator. No plastic casings here, which can not but rejoice. The reverse side of the Board, by and large, is empty, which once again confirms its modest budget level.

 

Aluminum radiator large area for power supply circuits of the processor modeled by the casing, so it looks quite original. Echoes and chipset combined with a plate heat spreader of the second M. 2 port. Coupled with another heat sink at the first M. 2, these elements give the Board a modern and even to some extent aggressive look.

 

The elements of design can be attributed to the inscription STEEL LEGEND at the edge of the PCB, which gets highlighted along with the logo of the series.

We add that the dimensions ASRock Z390 Steel Legend are 305 × 244 mm, that is, it refers to the standard ATX.

The particular location of the motherboard components on the PCB shown in the diagram from the instruction manual.

 

On the interface panel displayed only a basic set of connectors. Here you can find a combo PS/2 port, video outputs HDMI and DisplayPort, network LAN-socket, six USB and audio outputs.

To the left there is a mounting bracket for antennas of the wireless communication module, although the module included with the cost there, but the connector for it M. 2 (Key E) in the center of the Board is present — it allows you to set module 2230 WiFi/BT and Intel CNVi.

Despite the low price of the Board, all the radiators are fastened with screws, not plastic studs, so they are removed without difficulty.

Note that the fee is based on the PCB of high density, more resistant to thermal stress and humidity. But the double thickness of copper layers, the product is ASRock, not here. However, it is quite predictable.

Any brand features CPU socket LGA1151 design-v2 does not have the holes for the temperature sensor in its center and no. In this case, it is possible to install any Intel eighth and ninth generation of the Core microarchitecture.

CPU power is organized according to 8-phase scheme with assemblies Dr. MOS, durable capacitors Premium 60A Power Choke and Nichicon 12K. In this case directly on the CPU core only have six phases.

For power management meets PWM controller uP9521P production uPI Semiconductor.

Power to the Board and its components is supplied in two standard housing with 24-and 8-contacts.

 

They have no needles high density or metallic sheath. All standard.

Chipset Intel Z390 here too, the most usual, however, something special he can be, in principle, can not.

ASRock Z390 Steel plastic Legend is equipped with four DIMM slots for memory modules of standard DDR4.

The total amount of RAM on the Board can reach 128 gigabytes, and the maximum frequency of 4266 MHz. Of course, the Board supports XMP profiles, and a list of certified modules it takes a few pages.

In terms of PCI-Express fee, can be called poor. She has only one full PCI Express 3.0 x16, connected to the processor lines. He has a metallic shell to amplify and additional electrical protection.

The second slot of this form factor can only work in x4 mode, therefore, NVIDIA SLI technology is not supported, and the combination of the two AMD graphics cards will work in CrossFireX at x16/x4. In addition, the Board has three PCI Express x1 slots with open ends for the installation of long expansion cards.

Six SATA III ports with a throughput of up to 6GB/s implemented by the chipset. Four ports are located horizontally, and two vertically.

 

High speed storage, there are two Ultra M. 2 port, throughput can reach up to 32 GB/s. it is Convenient that both connectors support both SATA and PCI Express drives, and uncomfortable that М2_1 divides chipset line ports SATA3_0 (if you install a SATA drive) or SATA3_1 (if you install a PCI-E drive), and М2_2 shares lines with SATA3_5 connector.

In port М2_1 you can install drives in length from 30 to 110 mm, and in М2_2 – length from 30 to 80 mm. Feature ASRock Z390 Steel Legend: both M. 2 port is equipped with a plate-radiator with pads. To budget models of motherboards that do not meet often.

All 13 of the USB ports on the motherboard are implemented by the capabilities of the chipset Intel Z390, additional controllers, no. On the back panel, 6 ports, including two high-speed USB 3.1 Gen 2 (Type-A and Type-C) with data transfer rate up to 10 GB/s. Four ports USB 3.1 Gen 1 can be connected to the two connectors on the PCB, and similarly with fees can take the three USB 2.0 ports.

Network controller on ASRock Z390 Steel Legend single Gigabit Intel I219-V.

Claimed protection from lightning and electrostatic discharges, Protocol support PXEand energy efficient Ethernet 802.3 az.

Based on the audio Board lies 7.1 CH HD audio codec Realtek ALC1220, complemented by five audiophile Nichicon Fine Gold audio caps in Japan.

The audio room is isolated from other elements on the PCB of the multiple conductive stripes for the left and right channels are different layers of the PCB, and the connectors for the connectors are covered with 15 micron layer of gold. Except for the last one is more of a marketing move, it’s quite a standard set for budget Board.

For monitoring and fan control on the motherboard is provided by controller Nuvoton NCT6791D.

Only the Board can control six fans with PWM or voltage changes, and one of the connectors is designed to connect energy-consuming pumps cooling system and could provide up to 2 A (24 W). Setting fans available in the BIOS or in the signature Annex A-Tuning.

Unfortunately, the fee is devoid of the indicator POST-codes, and partly to replace it offers four status LEDs CPU/DRAM/VGA/BOOT in the bottom right corner of the PCB.

ASRock Z390 Steel Legend supported proprietary illumination system Polychrome RGB SYNC. On the Board itself highlighted area of the chipset and the entire reverse side of the right edge of the PCB.

To connect led strips lighting on ASRock Z390 Steel Legend has three connectors, including one addressing mode (5 V, 3 A, 15 watts). Backlight control implemented in the BIOS or through the app ASRock RGB LED.

The set of connectors on the bottom edge of the PCB is quite usual and does not stand out with some unique solutions.

In conclusion, we note quite a decent cooling system of fees, consisting of a massive aluminum heatsink on the power circuits, chipset, combined with plate-radiator of the second M. 2, a separate heat spreader for the first M. 2.

After the first inspection ASRock Z390 Steel Legend can be quite a simple Board, with an average power of the power supply system of the processor and a basic set of controllers and functions. All pretty standard and no interesting features. Now look at your BIOS.

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Review AMD Ryzen Ryzen 5 and 3600X 3600 5: shestiyadernik healthy person

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Overview of GIGABYTE AORUS X570 PRO: time to gather a powerful PC Ryzen

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So lately into my hands from time to time fall GIGABYTE, the title of which is the word PRO. In 2018 my authorship out related models such as the AORUS PRO B450 and Z390 AORUS PRO. And you know what? In both cases we were dealing with a sturdy “workhorses” cards, which perfectly showed themselves in the coordinate system of “price — quality”. The character of today’s review — GIGABYTE model AORUS X570 PRO — fits into the designated category.

GIGABYTE X570 AORUS PRO

GIGABYTE AORUS PRO X570

#Specifications and packaging

At the time of writing, on the official GIGABYTE website was listed just nine motherboard models based on the new chipset X570. While X570 AORUS PRO exists in two versions — if you need a device with a preinstalled wireless module, look at the selling option called X570 AORUS PRO WIFI. Otherwise the versions are identical. Main technical characteristics of the device shown in the table below.

GIGABYTE AORUS PRO X570
Supported processors AMD Ryzen 3rd Generation
AMD Ryzen 2nd Generation
Ryzen with AMD Radeon Graphics Vega
Chipset AMD X570
Memory subsystem 4 × DIMM slots, up to 128 GB DDR4-2133-4400 (OC), for Ryzen 2000 — up to DDR4-3600 (OC)
Expansion slots 3 × PCI Express x16
2 × PCI Express x1
The storage interface 1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
6 × SATA 6GB/s
RAID 0, 1, 10
LAN Intel I219V, 10/100/1000 Mbps
Audio Realtek ALC1220-VB 7.1 HD
Interfaces on the rear panel 1 × HDMI
1 × RJ-45
1 × optical S/PDIF
3 × USB 3.1 Gen1 Type A
1 × USB 3.1 Gen2 Type C
2 × USB 3.1 Gen2 Type A
4 × USB 2.0 Type A
5 × 3.5 mm audio
Form factor ATX
Price 19 500 RUB.

I note that details about the set logic X570 you can read in the article “AMD Ryzen 7 3700X: Zen 2 in all its glory, “although the hereafter will necessarily be distinctive features of the new boards for the platform AM4.

The device is Packed in a small but colorful cardboard box. The packaging has a quite recognizable appearance, but the main thing is, of course, its contents. In addition to the Board, it was a lot of accessories, both useful and not:

  • user manual;
  • sticker with the logo AORUS;
  • disk with software and drivers;
  • four SATA cable;
  • the screws for fastening the M. 2 drives;
  • extension cable RGB tape;
  • adapter G Connector to facilitate connection of the bodies of management of the case.

In General, we have everything you need in order to start the Assembly of the system unit.

#Design and capabilities

So, we have motherboard form factor ATX. The manufacturer uses a full size PCB, that is, its dimensions are 305 × 244 mm. Many know the consequences of application of the PCB smaller. So, when attaching the circuit Board in the housing the right side will SAG and can be deformed upon connection of the memory modules or the main connector of the power supply. In the case of the AORUS PRO X570 unexpected “twists of fate” of this kind should not happen.

GIGABYTE X570 AORUS PRO

GIGABYTE AORUS X570 PRO: five PCI-E connectors

Since we are talking about the form factor ATX, the manufacturer may place on the motherboard up to seven expansion slots. However, X570 AORUS PRO boasts only five PCI Express slots. In the photo above, we see that the part of space occupied by the M. 2 ports required for installing SSDs. Well, cry about it just not worth it.

Motherboard supports technologies such as AMD CrossFire (hardware manufacturers, as we still use this term, although it is slowly disappearing) and NVIDIA SLI. When connecting two digital devices to the PCI Express x16 slots they will work according to the scheme x8+x8. If you read the review Ryzen 7 3700X, you know that now we are talking about PCI Express 4.0. Of course, this would require the processor family Ryzen 3000 (not the G-version, as it uses the now outdated architecture Zen+). In the case of “stones” Ryzen 2000, all the expansion slots will work according to the standard number 3.0.

The third PCI Express x16 slot always runs at x4 speed — these lines are provided directly by the chipset. They also — depending on the generation of processor Ryzen — will work with bandwidth or standard 4.0, or 3.0. And on the PCB X570 AORUS PRO has two PCI Express x1 4.0/3.0.

In my opinion, the location of the expansion slots at the test Board as a whole was successful. Firstly, the main PEG port is noticeably removed from the socket. In the end, X570 AORUS PRO will allow you to set any, even the largest air cooler. We also without any problems, without removing the video card, can install RAM modules.

Secondly, between the main PEG-ports a decent distance — such that we can combine in SLI/CrossFire arrays, even video cards with translatewiki coolers. I believe that in 99.9% of cases in the system will still use a single graphics accelerator, and therefore with one port PCI-Express x1 have to say goodbye. And another point: the graphics card will block the fan of system of cooling of the chipset and translateby 3D accelerator still soldered below the M. 2 slot.

Please note that the main PEG ports and DIMM slots are reinforced. Ports also have additional fixation and increased the number of soldering points on the PCB. In total, according to the manufacturer, these design solutions strengthen connectors 1.7 times when the load on the fracture, and 3.2 times when the load on the pulling.

When you install the DLC NZXT KRAKEN X62 I had to part with one DIMM slot — the ones closest to the CPU socket. This point is important to consider if you want to build a system with a liquid cooling system similar designs (when hoses “dropsy” are attached to the waterblock on the right) and if you plan to install into the system four memory modules.

GIGABYTE AORUS PRO X570 soldered seven 4-pin connectors for fans connection. The fee traditionally GIGABYTE allows you to control the impeller with shim and without it (fan with 3-pin connectors). Thanks for this Smart Fan 5. It supports even the fans power up to 24 watts. In General, the connectors for the “Carlson” is located successfully. I’d only moved to the side of the CPU socket connector SYS_FAN5_PUMP, which is the closest to 24-pin power port. The fact that connecting it to the pump maintenance-free DLC, not so easy to hide the protruding wire. Still want to collect a beautiful system units.

But SYS_FAN6_PUMP connector is successful. It will be useful to you if you are going to install in PC full custom “dropsy”. In Tower-building, as a rule, a tank of refrigerant and a pump mounted in the front portion thereof.

Speaking of beauty. At the top right of X570 AORUS PRO has just two ports for connection of led strips: one is designed for 12-volt RGB accessory, one for the 5V addressable strip. Exactly the same “sweet couple” and soldered at the bottom of the PCB. Another 12-volt plug is located next to the socket AM4. Is connected to the backlight of the cooler.

The Board highlighted left edge and a small strip on the plastic housing. Note that when using RGB Fusion 2.0 the user has the option to install 11 modes of illumination.

The disk subsystem includes six SATA 6 GB/s and two M. 2 slots. Now they do not share bandwidth with each other. The primary M. 2 connector allows you to install SSD sizes 2242, 2260, 2280 and 22110. It supports both SATA mode and in the mode PCI Express. The second option involves the CPU of the line: in the case of Ryzen 3000 we are talking about the 4.0 standard, in the case of Ryzen 2000 — on 3.0. The second M. 2 slot has the same features, but only in this case the PCI Express coming from the chipset.

In my opinion, the main M. 2 port is successful. It will not be covered by the graphics card, and if using an air CPU cooler installed this SSD socket will be additionally Abdovitsa. And here is an additional M. 2, I think, it was better to unsolder the lower PEG of the second port near the PCI Express x1 and chipset. With this arrangement, the SSD will not (even partially) covered by the video card, if the system has only one graphics accelerator. We can safely say that the era of NVMe drives come in fully — consequently, the presence in PC of two M. 2 SSD doesn’t look like something outlandish.

GIGABYTE AORUS X570 PRO features a high-quality Gigabit network controller Intel I219-V and sound chip Realtek ALC1220-VB. The audio codec has a ratio of “signal to noise” of 120 dB and an intelligent amplifier that automatically determines the impedance of the connected headphones. Separately, the manufacturer notes that the new controller enables us to convey to the Network the voice with a microphone connected to the 3.5 mm Jack on the front or on the rear panel. In addition, the tract is equipped with special capacitors WIMA FKP2. Here we see a complete copy of the audio subsystem used in the AORUS PRO B450.

The I/O panel GigX570 AORUS PRO you’ll find two USB 3.1 Gen2 A-type and another of the same, but C-type. Three USB connectors meet the USB 3.1 Gen1, and four 2.0. From video outputs there are HDMI only. The rest of the space on the rear panel is a RJ-45, optical S/PDIF output and five 3.5-mm mini-jacks.

As for the internal I/O ports X570 AORUS PRO on the edges of the PCB are soldered device from a single USB 3.1 Gen2, two USB 3.1 Gen1, two USB 2.0, TPM and F-audio.

From pleasant trifles I note the presence on Board button Q-Flash with which BIOS matplot you can upgrade, not even including the computer.

According to the manufacturer, Converter power X570 AORUS PRO has 12+2 phases — sounds impressive, agree. Controls the lines VRM PWM controller Infineon IR35201, which, as you know, works according to the scheme 6+2. This means that in reality the power subsystem X570 AORUS PRO, responsible for the operation of the computational cores has six phases — they simply double (on the reverse side we see the PWM-doubles Infineon IR3599). Each such channel comprises two inductors and two MOSFET Infineon IR3553, each of which can withstand a load of 40 A. Each of the two phases responsible for the SoC component of the CPU consists of one inductor and four MOSFETs ON Semiconductor — two transistor 4C10N and 4C06N.

In General, the power Converter X570 AORUS PRO inspires confidence. Moreover, field-effect transistors therein are cooled by two large aluminum radiators, connected by a copper deplorable. Details about the efficiency of the power Converter of this Board I’ll explain in a second part of the review.

Please note that the chipset of the device is cooled by an active cooler. We’ll get used to this state of Affairs, because many X570-the motherboard uses a similar cooling system. The fact that the level of heat the chipset up to 14 watts. As you know, AMD is, in fact, uses a modified I/O-chiplet, which is used in server processors EPYC Rome. It is produced using 14-nanometer technology and, as you can see, needs active cooling.

I have already noted that in some cases chipsetov fan of the cooler will be covered with a graphics card. This leads to the fact that the chipset if you use temperature sensors the Board is heated to 55-60 degrees Celsius. The fan is quite loud only when turning on the computer, and then it takes a few seconds and it ceases to be heard.

Of course, over time the impeller gets clogged with dust and may begin to make other sounds. However, we must understand that for the “health” of the system unit entirely meets its owner — don’t be lazy as often as possible to clean your PC from dust.

SOURCE

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AMD Ryzen 3900X 9: a split personality

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Last week AMD gave the press a computer a nightmare. The company’s desire to release their new 7-nm products certainly in “beautiful” date July 7 (7.07) led to the fact that the preparation for their announcements was carried out in a wild rush and very messy. For example, samples Ryzen 3000 arrived in our lab just five days before the “hour X”, but even during these five days we have been updating the BIOS of the test motherboard based on set logic X570, which not only corrected mistakes and added platform stability, but also seriously affect performance.

Because of this, we were faced with a difficult choice: either to engage in continuous retesting of the new processors at the next firmware versions and abandon any attempt to catch with the publication of the review of the first media micro Zen 2 at the end of information embargo, or for use in publications are not the most current performance data. But in the end was chosen as a compromise: the review was divided into two parts. The first part, which is dedicated to eight Ryzen 7 3700X, you most likely have already read – it appeared on our website in the very moment when the world started selling Ryzen 3000. And this article is the second part, and it will focus on the older 12-core representative of a new family, the processor Ryzen 9 3900X.

This separation allowed us again to recheck all the results on the last (at the current moment) version of firmware for the motherboard and ensure that the first buyers Ryzen 3000 will have at its disposal is the level of performance, referred to in this material.

However, no certainty that this performance level does not undergo regular adjustments in the very near future, we have. The fact that the five different versions of the BIOS of our test motherboard that we have tested for five days of experiments, change in the system is quite fundamental. Them AMD not only in optimizing memory controller, but “tighten up” the variable Boost 2 technology Precision, increasing the real frequency of the processor at the expense of efficiency. It is quite possible that later the company will want to change the operating parameters of their processors again. In other words, today’s tests Ryzen 3000 is only a preliminary acquaintance, which occurs at an early stage in the life cycle of new products.

Perhaps in the circumstances it would be right to wait a few weeks and thoroughly test the new chips, when the situation with them already ustakanilos: motherboard manufacturers will prepare a stable version of firmware, based on the AGESA libraries that have all the essential optimization and AMD will come to a final understanding, a balance between performance and energy efficiency it wants to achieve in the end.

However, to do so would be not too rational. The hype created around the new version of the microarchitecture of authorship and the first AMD desktop processors based on it, is so great that the computer community is ready to swallow any information, even if it is in the nature of rough estimates. Therefore, the review Ryzen 9 3900X still goes on our website after the review Ryzen 7 3700X, despite the clear “dampness” of these products. Later, to put the final point in the subject’s performance of new products, we’ll just test them again.

#Of eight — twelve: topology Ryzen 9 3900X

Together with new microarchitecture Zen 2 AMD introduces into use the new topology. Processors now are not a monolithic crystal, and are assembled from several components. This allows the company under the old ecosystems Socket AM4 to offer a new powerful CPU, with 12 and 16 cores. The budget for such multi-core processors consists of nearly 10 billion transistors, but they are distributed over several semiconductor crystals, similar to the way it was done in the HEDT CPUs Ryzen Threadripper.

However, unlike Threadripper desktop CPUs are not constructed of the same components, they use semiconductor crystals of two different types. First, it is OCTA-core “computing” CCD chipley produced for 7-nm process at TSMC companies. Each chipset combines two CCX-complex, containing four cores and 16 MB cache in the third level. Second, an additional 12-nm I/O-chipset controller memory controller, PCI Express 4.0 and elements of the SoC, which is responsible for input / output.

Given the fact that Ryzen 9 3900X – dwenadzatiperstnuu processor, it is constructed from three semiconductor crystals: two 7-nm CCD-chipsetov, with 3.9 billion transistors with an area of 74 mm2, and 12-nm I/O chiplet area of approximately 125 mm2, consisting of 2.09 billion transistors. Connect chipley tyre Infinity Fabric, the same as that used for communication between CCX-complexes within a single CCD chiplet. And, most importantly, chipley nuclei have no direct link connecting them, and all internuclear interaction, is constructed using the I/O-ciplet, who also plays the role of the switch.

It is easy to calculate that a 12-core CPU Ryzen 9 3900X needs to be active not all the cores available. And it’s true: one computational kernel in each CCX available-complex hardware locked, which makes any of the initial 16-core stock CPU with 12 cores. In this case, limiting the number of cores is partly a forced measure, as 16 cores hard enough to enter in a valid Socket AM4 limits energy consumption. But AMD does not abandon the idea of release and 16-core Socket AM4 product. This project is scheduled for the autumn, it will be released under the name Ryzen 7 3950X, but the manufacturer will have to resort to a special education careful selection of semiconductor crystals.

Chipley approach allows to obtain several advantages. First, it allows to simplify the design and production of processors, but also offers ways for easy scalability of the products. Second, because of the separation of functions chiplets different types of AMD had the opportunity to avoid duplicating nodes, we need in a single number, for example, memory controller or bus controller PCI Express 4.0. Due to the fact that all these blocks are put into a single I/O-chiplet to which the CCD chipley have equal access, a logical processor is a monolithic structure with centralized mechanisms of memory accesses and to external devices. Any hints on the usual users Threadripper NUMA-modes in the AM4 Socket system, all cores in 12 – and 16-core processors have exactly the same access to the array RAM.

Everything said is illustrated by the results of practical measurements. As for memory access, then it is all really OK. Ryzen 9 3900X shows approximately the same latency that OCTA-core processor Ryzen 7 3700X. This means that the connection to the I/O chiplet with the memory controller not one, but two CCD chipsetov does not entail any negative effects. Thanks cipitol the layout of memory for all cores do seem to be a single array with the same delay.

And by the way, please note, Ryzen 9 3900X is not subject to the same problem with lower half-bandwidth of the recording, which we found Ryzen 7 3700X. It turns out that the memory controller I/O coplete Ryzen 3000 just optimized to work with two CCD chipsetati and when you connect one chiplet full performance can not give.

But much more disturbing than the speed of the memory cause a latency of internuclear interaction. It seems that the location of the nuclei in different CCD-chiplet should impose a substantial penalty in data transfer between them. For example, the latency in the exchange of information between cores in different crystals in the processors Threadripper, one and a half times higher than when transfers between different cores CCX-complexes within a single crystal. However, surprisingly, such problems have Ryzen 9 3900X does not exist. Here the internuclear interaction between the nuclei belonging to different CCX-complexes, leads to the same delays regardless of whether we are talking about the CCX in the same or in different CCD-chiplet.

And this is a really serious achievement. Thanks to the centralized scheme of the mutual connection of cores, multi-processor Ryzen 9 3900X from the side looks like a completely solid solution. No additional penalties for mercapital communication do not. And therefore, there is no reason to compare Ryzen 9 3900X with Threadripper. What AMD offers at this time – a full 12-core processor, not the Assembly of the two shestiyaderny in a single housing.

#Read more about the characteristics of Ryzen 9 3900X

The review Ryzen 7 3700X we compare it with the older LGA1151-Intel. It was logical, based on the number of cores and threads: Ryzen 7 3700X – shestnadtsatiletnij and OCTA-core CPU, like Core i9-9900K. In fact, however, AMD continues to follow his principle “we will have more cores for the same money than the competitor” and contrasts the Core i9-9900K completely different your processor. The recommended price of $499 in the new lineup got a 12-core, 24-threaded Ryzen 9 3900X, and it is positioned as alternatives to the five hundred-dollar osmeteria Core i9-9900K.

Cores/ Threads Base frequency, MHz Turbocheetah, MHz L3 cache MB TDP, watts Chipley Price
Ryzen 9 3950X 16/32 3,5 4,7 64 105 2×CCD + I/O $749
Ryzen 9 3900X 12/24 3,8 4,6 64 105 2×CCD + I/O $499
Ryzen 7 3800X 8/16 3,9 4,5 32 105 CCD + I/O $399
Ryzen 7 3700X 8/16 3,6 4,4 32 65 CCD + I/O $329
Ryzen 5 3600X 6/12 3,8 4,4 32 95 CCD + I/O $249
Ryzen 5 3600 6/12 3,6 4,2 32 65 CCD + I/O $199

Already in the simple comparison of the characteristics Ryzen 9 3900X against the Core i9-9900K AMD processor looks very impressive. Time and a half because in addition to the superiority in number of cores and threads Ryzen 9 3900X can offer and huge L3 cache with a total capacity of 64 MB, while in a competing processor, the cache memory of the third level less than four times. In addition, Ryzen 9 3900X can boast official support for DDR4-3200 and accelerated version of PCI Express 4.0.

The only thing Ryzen 9 3900X has not yet been able to surpass Intel CPUs is the clock frequency. They are for 12-core are declared in the range of 3.8-4.6 GHz, although in reality it will strive to get closer to its upper bound due to aggressive technology Precision Boost 2. However, lower frequencies are quite Ryzen 3000 kompensiruet his outstanding IPC (the number of executable per clock instruction): as we have seen, in many cases at the same frequency core 2 Zen work even faster cores Coffee Lake Refresh.

In the end, to find in the camp of Intel suitable opponent for Ryzen 9 3900X with the same number of cores, we will inevitably have to turn to heavy HEDT platform LGA2066. Only in its composition there are 12-core Core i9-9920X, but it is estimated at $1 199, that is 2.4 times more expensive than AMD’s flagship news related to the mass platform Socket AM4. Here, of course, one could argue that the HEDT platform offering Quad-channel memory controller and more PCI Express, however, such possibilities can hardly be attributed to the vital for most users things. And that means Ryzen 9 3900X actually blurs the line between HEDT and Socket AM4. Thanks to this gift from AMD users conventional bulk systems can now get the level of multithreading, which recently was only available to owners of heavy and expensive platforms LGA2066 or Socket TR4.

Ryzen 9 3900X Core i9-9920X Core i9-9900K Threadripper 2920X
Platform Socket AM4 LGA2066 LGA1151v2 Socket TR4
Manufacturing process, nm 7/12 14 14 12
Cores/ threads 12/24 12/24 8/16 12/24
Frequency (nominal/turbo) GHz 3,8/4,6 3,5/4,4 3,6/5,0 3,5/4,3
L3 cache MB 64 19,25 16 32
TDP, watts 105 165 95 180
Memory 2 × DDR4-3200 4 ×DDR4-2666 2 ×DDR4-2666 4 ×DDR4-2933
Lines PCIe 24 ×Gen4 44 ×Gen3 16 ×Gen3 64 ×Gen3
Price $499 $1 199 $488 $625

Let’s look at the characteristics of Ryzen 9 3900X more. Among the processors in the consumer segment this processor looks like an alien from another world. So it turns out due to the increased number of cores and huge cache, and these features are acquired thanks to the introduction of kiplenge design. In other words, it is legitimate to say that Ryzen 9 3900X – a vivid demonstration of the correctness of the course taken by AMD. The company’s engineers “flick of the wrist” collected from the two CCD-chipsetov mass processor to catch up with that in the baseline characteristics of the Intel in the near future obviously will not be able to.

 

Another feature Ryzen 9 3900X – relatively good frequency. Typically processors with more cores, lower clock frequency, but in this case the opposite happened. And nominal, and maximum frequency Ryzen 9 3900X superior cosmedent Ryzen 7 3700X, and even ahead of eight Ryzen 7 3800X terms of the maximum frequency. This means that Ryzen 9 3900X will be as good in multithreaded applications or when a more simple load on a limited number of cores. That is, the processor must be universal, not a niche solution for demanding work loads, this is technology Precision Boost 2 in aggressiveness which Ryzen 3000 we have already seen.

For example, look how are real working frequency Ryzen 9 3900X in Cinebench R20 load on different number of cores. The minimum frequency observed at full load CPU rendering, start from 4,025 GHz.

And for example, when OCTA core load, the processor is capable of operating at a frequency of 4.1 GHz, that is at least not slower than Ryzen 7 3700X. In the case of downloading a small number of cores Ryzen 9 3900X comes on frequencies above a 4.3-4.4 GHz.

When meeting with Ryzen 7 3700X we drew attention to its high operating temperatures. Ryzen 9 3900X, in which nuclei and a half times more, was also affected by this issue, and even more.

The stress load is received by the utility Prime95 29.8, raises the temperature of the CPU in the nominal mode up to 95 degrees (with the cooler Noctua NH-U14S) and the Converter power the motherboard reports the CPU consumption of about 190 watts of electricity.

It looks somewhat normal, and we were able to get unofficial confirmation that in the latest versions of the BIOS that came for X570-motherboard before the announcement of Ryzen 3000, technology of Precision Boost 2 is configured with a strong overestimation of the allowable limits for the consumption and heat dissipation that automatically provides an additional increase of operating frequencies. However, apparently, the initiator of this “overclocking out of the box” is the AMD, and it is unclear whether this mode will now become standard, whether it is imposed only on the output time of the first wave of reviews to get more positive reviews in the press, and will be removed.

#Acceleration

About acceleration Ryzen 9 3900X not much to tell. Here everything is done to us. Technology parameters Precision Boost 2 12-core unscrewed to the limit, and this CPU works at the maximum possible under dynamic acceleration frequencies without any additional configuration.

If to speak about static acceleration, the power voltage setting To 1.2, it was possible to achieve stable operation at a frequency of 4.0 GHz. Unfortunately, the processor is strongly heated, and it almost completely ties the hands of overclocking.

It is doubtful that in this static acceleration there is some practical sense. Technology Precision Boost 2 even at 100% load on CPU provides a slightly lower frequency, but when loaded by the operation of a part of cores it is able to provide for Ryzen 9 3900X noticeably better performance.

SOURCE

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