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ASRock OC Formula X299: created to disperse

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The range of any known company, which produces motherboards, today a lot of models that supports overclocking. Somewhere- for example, in the elite series ASUS ROG — such functions is inexhaustible many, how many, and all the others, and the more affordable versions of the boards, on the contrary, the developers have added only the most basic overclocking. But there is a very small group of motherboards designed specifically for overclocking. They are not saturated, “weight” circuitry controllers often do not support the maximum for a specific set of logic memory and are not painted with a solid “carpet” of LEDs on the PCB. But they are ready to squeeze all the juice out of the processors and is designed to achieve the limit frequency and setting records.

One of these boards over a year ago, the company released the ASRock with the direct participation of the legends of overclocking from Taiwan nick Shi (Nick Shih). He owned and owns several records overclocking using liquid nitrogen, and among professional overclockers, it took first place for 18 months. It was his recommendation helped developers to release X299 ASRock OC Formula, and that his extreme overclocking profiles programmed into the BIOS of this Board.

Today we will learn the features of this Board and read its overclocking capabilities.

#Specifications and cost

X299 ASRock OC Formula
Supported processors Intel Core X in the performance LGA2066 (seventh generation microarchitecture Core);
support technology Turbo Boost Technology 3.0 Max;
technology support, ASRock BCLK Hyper Engine III
Chipset Intel Express X299
Memory subsystem 4 × DDR4 DIMM UN-buffered memory up to 64 GB;
four – or dual-channel memory mode (depending on CPU);
support modules with frequency 4600(OC)/4500(OC)/4400(OC)/4266(OC)/4133(OC)/4000(OC)/
2133 MHz;
15 micron gold contacts in the memory slots;
support Intel XMP (Extreme Memory Profile) 2.0
Connectors for expansion boards 5 slots PCI Express 3.0 x16 modes x16/x0/x0/x16/x8 or x8/x8/x8/x8/x8 with the processor 44 with PCI-E; x16/x0/x0/x8/x4 or x8/x8/x0/x8/x4 CPU with 28 PCI-E; x16/x0/x0/x0/x4 or x8/x0/x0/x8/x4 CPU with 16 PCI-E;
1 slot PCI Express 3.0 x4;
1 slot PCI Express 2.0 x1;
15-micron gold-plated contacts in the PCI-E1 and PCI-E5
The scalability of the video NVIDIA Quad/4-way/3-way/2-way SLI Technology;
AMD Quad/4-way/3-way/2-way CrossFireX Technology
The storage interface Intel X299 Express:
– 6 × SATA 3 bandwidth of up to 6 Gbps (supports RAID 0, RAID 1, RAID 5, RAID 10, Intel Optane Memory 15 Intel Rapid Storage, Intel Smart Response, NCQ, AHCI and Hot Plug);
– 2 x Ultra M. 2 (PCI Express x4 Gen 3/SATA 3), capacity up to 32 GB/s ports (both ports support drive types 2230/2242/2260/2280/22110).
Controller ASMedia ASM1061:
– 2 × SATA 3 bandwidth of up to 6GB/s (support NCQ, AHCI and Hot Plug)
Dual NICs Intel Gigabit LAN I219V and I211AT (10/100/1000 Mbit);
protection from lightning and electrostatic discharges (Lightning/ESD Protection);
technology supports Wake-On-LAN Dual LAN with Teaming; energy efficient Ethernet 802.3 az, PXE
Wireless network interface Missing
Bluetooth Missing
Audio 7.1 channel HD audio Realtek ALC1220:
– the ratio of “signal to noise” on the linear audio output 120 dB, and on the linear input 113 dB;
– Japanese audio capacitors of Nichicon Fine Gold Series;
– built-in headphone amplifier TI NE5532 Premium with output to front panel (support headphones with impedance up to 600 Ohms);
insulation audiosony on the PCB Board;
– left and right audio channels located in different layers of the PCB;
– protection against power surges;
– 15-micron gold-plated audio jacks;
– supports Premium Blu-ray audio;
– support technology Surge Protection and Purity Sound 4;
– supports DTS Connect
USB interface Intel X299 Express:
– 6 ports USB 3.1 Gen1 (4 on back panel, 2 are connected to the connector on the Board);
– 6 USB 2.0 ports (2 on back panel, 4 ports to the two connectors on the Board).
Controller ASMedia ASM3142:
– 2 ports USB 3.1 Gen2 (Type-A and Type-C on the rear panel);
Controller ASMedia ASM3142:
– 1 port USB 3.1 Gen2 (Type-C front panel)
Connectors and buttons on the rear panel 2 USB 2.0 ports and a combo PS/2 port;
BIOS Flashback button;
Clear CMOS switch;
2 port USB 3.1 Gen1;
2 port USB 3.1 Gen1, and network LAN-socket RJ-45;
2 port USB 3.1 Gen2 (Type-A + Type-C) and network LAN-socket RJ-45;
optical S/PDIF output;
5 jacks (Rear Speaker / Central / Bass / Line in / Front Speaker / Microphone)
Internal connectors on the system Board 24-pin power connector high density EATX;
8-pin power connector high density ATX 12 V;
4-pin power connector high density ATX 12 V;
6-pin power connector high density ATX 12 V for graphics cards;
8 SATA 3;
2 M. 2;
5 4-pin connectors for hull/CPU fan with PWM support;
2 contact RGB LED;
USB 3.1 Gen1 to connect the two ports;
2 USB 2.0 ports for connecting four ports;
USB 3.1 Gen2 port on the front panel of the housing;
connector TPM;
audio connector for the front panel;
audio connector Right Angle;
connector Virtual RAID On the CPU;
connectors Power LED and Speaker;
the Thunderbolt connector;
a group of connectors for the front panel;
connector Voltage Control;
indicators Dr. Debug;
the power button is illuminated;
reset button (Reset);
reset button (Retry);
button Safe Boot;
Rapid OC buttons;
Menu button;
the PCIe switches ON/OFF;
Post Status Checker (PSC);
switch Slow Mode;
switch LN2 Mode;
connector BIOS B Select
BIOS 2 × 128 Mbit AMI UEFI BIOS with multilingual GUI (SD/HD/Full HD);
support PnP, DMI 3.0; WfM 2.0, SM BIOS 3.0, ACPI 6.1;
the supports Secure Backup UEFI
Corporate functions, technology and exclusive features OC Formula Power Kit:
– 13 Phase CPU Power design + 2 Phase Memory Power design;
– Digi Power (CPU and Memory);
– Dr. MOS;
OC Formula Connector Kit:
– Hi-Density Power Connector (24-pin for Motherboard, 8+4 pin for Motherboard, 6-pin for PCIe Slot);
– 15μ Gold Contact (memory sockets and PCIE x16 slots (PCIE1 and PCIE5));
OC Formula Cooling Kit:
– 8 Layer PCB;
– 2oz copper;
– Heat Pipe Design;
OC Formula Monitor Kit:
– Multi Thermal Sensor
ASRock Super Alloy:
– XXL aluminum radiator;
– Premium 60A Power chokes Choke;
– 60A Dr.MOS;
– premium memory capacitors;
capacitors Nichicon 12K Black (100% Japan made polymer capacitors high quality and conductivity);
black frosted printed circuit Board;
– High Density Glass Fabric PCB;
ASRock Steel Slots;
ASRock Ultra M. 2 (PCIe Gen3 x4 & SATA3);
ASRock Ultra USB Power;
ASRock Full Spike Protection (all USB, Audio and LAN);
ASRock Live Update & APP Shop
Operating system Microsoft Windows 10 x64
Form factor, dimensions (mm) ATX, 305 × 244
The warranty of the manufacturer, years 3
The minimum retail price, RUB. 30 700

#Packaging equipment

X299 ASRock OC Formula comes in a big box decorated in strong colours. On the front side no bright eye-catching screen savers and stickers – only the name of the Board manufacturer and the list of supported technologies.


On the reverse side of the box you can find a brief listing of the features of the Board and its ports on the back panel, and more information open under flap front panel of the box.

It is already possible to gather almost all the information about the product and also to see a bigger part of the Board through a transparent plastic window.

On the sticker from the end of the box lists the serial number and the batch number, the name of the model and its dimensions, country of origin and weight.

Please note that the Board weighs more than 1.2 kg, it’s really massive and heavy.

Inside of the carton Board is lying on a pallet made of polyethylene foam to which it is pressed against the plastic ties, and top it covers another insert of the same material.

Package Board includes four SATA cables with latches, standard backplate, plug the rear panel, two screws to secure the drives in the slots M. 2, and four connecting bridge for various SLI configurations.

The documentation Board is equipped with two types of instructions that contain sections in Russian, the Bulletin supported processors, ASRock card, CD with drivers and proprietary utilities.

X299 ASRock OC Formula is accompanied by a three year warranty. As for the cost, in Russia the fee can be purchased at a price of 30.7 thousand rubles. In other words, this is one of the most expensive boards, processors design LGA2066.


Design ASRock OC Formula X299 strict, but at the same time attractive. Colors of the Board are selected in such a way that all its elements, including radiators, in harmony with each other. So when you look at it there is a feeling of serious and high-quality product, and not just another “toy” boards with bright full of details on the PCB.


I would like to mention the massive heatsinks on the VRM cooling circuits of the processor is connected with a heat pipe. In the same style with them decorated the radiator of the chipset, which caused the name of the Board model.


Add that X299 ASRock OC Formula made in the form factor ATX and has dimensions of 305 × 244 mm.

A large area of the back panel is ribbed end of the second section of the radiator. Obviously, due to such a simple solution the developers sought to increase the efficiency of cooling elements VRM. The specs of the Board stated that the radiator can remove elements from the VRM up to 450 watts of thermal power.

Despite this fact, all the necessary ports on the rear panel. Among them, eight USB 3.1 Gen2 including the PS/2 port, button, BIOS Flashback and Clear CMOS, two network sockets, optical output and 5 audio outputs. Plug here not built in, like some other flagship motherboards.

Of the cover parts on ASRock OC Formula X299 radiators only, no plastic housing with backlight. The radiators are fastened with screws, therefore, be removed easily. Here is the Board without them.

Like other flagship models from ASRock, X299 OC Formula uses an eight-layer PCB of high density, more resistant to thermal stress and humidity. In addition, it doubled the thickness of the copper layers, which should positively affect the heat distribution.

The main advantages of the ASRock, which we will examine in the article below.

To further study the arrangement of elements on the PCB will help the scheme with the table of the instruction manual.


In the CPU socket LGA2066 X299 ASRock OC Formula contact needle sputter-coated from a 15-micron layer of gold. According to the developers, such a coating contributes to the increased resistance of the needles to corrosion and increase the number of times you can remove and replace the processor without deterioration of contact with them (especially for overclockers). In addition, the center of the connector there is a hole for installation under the CPU temperature sensor.

Currently, the fee supports 17 models of Intel processors, released in design LGA2066.

Stated that the power circuit of the CPU built in the 13-phase scheme, which uses the Assembly Dr. MOS, durable capacitors Premium 60A Power Choke and Nichicon 12K. The total capacity of the CPU power circuit declared at around 750 A.


But her closer inspection, it turns out that directly to the processor there are 12 phases, and another involved in VCCSA (right hand throttle in the photo marked TR30) and VCCIO. On the reverse side of the PCB with soldered IC-doubles on the use of spoken and application of the seven phase controller ISL69138.

In addition, the X299 ASRock OC Formula has an external clock – BCLK Hyper Engine III, implemented by a microprocessor ICS 6V41742B.

It should help to achieve better overclocking results on the BCLK frequency and to provide precision installation.

For nutrition fee gave four connectors. They include the standard 24 – and 8-pin and additional 4-pin for CPU and memory. Well, six-pin connector which should be connected if charge installed four graphics cards.


All power connectors, the Board uses the contact needle of high density.

The number of slots of RAM on ASRock OC Formula X299 reduced from eight to four, and the maximum supported memory DDR4 reduced from 128 to 64 GB. This approach engineers the ASRock understandable and justified, since overclockers on platforms with LGA2066 rarely uses all eight slots, and four modules to achieve a more impressive memory overclocking is much easier than eight. Slots located in pairs on both sides of the CPU socket, all the contacts within them are covered with 15 micron layer of gold.

Frequency modules can reach 4600 MHz, and support for XMP (Extreme Memory Profile) 2.0 standard will simplify the achievement of this indicator, the benefit of DDR4 kits with this nominal frequency is already available. By the way, on the company’s website published lists of certified for this card sets of RAM, including therefore the memory with a frequency of 4600 MHz (G. Skill F4-4600CL19D-16GTZKKC). We add that the power supply system of each pair of dual channel slots.

PCI Express slots on the ASRock OC Formula X299 seven, with five of them, made in the form factor of x16, have a metal shell that further emphasizes these slots and shielding their contacts from electromagnetic radiation. In addition, in the first and fifth reels well as the contacts inside are gold plated layer with a thickness of 15 µm.

When installed on the processor Board 44 with a PCI-E supported the creation of the multiprocessor graphic configurations with four graphics cards for GPU AMD or NVIDIA in the mode x8/x8/x8/x8, and two video cards will work in conjunction full speed x16/x16. In turn, with a CPU with 28 PCI-E can work four graphics cards on AMD GPU in the mode x8/x8/x8/x4 or three on the NVIDIA GPU in the mode x8/x8/x8 and two cards will always work in mode x16/x8. Finally, when you install a processor Board with 16 PCI-E will be available modes are x16 or x8/x8.

For the distribution of PCI-E on the Board meets a huge array of multiplexers NXP supplies (22), part of which is located on the opposite side of the PCB.

Additionally commutes the PCI-Express controller ASM1184e production ASMedia.

To the periphery of the PCB has one slot PCI Express 3.0 x4 slot with an open end and a single slot PCI Express 2.0 x1.

Crystal Express chipset Intel X299 contact with the heatsink via thermal pads and nothing special.

Is it only possible to note that the PCB Board exactly on the perimeter of the chipset is soldered 19 LEDs RGB-lighting.

Board is equipped with from eight SATA 3 ports, six of which are implemented by the chipset Intel Express X299. It supports the creation of RAID-arrays levels 0, 1, 5, 10 and Intel Optane Memory 15 Intel Rapid Storage, Intel Smart Response, NCQ, AHCI and Hot Plug.

Two additional ports are implemented by controller ASMedia ASM1061. The meaning of their presence on the Board aimed at overclocking, we are not clear.

X299 ASRock OC Formula gave two-port Ultra M. 2 with a capacity of up to 32 Gbit/s, both support drives with PCI Express x4 Gen 3 and SATA 3.

The length of the drives in both ports can be any (from 30 to 110 mm), but the drawback is the radiators are absent, although the problem of overheating of high-speed SSD and decrease their performance today is quite acute.

Continuing the theme drives note the presence on the Board of the connector Virtual RAID On CPU (VROC1).

It is designed to create Hyper-speed RAID-arrays NVMe SSD connected directly to the processor.

15 total number of USB ports to eight external and seven internal. Six ports are USB 3.1 Gen1: four displayed on the rear panel and two are connected to an internal connector on the Board. Another six ports are USB 2.0: two displayed on the rear panel and four connected to two internal connectors on the motherboard.

All of these ports are implemented by the chipset. Two additional controller ASMedia ASM3142 allowed to add three high-speed USB 3.1 Gen2 throughput to 10 Gbps.

Two such port can be found on the rear panel (connectors Type-A and Type-C) and another port located on the PCB and is intended for connecting a cable from the front panel of the system unit. In General, the number of USB ports and their distribution on ASRock OC Formula X299 can be called perfect.

The Board was equipped with two Gigabit network controllers: Intel WGI219-V and Intel WGI211-AT.

Both controllers and their connectors are protected against lightning and electrostatic discharges (Lightning/ESD Protection), and supports Wake-On-LAN Dual LAN with Teaming and energy-efficient Ethernet 802.3 az.

Despite the obvious overclocking focus X299 ASRock OC Formula, the sound of her given due consideration. The basis of the sound channel lies popular 7.1 channel audio codec Realtek ALC1220.

To increase the purity of the sound, it added Japanese audio capacitors of Nichicon Fine Gold Series and headphone amplifier TI NE5532 Premium with output to front panel (support headphones with impedance up to 600 Ohms).

In addition, left and right audio channels located in different layers of the PCB, and the whole area of the audio components are separated from the rest of the Board non-conductive strips.

Such hardware optimization, according to the developers, allowed to achieve the ratio of “signal to noise” on the linear audio output 120 dB, and on the linear input 113 dB. At the software level they are complemented by technology Purity Sound 4, DTS Connect, Premium Blu-ray audio, Surge Protection and DTS Connect.

Monitoring and fan control on the Board vested immediately to two controllers Super I/O Nuvoton NCT6683D and NCT6791D.


In addition, on the reverse side of the Board soldered two extra controller Winbond W83795ADG.

Each controller can monitor up to 21 voltages, 8 fans and 6 temperature sensors. But it is strange that on the Board we can only find 5 connectors to connect and control the fans via PWM or voltage. In our opinion, for a motherboard of this class and orientation of these connectors should not be less than seven.

But motherboard is equipped with a comprehensive set of overclocking buttons and switches, and four diagnostic LEDs.

In addition, on the bottom edge of the PCB has an indicator POST-codes, which you can use to determine the cause of the loading error or system failure.

X299 ASRock OC Formula contains two 128-bit BIOS.

Switching between primary and backup microchip implemented the good old jumper. Will add that updating the BIOS can be used the BIOS Flashback button on the rear panel of the Board. And it does not require any CPU, no RAM, no graphics card — only the Board itself when the USB drive with FAT32 file system and update the BIOS.

As we mentioned above, the Board highlighted area of the chipset. The illumination color and its mode of operation are configured in the BIOS and in the corporate application ASRock RGB LED.

To extend the backlight for the whole system block will help two RGB connector, to which you can connect led strip to limit current 3 And each length is two meters.

Cooling of the circuit elements of the VRM on ASRock OC Formula X299 implemented two massive radiators, connected by heat pipe. Remote radiator goes on the backboard, and further is cooled by external air flow.

On a barely heated the chipset installed flat aluminum heatsink with thermal pad.


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Overview of GIGABYTE AORUS X570 PRO: time to gather a powerful PC Ryzen

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So lately into my hands from time to time fall GIGABYTE, the title of which is the word PRO. In 2018 my authorship out related models such as the AORUS PRO B450 and Z390 AORUS PRO. And you know what? In both cases we were dealing with a sturdy “workhorses” cards, which perfectly showed themselves in the coordinate system of “price — quality”. The character of today’s review — GIGABYTE model AORUS X570 PRO — fits into the designated category.



#Specifications and packaging

At the time of writing, on the official GIGABYTE website was listed just nine motherboard models based on the new chipset X570. While X570 AORUS PRO exists in two versions — if you need a device with a preinstalled wireless module, look at the selling option called X570 AORUS PRO WIFI. Otherwise the versions are identical. Main technical characteristics of the device shown in the table below.

Supported processors AMD Ryzen 3rd Generation
AMD Ryzen 2nd Generation
Ryzen with AMD Radeon Graphics Vega
Chipset AMD X570
Memory subsystem 4 × DIMM slots, up to 128 GB DDR4-2133-4400 (OC), for Ryzen 2000 — up to DDR4-3600 (OC)
Expansion slots 3 × PCI Express x16
2 × PCI Express x1
The storage interface 1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
1 × M. 2 (Socket 3, 2242/2260/2280/22110) with support for SATA 6 Gbps and PCI Express x4
6 × SATA 6GB/s
RAID 0, 1, 10
LAN Intel I219V, 10/100/1000 Mbps
Audio Realtek ALC1220-VB 7.1 HD
Interfaces on the rear panel 1 × HDMI
1 × RJ-45
1 × optical S/PDIF
3 × USB 3.1 Gen1 Type A
1 × USB 3.1 Gen2 Type C
2 × USB 3.1 Gen2 Type A
4 × USB 2.0 Type A
5 × 3.5 mm audio
Form factor ATX
Price 19 500 RUB.

I note that details about the set logic X570 you can read in the article “AMD Ryzen 7 3700X: Zen 2 in all its glory, “although the hereafter will necessarily be distinctive features of the new boards for the platform AM4.

The device is Packed in a small but colorful cardboard box. The packaging has a quite recognizable appearance, but the main thing is, of course, its contents. In addition to the Board, it was a lot of accessories, both useful and not:

  • user manual;
  • sticker with the logo AORUS;
  • disk with software and drivers;
  • four SATA cable;
  • the screws for fastening the M. 2 drives;
  • extension cable RGB tape;
  • adapter G Connector to facilitate connection of the bodies of management of the case.

In General, we have everything you need in order to start the Assembly of the system unit.

#Design and capabilities

So, we have motherboard form factor ATX. The manufacturer uses a full size PCB, that is, its dimensions are 305 × 244 mm. Many know the consequences of application of the PCB smaller. So, when attaching the circuit Board in the housing the right side will SAG and can be deformed upon connection of the memory modules or the main connector of the power supply. In the case of the AORUS PRO X570 unexpected “twists of fate” of this kind should not happen.


GIGABYTE AORUS X570 PRO: five PCI-E connectors

Since we are talking about the form factor ATX, the manufacturer may place on the motherboard up to seven expansion slots. However, X570 AORUS PRO boasts only five PCI Express slots. In the photo above, we see that the part of space occupied by the M. 2 ports required for installing SSDs. Well, cry about it just not worth it.

Motherboard supports technologies such as AMD CrossFire (hardware manufacturers, as we still use this term, although it is slowly disappearing) and NVIDIA SLI. When connecting two digital devices to the PCI Express x16 slots they will work according to the scheme x8+x8. If you read the review Ryzen 7 3700X, you know that now we are talking about PCI Express 4.0. Of course, this would require the processor family Ryzen 3000 (not the G-version, as it uses the now outdated architecture Zen+). In the case of “stones” Ryzen 2000, all the expansion slots will work according to the standard number 3.0.

The third PCI Express x16 slot always runs at x4 speed — these lines are provided directly by the chipset. They also — depending on the generation of processor Ryzen — will work with bandwidth or standard 4.0, or 3.0. And on the PCB X570 AORUS PRO has two PCI Express x1 4.0/3.0.

In my opinion, the location of the expansion slots at the test Board as a whole was successful. Firstly, the main PEG port is noticeably removed from the socket. In the end, X570 AORUS PRO will allow you to set any, even the largest air cooler. We also without any problems, without removing the video card, can install RAM modules.

Secondly, between the main PEG-ports a decent distance — such that we can combine in SLI/CrossFire arrays, even video cards with translatewiki coolers. I believe that in 99.9% of cases in the system will still use a single graphics accelerator, and therefore with one port PCI-Express x1 have to say goodbye. And another point: the graphics card will block the fan of system of cooling of the chipset and translateby 3D accelerator still soldered below the M. 2 slot.

Please note that the main PEG ports and DIMM slots are reinforced. Ports also have additional fixation and increased the number of soldering points on the PCB. In total, according to the manufacturer, these design solutions strengthen connectors 1.7 times when the load on the fracture, and 3.2 times when the load on the pulling.

When you install the DLC NZXT KRAKEN X62 I had to part with one DIMM slot — the ones closest to the CPU socket. This point is important to consider if you want to build a system with a liquid cooling system similar designs (when hoses “dropsy” are attached to the waterblock on the right) and if you plan to install into the system four memory modules.

GIGABYTE AORUS PRO X570 soldered seven 4-pin connectors for fans connection. The fee traditionally GIGABYTE allows you to control the impeller with shim and without it (fan with 3-pin connectors). Thanks for this Smart Fan 5. It supports even the fans power up to 24 watts. In General, the connectors for the “Carlson” is located successfully. I’d only moved to the side of the CPU socket connector SYS_FAN5_PUMP, which is the closest to 24-pin power port. The fact that connecting it to the pump maintenance-free DLC, not so easy to hide the protruding wire. Still want to collect a beautiful system units.

But SYS_FAN6_PUMP connector is successful. It will be useful to you if you are going to install in PC full custom “dropsy”. In Tower-building, as a rule, a tank of refrigerant and a pump mounted in the front portion thereof.

Speaking of beauty. At the top right of X570 AORUS PRO has just two ports for connection of led strips: one is designed for 12-volt RGB accessory, one for the 5V addressable strip. Exactly the same “sweet couple” and soldered at the bottom of the PCB. Another 12-volt plug is located next to the socket AM4. Is connected to the backlight of the cooler.

The Board highlighted left edge and a small strip on the plastic housing. Note that when using RGB Fusion 2.0 the user has the option to install 11 modes of illumination.

The disk subsystem includes six SATA 6 GB/s and two M. 2 slots. Now they do not share bandwidth with each other. The primary M. 2 connector allows you to install SSD sizes 2242, 2260, 2280 and 22110. It supports both SATA mode and in the mode PCI Express. The second option involves the CPU of the line: in the case of Ryzen 3000 we are talking about the 4.0 standard, in the case of Ryzen 2000 — on 3.0. The second M. 2 slot has the same features, but only in this case the PCI Express coming from the chipset.

In my opinion, the main M. 2 port is successful. It will not be covered by the graphics card, and if using an air CPU cooler installed this SSD socket will be additionally Abdovitsa. And here is an additional M. 2, I think, it was better to unsolder the lower PEG of the second port near the PCI Express x1 and chipset. With this arrangement, the SSD will not (even partially) covered by the video card, if the system has only one graphics accelerator. We can safely say that the era of NVMe drives come in fully — consequently, the presence in PC of two M. 2 SSD doesn’t look like something outlandish.

GIGABYTE AORUS X570 PRO features a high-quality Gigabit network controller Intel I219-V and sound chip Realtek ALC1220-VB. The audio codec has a ratio of “signal to noise” of 120 dB and an intelligent amplifier that automatically determines the impedance of the connected headphones. Separately, the manufacturer notes that the new controller enables us to convey to the Network the voice with a microphone connected to the 3.5 mm Jack on the front or on the rear panel. In addition, the tract is equipped with special capacitors WIMA FKP2. Here we see a complete copy of the audio subsystem used in the AORUS PRO B450.

The I/O panel GigX570 AORUS PRO you’ll find two USB 3.1 Gen2 A-type and another of the same, but C-type. Three USB connectors meet the USB 3.1 Gen1, and four 2.0. From video outputs there are HDMI only. The rest of the space on the rear panel is a RJ-45, optical S/PDIF output and five 3.5-mm mini-jacks.

As for the internal I/O ports X570 AORUS PRO on the edges of the PCB are soldered device from a single USB 3.1 Gen2, two USB 3.1 Gen1, two USB 2.0, TPM and F-audio.

From pleasant trifles I note the presence on Board button Q-Flash with which BIOS matplot you can upgrade, not even including the computer.

According to the manufacturer, Converter power X570 AORUS PRO has 12+2 phases — sounds impressive, agree. Controls the lines VRM PWM controller Infineon IR35201, which, as you know, works according to the scheme 6+2. This means that in reality the power subsystem X570 AORUS PRO, responsible for the operation of the computational cores has six phases — they simply double (on the reverse side we see the PWM-doubles Infineon IR3599). Each such channel comprises two inductors and two MOSFET Infineon IR3553, each of which can withstand a load of 40 A. Each of the two phases responsible for the SoC component of the CPU consists of one inductor and four MOSFETs ON Semiconductor — two transistor 4C10N and 4C06N.

In General, the power Converter X570 AORUS PRO inspires confidence. Moreover, field-effect transistors therein are cooled by two large aluminum radiators, connected by a copper deplorable. Details about the efficiency of the power Converter of this Board I’ll explain in a second part of the review.

Please note that the chipset of the device is cooled by an active cooler. We’ll get used to this state of Affairs, because many X570-the motherboard uses a similar cooling system. The fact that the level of heat the chipset up to 14 watts. As you know, AMD is, in fact, uses a modified I/O-chiplet, which is used in server processors EPYC Rome. It is produced using 14-nanometer technology and, as you can see, needs active cooling.

I have already noted that in some cases chipsetov fan of the cooler will be covered with a graphics card. This leads to the fact that the chipset if you use temperature sensors the Board is heated to 55-60 degrees Celsius. The fan is quite loud only when turning on the computer, and then it takes a few seconds and it ceases to be heard.

Of course, over time the impeller gets clogged with dust and may begin to make other sounds. However, we must understand that for the “health” of the system unit entirely meets its owner — don’t be lazy as often as possible to clean your PC from dust.


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AMD Ryzen 3900X 9: a split personality

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Last week AMD gave the press a computer a nightmare. The company’s desire to release their new 7-nm products certainly in “beautiful” date July 7 (7.07) led to the fact that the preparation for their announcements was carried out in a wild rush and very messy. For example, samples Ryzen 3000 arrived in our lab just five days before the “hour X”, but even during these five days we have been updating the BIOS of the test motherboard based on set logic X570, which not only corrected mistakes and added platform stability, but also seriously affect performance.

Because of this, we were faced with a difficult choice: either to engage in continuous retesting of the new processors at the next firmware versions and abandon any attempt to catch with the publication of the review of the first media micro Zen 2 at the end of information embargo, or for use in publications are not the most current performance data. But in the end was chosen as a compromise: the review was divided into two parts. The first part, which is dedicated to eight Ryzen 7 3700X, you most likely have already read – it appeared on our website in the very moment when the world started selling Ryzen 3000. And this article is the second part, and it will focus on the older 12-core representative of a new family, the processor Ryzen 9 3900X.

This separation allowed us again to recheck all the results on the last (at the current moment) version of firmware for the motherboard and ensure that the first buyers Ryzen 3000 will have at its disposal is the level of performance, referred to in this material.

However, no certainty that this performance level does not undergo regular adjustments in the very near future, we have. The fact that the five different versions of the BIOS of our test motherboard that we have tested for five days of experiments, change in the system is quite fundamental. Them AMD not only in optimizing memory controller, but “tighten up” the variable Boost 2 technology Precision, increasing the real frequency of the processor at the expense of efficiency. It is quite possible that later the company will want to change the operating parameters of their processors again. In other words, today’s tests Ryzen 3000 is only a preliminary acquaintance, which occurs at an early stage in the life cycle of new products.

Perhaps in the circumstances it would be right to wait a few weeks and thoroughly test the new chips, when the situation with them already ustakanilos: motherboard manufacturers will prepare a stable version of firmware, based on the AGESA libraries that have all the essential optimization and AMD will come to a final understanding, a balance between performance and energy efficiency it wants to achieve in the end.

However, to do so would be not too rational. The hype created around the new version of the microarchitecture of authorship and the first AMD desktop processors based on it, is so great that the computer community is ready to swallow any information, even if it is in the nature of rough estimates. Therefore, the review Ryzen 9 3900X still goes on our website after the review Ryzen 7 3700X, despite the clear “dampness” of these products. Later, to put the final point in the subject’s performance of new products, we’ll just test them again.

#Of eight — twelve: topology Ryzen 9 3900X

Together with new microarchitecture Zen 2 AMD introduces into use the new topology. Processors now are not a monolithic crystal, and are assembled from several components. This allows the company under the old ecosystems Socket AM4 to offer a new powerful CPU, with 12 and 16 cores. The budget for such multi-core processors consists of nearly 10 billion transistors, but they are distributed over several semiconductor crystals, similar to the way it was done in the HEDT CPUs Ryzen Threadripper.

However, unlike Threadripper desktop CPUs are not constructed of the same components, they use semiconductor crystals of two different types. First, it is OCTA-core “computing” CCD chipley produced for 7-nm process at TSMC companies. Each chipset combines two CCX-complex, containing four cores and 16 MB cache in the third level. Second, an additional 12-nm I/O-chipset controller memory controller, PCI Express 4.0 and elements of the SoC, which is responsible for input / output.

Given the fact that Ryzen 9 3900X – dwenadzatiperstnuu processor, it is constructed from three semiconductor crystals: two 7-nm CCD-chipsetov, with 3.9 billion transistors with an area of 74 mm2, and 12-nm I/O chiplet area of approximately 125 mm2, consisting of 2.09 billion transistors. Connect chipley tyre Infinity Fabric, the same as that used for communication between CCX-complexes within a single CCD chiplet. And, most importantly, chipley nuclei have no direct link connecting them, and all internuclear interaction, is constructed using the I/O-ciplet, who also plays the role of the switch.

It is easy to calculate that a 12-core CPU Ryzen 9 3900X needs to be active not all the cores available. And it’s true: one computational kernel in each CCX available-complex hardware locked, which makes any of the initial 16-core stock CPU with 12 cores. In this case, limiting the number of cores is partly a forced measure, as 16 cores hard enough to enter in a valid Socket AM4 limits energy consumption. But AMD does not abandon the idea of release and 16-core Socket AM4 product. This project is scheduled for the autumn, it will be released under the name Ryzen 7 3950X, but the manufacturer will have to resort to a special education careful selection of semiconductor crystals.

Chipley approach allows to obtain several advantages. First, it allows to simplify the design and production of processors, but also offers ways for easy scalability of the products. Second, because of the separation of functions chiplets different types of AMD had the opportunity to avoid duplicating nodes, we need in a single number, for example, memory controller or bus controller PCI Express 4.0. Due to the fact that all these blocks are put into a single I/O-chiplet to which the CCD chipley have equal access, a logical processor is a monolithic structure with centralized mechanisms of memory accesses and to external devices. Any hints on the usual users Threadripper NUMA-modes in the AM4 Socket system, all cores in 12 – and 16-core processors have exactly the same access to the array RAM.

Everything said is illustrated by the results of practical measurements. As for memory access, then it is all really OK. Ryzen 9 3900X shows approximately the same latency that OCTA-core processor Ryzen 7 3700X. This means that the connection to the I/O chiplet with the memory controller not one, but two CCD chipsetov does not entail any negative effects. Thanks cipitol the layout of memory for all cores do seem to be a single array with the same delay.

And by the way, please note, Ryzen 9 3900X is not subject to the same problem with lower half-bandwidth of the recording, which we found Ryzen 7 3700X. It turns out that the memory controller I/O coplete Ryzen 3000 just optimized to work with two CCD chipsetati and when you connect one chiplet full performance can not give.

But much more disturbing than the speed of the memory cause a latency of internuclear interaction. It seems that the location of the nuclei in different CCD-chiplet should impose a substantial penalty in data transfer between them. For example, the latency in the exchange of information between cores in different crystals in the processors Threadripper, one and a half times higher than when transfers between different cores CCX-complexes within a single crystal. However, surprisingly, such problems have Ryzen 9 3900X does not exist. Here the internuclear interaction between the nuclei belonging to different CCX-complexes, leads to the same delays regardless of whether we are talking about the CCX in the same or in different CCD-chiplet.

And this is a really serious achievement. Thanks to the centralized scheme of the mutual connection of cores, multi-processor Ryzen 9 3900X from the side looks like a completely solid solution. No additional penalties for mercapital communication do not. And therefore, there is no reason to compare Ryzen 9 3900X with Threadripper. What AMD offers at this time – a full 12-core processor, not the Assembly of the two shestiyaderny in a single housing.

#Read more about the characteristics of Ryzen 9 3900X

The review Ryzen 7 3700X we compare it with the older LGA1151-Intel. It was logical, based on the number of cores and threads: Ryzen 7 3700X – shestnadtsatiletnij and OCTA-core CPU, like Core i9-9900K. In fact, however, AMD continues to follow his principle “we will have more cores for the same money than the competitor” and contrasts the Core i9-9900K completely different your processor. The recommended price of $499 in the new lineup got a 12-core, 24-threaded Ryzen 9 3900X, and it is positioned as alternatives to the five hundred-dollar osmeteria Core i9-9900K.

Cores/ Threads Base frequency, MHz Turbocheetah, MHz L3 cache MB TDP, watts Chipley Price
Ryzen 9 3950X 16/32 3,5 4,7 64 105 2×CCD + I/O $749
Ryzen 9 3900X 12/24 3,8 4,6 64 105 2×CCD + I/O $499
Ryzen 7 3800X 8/16 3,9 4,5 32 105 CCD + I/O $399
Ryzen 7 3700X 8/16 3,6 4,4 32 65 CCD + I/O $329
Ryzen 5 3600X 6/12 3,8 4,4 32 95 CCD + I/O $249
Ryzen 5 3600 6/12 3,6 4,2 32 65 CCD + I/O $199

Already in the simple comparison of the characteristics Ryzen 9 3900X against the Core i9-9900K AMD processor looks very impressive. Time and a half because in addition to the superiority in number of cores and threads Ryzen 9 3900X can offer and huge L3 cache with a total capacity of 64 MB, while in a competing processor, the cache memory of the third level less than four times. In addition, Ryzen 9 3900X can boast official support for DDR4-3200 and accelerated version of PCI Express 4.0.

The only thing Ryzen 9 3900X has not yet been able to surpass Intel CPUs is the clock frequency. They are for 12-core are declared in the range of 3.8-4.6 GHz, although in reality it will strive to get closer to its upper bound due to aggressive technology Precision Boost 2. However, lower frequencies are quite Ryzen 3000 kompensiruet his outstanding IPC (the number of executable per clock instruction): as we have seen, in many cases at the same frequency core 2 Zen work even faster cores Coffee Lake Refresh.

In the end, to find in the camp of Intel suitable opponent for Ryzen 9 3900X with the same number of cores, we will inevitably have to turn to heavy HEDT platform LGA2066. Only in its composition there are 12-core Core i9-9920X, but it is estimated at $1 199, that is 2.4 times more expensive than AMD’s flagship news related to the mass platform Socket AM4. Here, of course, one could argue that the HEDT platform offering Quad-channel memory controller and more PCI Express, however, such possibilities can hardly be attributed to the vital for most users things. And that means Ryzen 9 3900X actually blurs the line between HEDT and Socket AM4. Thanks to this gift from AMD users conventional bulk systems can now get the level of multithreading, which recently was only available to owners of heavy and expensive platforms LGA2066 or Socket TR4.

Ryzen 9 3900X Core i9-9920X Core i9-9900K Threadripper 2920X
Platform Socket AM4 LGA2066 LGA1151v2 Socket TR4
Manufacturing process, nm 7/12 14 14 12
Cores/ threads 12/24 12/24 8/16 12/24
Frequency (nominal/turbo) GHz 3,8/4,6 3,5/4,4 3,6/5,0 3,5/4,3
L3 cache MB 64 19,25 16 32
TDP, watts 105 165 95 180
Memory 2 × DDR4-3200 4 ×DDR4-2666 2 ×DDR4-2666 4 ×DDR4-2933
Lines PCIe 24 ×Gen4 44 ×Gen3 16 ×Gen3 64 ×Gen3
Price $499 $1 199 $488 $625

Let’s look at the characteristics of Ryzen 9 3900X more. Among the processors in the consumer segment this processor looks like an alien from another world. So it turns out due to the increased number of cores and huge cache, and these features are acquired thanks to the introduction of kiplenge design. In other words, it is legitimate to say that Ryzen 9 3900X – a vivid demonstration of the correctness of the course taken by AMD. The company’s engineers “flick of the wrist” collected from the two CCD-chipsetov mass processor to catch up with that in the baseline characteristics of the Intel in the near future obviously will not be able to.


Another feature Ryzen 9 3900X – relatively good frequency. Typically processors with more cores, lower clock frequency, but in this case the opposite happened. And nominal, and maximum frequency Ryzen 9 3900X superior cosmedent Ryzen 7 3700X, and even ahead of eight Ryzen 7 3800X terms of the maximum frequency. This means that Ryzen 9 3900X will be as good in multithreaded applications or when a more simple load on a limited number of cores. That is, the processor must be universal, not a niche solution for demanding work loads, this is technology Precision Boost 2 in aggressiveness which Ryzen 3000 we have already seen.

For example, look how are real working frequency Ryzen 9 3900X in Cinebench R20 load on different number of cores. The minimum frequency observed at full load CPU rendering, start from 4,025 GHz.

And for example, when OCTA core load, the processor is capable of operating at a frequency of 4.1 GHz, that is at least not slower than Ryzen 7 3700X. In the case of downloading a small number of cores Ryzen 9 3900X comes on frequencies above a 4.3-4.4 GHz.

When meeting with Ryzen 7 3700X we drew attention to its high operating temperatures. Ryzen 9 3900X, in which nuclei and a half times more, was also affected by this issue, and even more.

The stress load is received by the utility Prime95 29.8, raises the temperature of the CPU in the nominal mode up to 95 degrees (with the cooler Noctua NH-U14S) and the Converter power the motherboard reports the CPU consumption of about 190 watts of electricity.

It looks somewhat normal, and we were able to get unofficial confirmation that in the latest versions of the BIOS that came for X570-motherboard before the announcement of Ryzen 3000, technology of Precision Boost 2 is configured with a strong overestimation of the allowable limits for the consumption and heat dissipation that automatically provides an additional increase of operating frequencies. However, apparently, the initiator of this “overclocking out of the box” is the AMD, and it is unclear whether this mode will now become standard, whether it is imposed only on the output time of the first wave of reviews to get more positive reviews in the press, and will be removed.


About acceleration Ryzen 9 3900X not much to tell. Here everything is done to us. Technology parameters Precision Boost 2 12-core unscrewed to the limit, and this CPU works at the maximum possible under dynamic acceleration frequencies without any additional configuration.

If to speak about static acceleration, the power voltage setting To 1.2, it was possible to achieve stable operation at a frequency of 4.0 GHz. Unfortunately, the processor is strongly heated, and it almost completely ties the hands of overclocking.

It is doubtful that in this static acceleration there is some practical sense. Technology Precision Boost 2 even at 100% load on CPU provides a slightly lower frequency, but when loaded by the operation of a part of cores it is able to provide for Ryzen 9 3900X noticeably better performance.


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