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Core i9-9900X against the Core i9-9900K: letter changes everything

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Platform LGA2066 and processor family Skylake-X was submitted to Intel for more than two years ago. Initially this decision was aimed by the company for the HEDT segment, i.e. high-performance system for users who are creating and processing content, because Skylake-X contained a significantly greater number of computational cores compared with the usual representatives of the families Kaby Lake and the Coffee Lake.

However, for the time elapsed from the appearance of the Skylake-X, the landscape of the CPU market has changed significantly, and today is enough available CPU can have six or even eight cores, and promising massive CPU, which should go in the course of this year, can get ten or even twelve cores. Does that Skylake-X useless chips? Probably not. First, among the representatives of this series exist in sentences with 16 and 18 cores, and similar mass in the near future, the market will not be exact. Secondly, the platform laid LGA2066 and other benefits that differentiate them from conventional consumer processors, such as the superiority of memory channels and available lines PCI Express.

Therefore, cosmetic update of the model series Skylake-X microprocessor giant held at the end of last year, it seemed quite natural – it perfectly fit into the accepted Intel’s annual schedule of announcements. However, the attitude of the manufacturer towards their HEDT-novelties little surprise: the company not only did not review rates, but also refused to provide a sample processor the IT press, limiting only the formal presentation and the subsequent start of sales.

Apparently, the company believed the new Skylake-X secondary and uninteresting products, but we with this formulation fundamentally disagree. Yes, the number of cores, the representatives of this lineup in the upgrade process is not increased. But they boast other interesting improvements: according to the increased clock frequency and increased number of L3 cache, and improved internal thermal interface. So we decided to give updated Skylake-X some attention, what really helped us in the store,”regard, have agreed to grant to research a new LGA2066-desyatiletnego: Core i9-9820X and Core i9-9900X.

Besides, the moment of the announcement Skylake-X Refresh us, did not give rest a question: why do older desyatiletnego HEDT processor Intel chose similar confusingly the name with the popular mass osmeterium Core i9-9900K? What does it mean? And now we have a chance to understand…

#Lineup Skylake-X Refresh

New LGA2066 processors with model numbers from your thousandth Intel announced in October of last year. Among the new products included seven models: six series processors Core i9 with the number of cores from 10 to 18 and eight-core model Core i7 conditional initial level. No shestiyaderny and Quad for LGA2066 in the new generation no longer provides that on the background of rapid growth of the platform LGA1151v2 is not surprising.

Cores/ threads Base frequency, GHz Turbocheetah, GHz L3 cache MB Memory TDP, watts Price
Core i9-9980XE 18/36 3,0 4,5 24,75 DDR4-2666 165 $1 979
Core i9-9960X 16/32 3,1 4,5 22,0 DDR4-2666 165 $1 684
Core i9-9940X 14/28 3,3 4,5 19,25 DDR4-2666 165 $1 387
Core i9-9920X 12/24 3,5 4,5 19,25 DDR4-2666 165 $1 189
Core i9-9900X 10/20 3,5 4,5 19,25 DDR4-2666 165 $989
Core i9-9820X 10/20 3,3 4,2 16,5 DDR4-2666 165 $889
Core i7-9800X 8/16 3,8 4,5 16,5 DDR4-2666 165 $589

The most noticeable change in the processors listed in the table, when compared with previous models Skylake-X seven series, was the increase in clock frequencies. The nominal frequency rose 200-600 MHz, and the maximum frequency achieved by the inclusion of turbo speed, increased by 200-300 MHz. In addition, younger members of the series increased the capacity of the cache memory of the third level. Earlier it was calculated on the basis of rules “1,375 MB per core”, and now each core can have up to about 2 MB of cache. Finally, the controller PCI Express eight-core Core i7-9800X was fully unlocked so that the processor has at its disposal all the 44 lines, which were previously available only to processors with 10 cores or more.

However, all these pleasant changes resulted in an increase in heat dissipation. While the first generation Skylake-X had a thermal Suite, limited by 140 watts, the new processors feature increased TDP of 165 watts. In other words, for higher frequencies, which has the new processors without any fundamental change in the applied for their release on 14-nm process, have to pay increased energy and thermal limits.

However, Intel itself when it claims that raising the speed characteristics allowed the introduction of production technology to a third version, code-named 14++ nm, which is now manufactured processors Coffee Lake Coffee Lake and Refresh. And if not that, then heat dissipation could be even higher. But fear that the new Skylake-X may be prone to overheating, no reasons. To reduce the operating temperature of the new processors have improved termoenergetyczny material under the heat-spreading lid. The place of the previously used polymeric thermal paste took the solders known to be higher conductivity.

But all the above is just the tip of the iceberg. The fact that changes in the specifications, first and foremost, the increase of the cache memory of the third level, is far more an unexpected basis. Now to release HEDT processors Intel started to use a slightly different “meaning” of semiconductor crystals.

This means the following: HEDT processors have always been a desktop kind of server chips. Traditionally, Intel took a minor modification Xeon, adapted thereto, the memory controller and some other features and transposed them into the desktop environment. Thus, while for their server products Intel has produced three options semiconductor crystals: LCC (Low Core Count) with 10 cores, the HCC (High Core Count) c 18 cores and XCC (eXtreme Core Count) c 28 cores in the desktop HEDT processors, only the most simple versions of the crystals. Thus, the processors Skylake-X is the first generation with 6, 8 and 10 cores were used the crystal LCC, and in versions with 12, 14, 16 and 18 cores used crystal HCC.

In updated Skylake-X, about which we are talking today, the younger version of the crystal LCC no longer applies. All the new HEDT processors thousandth of the series, including eight – and decategory options are based on the crystal HCC. That is, even in Core i7-9800X or Core i9-9900X potentially feature 18 cores, but much of it is hardware locked at the manufacturing stage.

Such strange at first sight, the decision was taken in order to increase the volume of cache in the new processors. The internal structure of the Skylake-X assumes that on each computation core is allocated a portion of the cache memory with a capacity of 1,375 MB. And if in the same Core i9-9900X used Junior crystal LCC, more 13,75 MB L3-cache, this processor is obviously to could. A larger crystal HCC in this respect more flexible, it has in total laid 24,75 MB cache, and this increased volume is partly involved in the eight – and desyatiletnij processors of the new wave.

Полупроводниковый кристалл Skylake-X HCC

Semiconductor chip Skylake-X HCC

As a result, all Skylake-X steel unified design, but the reverse side of this unification was the widespread use of very large semiconductor crystal with an area of about 485 mm2, more than two and a half times the area of the crystal Lake Coffee OCTA core Refresh. This means that any of LGA2066-thousandth series processors has significantly higher cost in comparison with the same Core i9-9900K. But despite this, eight-core Core i9-9800X in the official price list priced just $100 more than the Core i9-9900K. Therefore, it is reasonable to assume that the production of eight – and desyatiletnij processors based on 18-core crystals still is for Intel some economic sense, for example, the company takes this opportunity to implement semiconductor crystals with a large number of manufacturing defects that until now could not find worthy application.

#Read more about desyatiletnij Core i9-9900X and Core i9-9820X

For testing we took two desyatiletnij processor “new wave” – Core i9-9900X and Core i9-9820X. Despite the fact that these CPU moved to a new crystal HCC, compared to Core i9-7900X they have changed not so much. Usually Intel with the release of the second generation of processors for the past varieties HEDT platform translated them into a newer microarchitecture, but now it did not happen. The changes affected only the numerical parameters, are qualitatively the same in the face of the Core i9-9900X and Core i9-9820X we have almost the same thing that was offered and decategory Core i9-7900X sample of 2017.

But Skylake-X second generation, there are no compatibility problems: they work fine in the existing LGA2066-motherboards based on chipset Intel X299. Like its predecessors, they have a four channel controller DDR4-memory, and built-in them, the controller PCI Express 3.0 supports 44 lines, which in theory can be split up into an arbitrary number of slots — from three to eleven.

However, the semiconductor crystal HCC, the underlying Core i9-9900X and Core i9-9820X, is somewhat different from the crystals that were used in high Skylake-X before. Although formal stepping saved the number M0, which was characteristic of the original versions of Skylake-X with the number of cores over 12, now Intel was used in the production process of modified lithographic masks in connection with the employment of a more Mature process technology 14++ nm process technology over the past 14+ nm. The key difference of the techniques is a bit more step between the gate of the transistor, which, as we have seen in the case of Coffee Lake, has a positive effect on the frequency capacity.

At the level of micro there is no change at all. Surprisingly, the new processors Skylake-X Refresh was not even any hardware fixes to reduce the vulnerability Meltdown and the Spectre. And it’s very strange on the background of the fact that in the parallel product Coffee Lake Refresh, released at the same time, certain patches have already appeared. For example, LGA1151v2 modern processors are protected against attacks Meltdown (Variant 3) and L1TF (Variant 5) at the hardware level.

But the most offensive not even that. The main reason for the disorder – the absence of any change in the scheme of combining the components of the processor in a single unit. In Skylake-X Refresh continues to use the peer-to-peer mesh a Mesh network is overlaid on top of the array of processor cores. This scheme internuclear connections performing well with a significant increase in the number of cores in server processors, but for HEDT products with not too high number of cores it is much different than a traditional ring bus, causing a dramatic increase of delays. One of the methods of struggle against this negative effect could be an acceleration Mesh connections, but here everything remained the same. The frequency of the interconnection as in the past, this year’s Skylake-X set at around 2.4 GHz, so the L3 cache and memory controller have LGA2066 processors have considerably worse latency to the background of the mass Coffee Lake Refresh. However, this is partly kompensiruet extended cache memory of the second level, which Skylake-X has a volume of 1 MB per core instead of four times less.

All this is easy to illustrate the graph of the latency of the memory subsystem processors Skylake-X the current generation in comparison to Coffee Lake Refresh. It clearly shows the lack of improvement in the situation of delays in the new HEDT processors.

But new deletedevice can boast of progress in clock frequency and in the size of the cache memory. For example, Core i9-9900X victimization has a L3-cache of the volume of 19.25 MB, which is 40% larger than the size of the cache in the past desacuerdos processor Core i9-7900X. Base frequency of the new model increased from 3.3 to 3.5 GHz, but the maximum frequency of the Core i9-9900X in turbo mode can go up to the same 4.5 GHz that were available and desyatiletnego of the previous generation. In both cases, the reach 4.5 GHz requires the use of technology Turbo Boost Max 3.0, with the traditional maximum turbo frequency for the Core i9-9900X is 4.4 GHz.

However, in practice the situation with frequencies Core i9-9900X develops a little differently. Under load on all cores CPU is clocked to 4.1 GHz.

If the workload uses AVX instructions, the processor frequency is reduced to 3.8 GHz.

And the most expensive 512-bit instructions from a new set of AVX-512 full load on all cores cause the CPU to slow down to 3.4 GHz that should be noted, even lower than the advertised specifications nominal frequency.

If we talk about desacuerdos Core i9-9820X, which stands on the step below, he differs from his older brother mainly volume cache of the third level, which he cut down to 16.5 MB. Slightly lower frequency and passport, but we should not forget that all HEDT processors from Intel have free multipliers that will allow enthusiasts to ignore this deficiency.

However, the nominal frequency Core i9-9820X – 3.3 GHz and the maximum frequency in turbo mode is 4.1 or 4.2 GHz depending on whether we are talking about technology Turbo Boost Turbo Boost 2.0 or 3.0 Max.

In practice, when operating the CPU with default settings and the load on all cores Core i9-9820X capable of operating at a frequency of 4.0 GHz.

If the load uses AVX instructions, the processor decreases the frequency to 3.8 GHz.

And in AVX-512 frequency Core i9-9820X drops to nominal value is 3.3 GHz.

Speaking about what new decategory LGA2066 processors better than the old Core i9-7900X, it’s impossible to forget what happened in the transition to more efficient internal thermal interface. Heat-dissipating cap now soldered to the crystal the same way as is done in Coffee Lake Refresh. Intel says that due to this, the new processors are more efficiently cooledand operate at lower temperatures, however, there are two but. First, Intel used solder does not cause much enthusiasm in the ranks of the overclockers, since it is less efficient than liquid metal. And secondly, now for most enthusiasts was unavailable scalping procedure: remove the cover without damaging the CPU, it has become very difficult, therefore, to improve the thermal interface is extremely difficult.

At the end of the story about the characteristics of the Core i9-9900X and Core i9-9820X it is worth to mention prices. Here Intel did not show any imagination and set the cost of senior desathaliernika Core i9-9900X in the same $989, which it asked for Intel Core i9-7900X related to the previous generation. But the Core i9-9820X is $100 cheaper, which makes it a more attractive offer for enthusiasts, since a lower 15% L3-cache is unlikely to greatly affect performance, and the nominal clock frequency for the real enthusiasts, high performance are irrelevant.


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Review AMD Ryzen Ryzen 5 and 3600X 3600 5: shestiyadernik healthy person

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Overview of GIGABYTE AORUS X570 PRO: time to gather a powerful PC Ryzen

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So lately into my hands from time to time fall GIGABYTE, the title of which is the word PRO. In 2018 my authorship out related models such as the AORUS PRO B450 and Z390 AORUS PRO. And you know what? In both cases we were dealing with a sturdy “workhorses” cards, which perfectly showed themselves in the coordinate system of “price — quality”. The character of today’s review — GIGABYTE model AORUS X570 PRO — fits into the designated category.



#Specifications and packaging

At the time of writing, on the official GIGABYTE website was listed just nine motherboard models based on the new chipset X570. While X570 AORUS PRO exists in two versions — if you need a device with a preinstalled wireless module, look at the selling option called X570 AORUS PRO WIFI. Otherwise the versions are identical. Main technical characteristics of the device shown in the table below.

Supported processors AMD Ryzen 3rd Generation
AMD Ryzen 2nd Generation
Ryzen with AMD Radeon Graphics Vega
Chipset AMD X570
Memory subsystem 4 × DIMM slots, up to 128 GB DDR4-2133-4400 (OC), for Ryzen 2000 — up to DDR4-3600 (OC)
Expansion slots 3 × PCI Express x16
2 × PCI Express x1
The storage interface 1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
6 × SATA 6GB/s
RAID 0, 1, 10
LAN Intel I219V, 10/100/1000 Mbps
Audio Realtek ALC1220-VB 7.1 HD
Interfaces on the rear panel 1 × HDMI
1 × RJ-45
1 × optical S/PDIF
3 × USB 3.1 Gen1 Type A
1 × USB 3.1 Gen2 Type C
2 × USB 3.1 Gen2 Type A
4 × USB 2.0 Type A
5 × 3.5 mm audio
Form factor ATX
Price 19 500 RUB.

I note that details about the set logic X570 you can read in the article “AMD Ryzen 7 3700X: Zen 2 in all its glory, “although the hereafter will necessarily be distinctive features of the new boards for the platform AM4.

The device is Packed in a small but colorful cardboard box. The packaging has a quite recognizable appearance, but the main thing is, of course, its contents. In addition to the Board, it was a lot of accessories, both useful and not:

  • user manual;
  • sticker with the logo AORUS;
  • disk with software and drivers;
  • four SATA cable;
  • the screws for fastening the M. 2 drives;
  • extension cable RGB tape;
  • adapter G Connector to facilitate connection of the bodies of management of the case.

In General, we have everything you need in order to start the Assembly of the system unit.

#Design and capabilities

So, we have motherboard form factor ATX. The manufacturer uses a full size PCB, that is, its dimensions are 305 × 244 mm. Many know the consequences of application of the PCB smaller. So, when attaching the circuit Board in the housing the right side will SAG and can be deformed upon connection of the memory modules or the main connector of the power supply. In the case of the AORUS PRO X570 unexpected “twists of fate” of this kind should not happen.


GIGABYTE AORUS X570 PRO: five PCI-E connectors

Since we are talking about the form factor ATX, the manufacturer may place on the motherboard up to seven expansion slots. However, X570 AORUS PRO boasts only five PCI Express slots. In the photo above, we see that the part of space occupied by the M. 2 ports required for installing SSDs. Well, cry about it just not worth it.

Motherboard supports technologies such as AMD CrossFire (hardware manufacturers, as we still use this term, although it is slowly disappearing) and NVIDIA SLI. When connecting two digital devices to the PCI Express x16 slots they will work according to the scheme x8+x8. If you read the review Ryzen 7 3700X, you know that now we are talking about PCI Express 4.0. Of course, this would require the processor family Ryzen 3000 (not the G-version, as it uses the now outdated architecture Zen+). In the case of “stones” Ryzen 2000, all the expansion slots will work according to the standard number 3.0.

The third PCI Express x16 slot always runs at x4 speed — these lines are provided directly by the chipset. They also — depending on the generation of processor Ryzen — will work with bandwidth or standard 4.0, or 3.0. And on the PCB X570 AORUS PRO has two PCI Express x1 4.0/3.0.

In my opinion, the location of the expansion slots at the test Board as a whole was successful. Firstly, the main PEG port is noticeably removed from the socket. In the end, X570 AORUS PRO will allow you to set any, even the largest air cooler. We also without any problems, without removing the video card, can install RAM modules.

Secondly, between the main PEG-ports a decent distance — such that we can combine in SLI/CrossFire arrays, even video cards with translatewiki coolers. I believe that in 99.9% of cases in the system will still use a single graphics accelerator, and therefore with one port PCI-Express x1 have to say goodbye. And another point: the graphics card will block the fan of system of cooling of the chipset and translateby 3D accelerator still soldered below the M. 2 slot.

Please note that the main PEG ports and DIMM slots are reinforced. Ports also have additional fixation and increased the number of soldering points on the PCB. In total, according to the manufacturer, these design solutions strengthen connectors 1.7 times when the load on the fracture, and 3.2 times when the load on the pulling.

When you install the DLC NZXT KRAKEN X62 I had to part with one DIMM slot — the ones closest to the CPU socket. This point is important to consider if you want to build a system with a liquid cooling system similar designs (when hoses “dropsy” are attached to the waterblock on the right) and if you plan to install into the system four memory modules.

GIGABYTE AORUS PRO X570 soldered seven 4-pin connectors for fans connection. The fee traditionally GIGABYTE allows you to control the impeller with shim and without it (fan with 3-pin connectors). Thanks for this Smart Fan 5. It supports even the fans power up to 24 watts. In General, the connectors for the “Carlson” is located successfully. I’d only moved to the side of the CPU socket connector SYS_FAN5_PUMP, which is the closest to 24-pin power port. The fact that connecting it to the pump maintenance-free DLC, not so easy to hide the protruding wire. Still want to collect a beautiful system units.

But SYS_FAN6_PUMP connector is successful. It will be useful to you if you are going to install in PC full custom “dropsy”. In Tower-building, as a rule, a tank of refrigerant and a pump mounted in the front portion thereof.

Speaking of beauty. At the top right of X570 AORUS PRO has just two ports for connection of led strips: one is designed for 12-volt RGB accessory, one for the 5V addressable strip. Exactly the same “sweet couple” and soldered at the bottom of the PCB. Another 12-volt plug is located next to the socket AM4. Is connected to the backlight of the cooler.

The Board highlighted left edge and a small strip on the plastic housing. Note that when using RGB Fusion 2.0 the user has the option to install 11 modes of illumination.

The disk subsystem includes six SATA 6 GB/s and two M. 2 slots. Now they do not share bandwidth with each other. The primary M. 2 connector allows you to install SSD sizes 2242, 2260, 2280 and 22110. It supports both SATA mode and in the mode PCI Express. The second option involves the CPU of the line: in the case of Ryzen 3000 we are talking about the 4.0 standard, in the case of Ryzen 2000 — on 3.0. The second M. 2 slot has the same features, but only in this case the PCI Express coming from the chipset.

In my opinion, the main M. 2 port is successful. It will not be covered by the graphics card, and if using an air CPU cooler installed this SSD socket will be additionally Abdovitsa. And here is an additional M. 2, I think, it was better to unsolder the lower PEG of the second port near the PCI Express x1 and chipset. With this arrangement, the SSD will not (even partially) covered by the video card, if the system has only one graphics accelerator. We can safely say that the era of NVMe drives come in fully — consequently, the presence in PC of two M. 2 SSD doesn’t look like something outlandish.

GIGABYTE AORUS X570 PRO features a high-quality Gigabit network controller Intel I219-V and sound chip Realtek ALC1220-VB. The audio codec has a ratio of “signal to noise” of 120 dB and an intelligent amplifier that automatically determines the impedance of the connected headphones. Separately, the manufacturer notes that the new controller enables us to convey to the Network the voice with a microphone connected to the 3.5 mm Jack on the front or on the rear panel. In addition, the tract is equipped with special capacitors WIMA FKP2. Here we see a complete copy of the audio subsystem used in the AORUS PRO B450.

The I/O panel GigX570 AORUS PRO you’ll find two USB 3.1 Gen2 A-type and another of the same, but C-type. Three USB connectors meet the USB 3.1 Gen1, and four 2.0. From video outputs there are HDMI only. The rest of the space on the rear panel is a RJ-45, optical S/PDIF output and five 3.5-mm mini-jacks.

As for the internal I/O ports X570 AORUS PRO on the edges of the PCB are soldered device from a single USB 3.1 Gen2, two USB 3.1 Gen1, two USB 2.0, TPM and F-audio.

From pleasant trifles I note the presence on Board button Q-Flash with which BIOS matplot you can upgrade, not even including the computer.

According to the manufacturer, Converter power X570 AORUS PRO has 12+2 phases — sounds impressive, agree. Controls the lines VRM PWM controller Infineon IR35201, which, as you know, works according to the scheme 6+2. This means that in reality the power subsystem X570 AORUS PRO, responsible for the operation of the computational cores has six phases — they simply double (on the reverse side we see the PWM-doubles Infineon IR3599). Each such channel comprises two inductors and two MOSFET Infineon IR3553, each of which can withstand a load of 40 A. Each of the two phases responsible for the SoC component of the CPU consists of one inductor and four MOSFETs ON Semiconductor — two transistor 4C10N and 4C06N.

In General, the power Converter X570 AORUS PRO inspires confidence. Moreover, field-effect transistors therein are cooled by two large aluminum radiators, connected by a copper deplorable. Details about the efficiency of the power Converter of this Board I’ll explain in a second part of the review.

Please note that the chipset of the device is cooled by an active cooler. We’ll get used to this state of Affairs, because many X570-the motherboard uses a similar cooling system. The fact that the level of heat the chipset up to 14 watts. As you know, AMD is, in fact, uses a modified I/O-chiplet, which is used in server processors EPYC Rome. It is produced using 14-nanometer technology and, as you can see, needs active cooling.

I have already noted that in some cases chipsetov fan of the cooler will be covered with a graphics card. This leads to the fact that the chipset if you use temperature sensors the Board is heated to 55-60 degrees Celsius. The fan is quite loud only when turning on the computer, and then it takes a few seconds and it ceases to be heard.

Of course, over time the impeller gets clogged with dust and may begin to make other sounds. However, we must understand that for the “health” of the system unit entirely meets its owner — don’t be lazy as often as possible to clean your PC from dust.


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AMD Ryzen 3900X 9: a split personality

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Last week AMD gave the press a computer a nightmare. The company’s desire to release their new 7-nm products certainly in “beautiful” date July 7 (7.07) led to the fact that the preparation for their announcements was carried out in a wild rush and very messy. For example, samples Ryzen 3000 arrived in our lab just five days before the “hour X”, but even during these five days we have been updating the BIOS of the test motherboard based on set logic X570, which not only corrected mistakes and added platform stability, but also seriously affect performance.

Because of this, we were faced with a difficult choice: either to engage in continuous retesting of the new processors at the next firmware versions and abandon any attempt to catch with the publication of the review of the first media micro Zen 2 at the end of information embargo, or for use in publications are not the most current performance data. But in the end was chosen as a compromise: the review was divided into two parts. The first part, which is dedicated to eight Ryzen 7 3700X, you most likely have already read – it appeared on our website in the very moment when the world started selling Ryzen 3000. And this article is the second part, and it will focus on the older 12-core representative of a new family, the processor Ryzen 9 3900X.

This separation allowed us again to recheck all the results on the last (at the current moment) version of firmware for the motherboard and ensure that the first buyers Ryzen 3000 will have at its disposal is the level of performance, referred to in this material.

However, no certainty that this performance level does not undergo regular adjustments in the very near future, we have. The fact that the five different versions of the BIOS of our test motherboard that we have tested for five days of experiments, change in the system is quite fundamental. Them AMD not only in optimizing memory controller, but “tighten up” the variable Boost 2 technology Precision, increasing the real frequency of the processor at the expense of efficiency. It is quite possible that later the company will want to change the operating parameters of their processors again. In other words, today’s tests Ryzen 3000 is only a preliminary acquaintance, which occurs at an early stage in the life cycle of new products.

Perhaps in the circumstances it would be right to wait a few weeks and thoroughly test the new chips, when the situation with them already ustakanilos: motherboard manufacturers will prepare a stable version of firmware, based on the AGESA libraries that have all the essential optimization and AMD will come to a final understanding, a balance between performance and energy efficiency it wants to achieve in the end.

However, to do so would be not too rational. The hype created around the new version of the microarchitecture of authorship and the first AMD desktop processors based on it, is so great that the computer community is ready to swallow any information, even if it is in the nature of rough estimates. Therefore, the review Ryzen 9 3900X still goes on our website after the review Ryzen 7 3700X, despite the clear “dampness” of these products. Later, to put the final point in the subject’s performance of new products, we’ll just test them again.

#Of eight — twelve: topology Ryzen 9 3900X

Together with new microarchitecture Zen 2 AMD introduces into use the new topology. Processors now are not a monolithic crystal, and are assembled from several components. This allows the company under the old ecosystems Socket AM4 to offer a new powerful CPU, with 12 and 16 cores. The budget for such multi-core processors consists of nearly 10 billion transistors, but they are distributed over several semiconductor crystals, similar to the way it was done in the HEDT CPUs Ryzen Threadripper.

However, unlike Threadripper desktop CPUs are not constructed of the same components, they use semiconductor crystals of two different types. First, it is OCTA-core “computing” CCD chipley produced for 7-nm process at TSMC companies. Each chipset combines two CCX-complex, containing four cores and 16 MB cache in the third level. Second, an additional 12-nm I/O-chipset controller memory controller, PCI Express 4.0 and elements of the SoC, which is responsible for input / output.

Given the fact that Ryzen 9 3900X – dwenadzatiperstnuu processor, it is constructed from three semiconductor crystals: two 7-nm CCD-chipsetov, with 3.9 billion transistors with an area of 74 mm2, and 12-nm I/O chiplet area of approximately 125 mm2, consisting of 2.09 billion transistors. Connect chipley tyre Infinity Fabric, the same as that used for communication between CCX-complexes within a single CCD chiplet. And, most importantly, chipley nuclei have no direct link connecting them, and all internuclear interaction, is constructed using the I/O-ciplet, who also plays the role of the switch.

It is easy to calculate that a 12-core CPU Ryzen 9 3900X needs to be active not all the cores available. And it’s true: one computational kernel in each CCX available-complex hardware locked, which makes any of the initial 16-core stock CPU with 12 cores. In this case, limiting the number of cores is partly a forced measure, as 16 cores hard enough to enter in a valid Socket AM4 limits energy consumption. But AMD does not abandon the idea of release and 16-core Socket AM4 product. This project is scheduled for the autumn, it will be released under the name Ryzen 7 3950X, but the manufacturer will have to resort to a special education careful selection of semiconductor crystals.

Chipley approach allows to obtain several advantages. First, it allows to simplify the design and production of processors, but also offers ways for easy scalability of the products. Second, because of the separation of functions chiplets different types of AMD had the opportunity to avoid duplicating nodes, we need in a single number, for example, memory controller or bus controller PCI Express 4.0. Due to the fact that all these blocks are put into a single I/O-chiplet to which the CCD chipley have equal access, a logical processor is a monolithic structure with centralized mechanisms of memory accesses and to external devices. Any hints on the usual users Threadripper NUMA-modes in the AM4 Socket system, all cores in 12 – and 16-core processors have exactly the same access to the array RAM.

Everything said is illustrated by the results of practical measurements. As for memory access, then it is all really OK. Ryzen 9 3900X shows approximately the same latency that OCTA-core processor Ryzen 7 3700X. This means that the connection to the I/O chiplet with the memory controller not one, but two CCD chipsetov does not entail any negative effects. Thanks cipitol the layout of memory for all cores do seem to be a single array with the same delay.

And by the way, please note, Ryzen 9 3900X is not subject to the same problem with lower half-bandwidth of the recording, which we found Ryzen 7 3700X. It turns out that the memory controller I/O coplete Ryzen 3000 just optimized to work with two CCD chipsetati and when you connect one chiplet full performance can not give.

But much more disturbing than the speed of the memory cause a latency of internuclear interaction. It seems that the location of the nuclei in different CCD-chiplet should impose a substantial penalty in data transfer between them. For example, the latency in the exchange of information between cores in different crystals in the processors Threadripper, one and a half times higher than when transfers between different cores CCX-complexes within a single crystal. However, surprisingly, such problems have Ryzen 9 3900X does not exist. Here the internuclear interaction between the nuclei belonging to different CCX-complexes, leads to the same delays regardless of whether we are talking about the CCX in the same or in different CCD-chiplet.

And this is a really serious achievement. Thanks to the centralized scheme of the mutual connection of cores, multi-processor Ryzen 9 3900X from the side looks like a completely solid solution. No additional penalties for mercapital communication do not. And therefore, there is no reason to compare Ryzen 9 3900X with Threadripper. What AMD offers at this time – a full 12-core processor, not the Assembly of the two shestiyaderny in a single housing.

#Read more about the characteristics of Ryzen 9 3900X

The review Ryzen 7 3700X we compare it with the older LGA1151-Intel. It was logical, based on the number of cores and threads: Ryzen 7 3700X – shestnadtsatiletnij and OCTA-core CPU, like Core i9-9900K. In fact, however, AMD continues to follow his principle “we will have more cores for the same money than the competitor” and contrasts the Core i9-9900K completely different your processor. The recommended price of $499 in the new lineup got a 12-core, 24-threaded Ryzen 9 3900X, and it is positioned as alternatives to the five hundred-dollar osmeteria Core i9-9900K.

Cores/ Threads Base frequency, MHz Turbocheetah, MHz L3 cache MB TDP, watts Chipley Price
Ryzen 9 3950X 16/32 3,5 4,7 64 105 2×CCD + I/O $749
Ryzen 9 3900X 12/24 3,8 4,6 64 105 2×CCD + I/O $499
Ryzen 7 3800X 8/16 3,9 4,5 32 105 CCD + I/O $399
Ryzen 7 3700X 8/16 3,6 4,4 32 65 CCD + I/O $329
Ryzen 5 3600X 6/12 3,8 4,4 32 95 CCD + I/O $249
Ryzen 5 3600 6/12 3,6 4,2 32 65 CCD + I/O $199

Already in the simple comparison of the characteristics Ryzen 9 3900X against the Core i9-9900K AMD processor looks very impressive. Time and a half because in addition to the superiority in number of cores and threads Ryzen 9 3900X can offer and huge L3 cache with a total capacity of 64 MB, while in a competing processor, the cache memory of the third level less than four times. In addition, Ryzen 9 3900X can boast official support for DDR4-3200 and accelerated version of PCI Express 4.0.

The only thing Ryzen 9 3900X has not yet been able to surpass Intel CPUs is the clock frequency. They are for 12-core are declared in the range of 3.8-4.6 GHz, although in reality it will strive to get closer to its upper bound due to aggressive technology Precision Boost 2. However, lower frequencies are quite Ryzen 3000 kompensiruet his outstanding IPC (the number of executable per clock instruction): as we have seen, in many cases at the same frequency core 2 Zen work even faster cores Coffee Lake Refresh.

In the end, to find in the camp of Intel suitable opponent for Ryzen 9 3900X with the same number of cores, we will inevitably have to turn to heavy HEDT platform LGA2066. Only in its composition there are 12-core Core i9-9920X, but it is estimated at $1 199, that is 2.4 times more expensive than AMD’s flagship news related to the mass platform Socket AM4. Here, of course, one could argue that the HEDT platform offering Quad-channel memory controller and more PCI Express, however, such possibilities can hardly be attributed to the vital for most users things. And that means Ryzen 9 3900X actually blurs the line between HEDT and Socket AM4. Thanks to this gift from AMD users conventional bulk systems can now get the level of multithreading, which recently was only available to owners of heavy and expensive platforms LGA2066 or Socket TR4.

Ryzen 9 3900X Core i9-9920X Core i9-9900K Threadripper 2920X
Platform Socket AM4 LGA2066 LGA1151v2 Socket TR4
Manufacturing process, nm 7/12 14 14 12
Cores/ threads 12/24 12/24 8/16 12/24
Frequency (nominal/turbo) GHz 3,8/4,6 3,5/4,4 3,6/5,0 3,5/4,3
L3 cache MB 64 19,25 16 32
TDP, watts 105 165 95 180
Memory 2 × DDR4-3200 4 ×DDR4-2666 2 ×DDR4-2666 4 ×DDR4-2933
Lines PCIe 24 ×Gen4 44 ×Gen3 16 ×Gen3 64 ×Gen3
Price $499 $1 199 $488 $625

Let’s look at the characteristics of Ryzen 9 3900X more. Among the processors in the consumer segment this processor looks like an alien from another world. So it turns out due to the increased number of cores and huge cache, and these features are acquired thanks to the introduction of kiplenge design. In other words, it is legitimate to say that Ryzen 9 3900X – a vivid demonstration of the correctness of the course taken by AMD. The company’s engineers “flick of the wrist” collected from the two CCD-chipsetov mass processor to catch up with that in the baseline characteristics of the Intel in the near future obviously will not be able to.


Another feature Ryzen 9 3900X – relatively good frequency. Typically processors with more cores, lower clock frequency, but in this case the opposite happened. And nominal, and maximum frequency Ryzen 9 3900X superior cosmedent Ryzen 7 3700X, and even ahead of eight Ryzen 7 3800X terms of the maximum frequency. This means that Ryzen 9 3900X will be as good in multithreaded applications or when a more simple load on a limited number of cores. That is, the processor must be universal, not a niche solution for demanding work loads, this is technology Precision Boost 2 in aggressiveness which Ryzen 3000 we have already seen.

For example, look how are real working frequency Ryzen 9 3900X in Cinebench R20 load on different number of cores. The minimum frequency observed at full load CPU rendering, start from 4,025 GHz.

And for example, when OCTA core load, the processor is capable of operating at a frequency of 4.1 GHz, that is at least not slower than Ryzen 7 3700X. In the case of downloading a small number of cores Ryzen 9 3900X comes on frequencies above a 4.3-4.4 GHz.

When meeting with Ryzen 7 3700X we drew attention to its high operating temperatures. Ryzen 9 3900X, in which nuclei and a half times more, was also affected by this issue, and even more.

The stress load is received by the utility Prime95 29.8, raises the temperature of the CPU in the nominal mode up to 95 degrees (with the cooler Noctua NH-U14S) and the Converter power the motherboard reports the CPU consumption of about 190 watts of electricity.

It looks somewhat normal, and we were able to get unofficial confirmation that in the latest versions of the BIOS that came for X570-motherboard before the announcement of Ryzen 3000, technology of Precision Boost 2 is configured with a strong overestimation of the allowable limits for the consumption and heat dissipation that automatically provides an additional increase of operating frequencies. However, apparently, the initiator of this “overclocking out of the box” is the AMD, and it is unclear whether this mode will now become standard, whether it is imposed only on the output time of the first wave of reviews to get more positive reviews in the press, and will be removed.


About acceleration Ryzen 9 3900X not much to tell. Here everything is done to us. Technology parameters Precision Boost 2 12-core unscrewed to the limit, and this CPU works at the maximum possible under dynamic acceleration frequencies without any additional configuration.

If to speak about static acceleration, the power voltage setting To 1.2, it was possible to achieve stable operation at a frequency of 4.0 GHz. Unfortunately, the processor is strongly heated, and it almost completely ties the hands of overclocking.

It is doubtful that in this static acceleration there is some practical sense. Technology Precision Boost 2 even at 100% load on CPU provides a slightly lower frequency, but when loaded by the operation of a part of cores it is able to provide for Ryzen 9 3900X noticeably better performance.


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