Connect with us

PC / Laptop

ASRock OC Formula X299: created to disperse

Advertisement
The New MacBook Air now features a fifth-generation Intel Core processor. MacBook Air 13" from $975. Free Shipping on orders over $79

The range of any known company, which produces motherboards, today a lot of models that supports overclocking. Somewhere- for example, in the elite series ASUS ROG — such functions is inexhaustible many, how many, and all the others, and the more affordable versions of the boards, on the contrary, the developers have added only the most basic overclocking. But there is a very small group of motherboards designed specifically for overclocking. They are not saturated, “weight” circuitry controllers often do not support the maximum for a specific set of logic memory and are not painted with a solid “carpet” of LEDs on the PCB. But they are ready to squeeze all the juice out of the processors and is designed to achieve the limit frequency and setting records.

One of these boards over a year ago, the company released the ASRock with the direct participation of the legends of overclocking from Taiwan nick Shi (Nick Shih). He owned and owns several records overclocking using liquid nitrogen, and among professional overclockers, it took first place for 18 months. It was his recommendation helped developers to release X299 ASRock OC Formula, and that his extreme overclocking profiles programmed into the BIOS of this Board.

Today we will learn the features of this Board and read its overclocking capabilities.

#Specifications and cost

X299 ASRock OC Formula
Supported processors Intel Core X in the performance LGA2066 (seventh generation microarchitecture Core);
support technology Turbo Boost Technology 3.0 Max;
technology support, ASRock BCLK Hyper Engine III
Chipset Intel Express X299
Memory subsystem 4 × DDR4 DIMM UN-buffered memory up to 64 GB;
four – or dual-channel memory mode (depending on CPU);
support modules with frequency 4600(OC)/4500(OC)/4400(OC)/4266(OC)/4133(OC)/4000(OC)/
3866(OC)/3800(OC)/3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800(OC)/2666(OC)/2400(OC)/
2133 MHz;
15 micron gold contacts in the memory slots;
support Intel XMP (Extreme Memory Profile) 2.0
Connectors for expansion boards 5 slots PCI Express 3.0 x16 modes x16/x0/x0/x16/x8 or x8/x8/x8/x8/x8 with the processor 44 with PCI-E; x16/x0/x0/x8/x4 or x8/x8/x0/x8/x4 CPU with 28 PCI-E; x16/x0/x0/x0/x4 or x8/x0/x0/x8/x4 CPU with 16 PCI-E;
1 slot PCI Express 3.0 x4;
1 slot PCI Express 2.0 x1;
15-micron gold-plated contacts in the PCI-E1 and PCI-E5
The scalability of the video NVIDIA Quad/4-way/3-way/2-way SLI Technology;
AMD Quad/4-way/3-way/2-way CrossFireX Technology
The storage interface Intel X299 Express:
– 6 × SATA 3 bandwidth of up to 6 Gbps (supports RAID 0, RAID 1, RAID 5, RAID 10, Intel Optane Memory 15 Intel Rapid Storage, Intel Smart Response, NCQ, AHCI and Hot Plug);
– 2 x Ultra M. 2 (PCI Express x4 Gen 3/SATA 3), capacity up to 32 GB/s ports (both ports support drive types 2230/2242/2260/2280/22110).
Controller ASMedia ASM1061:
– 2 × SATA 3 bandwidth of up to 6GB/s (support NCQ, AHCI and Hot Plug)
Network
interface
Dual NICs Intel Gigabit LAN I219V and I211AT (10/100/1000 Mbit);
protection from lightning and electrostatic discharges (Lightning/ESD Protection);
technology supports Wake-On-LAN Dual LAN with Teaming; energy efficient Ethernet 802.3 az, PXE
Wireless network interface Missing
Bluetooth Missing
Audio 7.1 channel HD audio Realtek ALC1220:
– the ratio of “signal to noise” on the linear audio output 120 dB, and on the linear input 113 dB;
– Japanese audio capacitors of Nichicon Fine Gold Series;
– built-in headphone amplifier TI NE5532 Premium with output to front panel (support headphones with impedance up to 600 Ohms);
insulation audiosony on the PCB Board;
– left and right audio channels located in different layers of the PCB;
– protection against power surges;
– 15-micron gold-plated audio jacks;
– supports Premium Blu-ray audio;
– support technology Surge Protection and Purity Sound 4;
– supports DTS Connect
USB interface Intel X299 Express:
– 6 ports USB 3.1 Gen1 (4 on back panel, 2 are connected to the connector on the Board);
– 6 USB 2.0 ports (2 on back panel, 4 ports to the two connectors on the Board).
Controller ASMedia ASM3142:
– 2 ports USB 3.1 Gen2 (Type-A and Type-C on the rear panel);
Controller ASMedia ASM3142:
– 1 port USB 3.1 Gen2 (Type-C front panel)
Connectors and buttons on the rear panel 2 USB 2.0 ports and a combo PS/2 port;
BIOS Flashback button;
Clear CMOS switch;
2 port USB 3.1 Gen1;
2 port USB 3.1 Gen1, and network LAN-socket RJ-45;
2 port USB 3.1 Gen2 (Type-A + Type-C) and network LAN-socket RJ-45;
optical S/PDIF output;
5 jacks (Rear Speaker / Central / Bass / Line in / Front Speaker / Microphone)
Internal connectors on the system Board 24-pin power connector high density EATX;
8-pin power connector high density ATX 12 V;
4-pin power connector high density ATX 12 V;
6-pin power connector high density ATX 12 V for graphics cards;
8 SATA 3;
2 M. 2;
5 4-pin connectors for hull/CPU fan with PWM support;
2 contact RGB LED;
USB 3.1 Gen1 to connect the two ports;
2 USB 2.0 ports for connecting four ports;
USB 3.1 Gen2 port on the front panel of the housing;
connector TPM;
audio connector for the front panel;
audio connector Right Angle;
connector Virtual RAID On the CPU;
connectors Power LED and Speaker;
the Thunderbolt connector;
a group of connectors for the front panel;
connector Voltage Control;
indicators Dr. Debug;
the power button is illuminated;
reset button (Reset);
reset button (Retry);
button Safe Boot;
Rapid OC buttons;
Menu button;
the PCIe switches ON/OFF;
Post Status Checker (PSC);
switch Slow Mode;
switch LN2 Mode;
connector BIOS B Select
BIOS 2 × 128 Mbit AMI UEFI BIOS with multilingual GUI (SD/HD/Full HD);
support PnP, DMI 3.0; WfM 2.0, SM BIOS 3.0, ACPI 6.1;
the supports Secure Backup UEFI
Corporate functions, technology and exclusive features OC Formula Power Kit:
– 13 Phase CPU Power design + 2 Phase Memory Power design;
– Digi Power (CPU and Memory);
– Dr. MOS;
OC Formula Connector Kit:
– Hi-Density Power Connector (24-pin for Motherboard, 8+4 pin for Motherboard, 6-pin for PCIe Slot);
– 15μ Gold Contact (memory sockets and PCIE x16 slots (PCIE1 and PCIE5));
OC Formula Cooling Kit:
– 8 Layer PCB;
– 2oz copper;
– Heat Pipe Design;
OC Formula Monitor Kit:
– Multi Thermal Sensor
ASRock Super Alloy:
– XXL aluminum radiator;
– Premium 60A Power chokes Choke;
– 60A Dr.MOS;
– premium memory capacitors;
capacitors Nichicon 12K Black (100% Japan made polymer capacitors high quality and conductivity);
black frosted printed circuit Board;
– High Density Glass Fabric PCB;
ASRock Steel Slots;
ASRock Ultra M. 2 (PCIe Gen3 x4 & SATA3);
ASRock Ultra USB Power;
ASRock Full Spike Protection (all USB, Audio and LAN);
ASRock Live Update & APP Shop
Operating system Microsoft Windows 10 x64
Form factor, dimensions (mm) ATX, 305 × 244
The warranty of the manufacturer, years 3
The minimum retail price, RUB. 30 700

#Packaging equipment

X299 ASRock OC Formula comes in a big box decorated in strong colours. On the front side no bright eye-catching screen savers and stickers – only the name of the Board manufacturer and the list of supported technologies.

 

On the reverse side of the box you can find a brief listing of the features of the Board and its ports on the back panel, and more information open under flap front panel of the box.

It is already possible to gather almost all the information about the product and also to see a bigger part of the Board through a transparent plastic window.

On the sticker from the end of the box lists the serial number and the batch number, the name of the model and its dimensions, country of origin and weight.

Please note that the Board weighs more than 1.2 kg, it’s really massive and heavy.

Inside of the carton Board is lying on a pallet made of polyethylene foam to which it is pressed against the plastic ties, and top it covers another insert of the same material.

Package Board includes four SATA cables with latches, standard backplate, plug the rear panel, two screws to secure the drives in the slots M. 2, and four connecting bridge for various SLI configurations.

The documentation Board is equipped with two types of instructions that contain sections in Russian, the Bulletin supported processors, ASRock card, CD with drivers and proprietary utilities.

X299 ASRock OC Formula is accompanied by a three year warranty. As for the cost, in Russia the fee can be purchased at a price of 30.7 thousand rubles. In other words, this is one of the most expensive boards, processors design LGA2066.

#Design

Design ASRock OC Formula X299 strict, but at the same time attractive. Colors of the Board are selected in such a way that all its elements, including radiators, in harmony with each other. So when you look at it there is a feeling of serious and high-quality product, and not just another “toy” boards with bright full of details on the PCB.

 

I would like to mention the massive heatsinks on the VRM cooling circuits of the processor is connected with a heat pipe. In the same style with them decorated the radiator of the chipset, which caused the name of the Board model.

 

Add that X299 ASRock OC Formula made in the form factor ATX and has dimensions of 305 × 244 mm.

A large area of the back panel is ribbed end of the second section of the radiator. Obviously, due to such a simple solution the developers sought to increase the efficiency of cooling elements VRM. The specs of the Board stated that the radiator can remove elements from the VRM up to 450 watts of thermal power.

Despite this fact, all the necessary ports on the rear panel. Among them, eight USB 3.1 Gen2 including the PS/2 port, button, BIOS Flashback and Clear CMOS, two network sockets, optical output and 5 audio outputs. Plug here not built in, like some other flagship motherboards.

Of the cover parts on ASRock OC Formula X299 radiators only, no plastic housing with backlight. The radiators are fastened with screws, therefore, be removed easily. Here is the Board without them.

Like other flagship models from ASRock, X299 OC Formula uses an eight-layer PCB of high density, more resistant to thermal stress and humidity. In addition, it doubled the thickness of the copper layers, which should positively affect the heat distribution.

The main advantages of the ASRock, which we will examine in the article below.

To further study the arrangement of elements on the PCB will help the scheme with the table of the instruction manual.

 

In the CPU socket LGA2066 X299 ASRock OC Formula contact needle sputter-coated from a 15-micron layer of gold. According to the developers, such a coating contributes to the increased resistance of the needles to corrosion and increase the number of times you can remove and replace the processor without deterioration of contact with them (especially for overclockers). In addition, the center of the connector there is a hole for installation under the CPU temperature sensor.

Currently, the fee supports 17 models of Intel processors, released in design LGA2066.

Stated that the power circuit of the CPU built in the 13-phase scheme, which uses the Assembly Dr. MOS, durable capacitors Premium 60A Power Choke and Nichicon 12K. The total capacity of the CPU power circuit declared at around 750 A.

 

But her closer inspection, it turns out that directly to the processor there are 12 phases, and another involved in VCCSA (right hand throttle in the photo marked TR30) and VCCIO. On the reverse side of the PCB with soldered IC-doubles on the use of spoken and application of the seven phase controller ISL69138.

In addition, the X299 ASRock OC Formula has an external clock – BCLK Hyper Engine III, implemented by a microprocessor ICS 6V41742B.

It should help to achieve better overclocking results on the BCLK frequency and to provide precision installation.

For nutrition fee gave four connectors. They include the standard 24 – and 8-pin and additional 4-pin for CPU and memory. Well, six-pin connector which should be connected if charge installed four graphics cards.

 

All power connectors, the Board uses the contact needle of high density.

The number of slots of RAM on ASRock OC Formula X299 reduced from eight to four, and the maximum supported memory DDR4 reduced from 128 to 64 GB. This approach engineers the ASRock understandable and justified, since overclockers on platforms with LGA2066 rarely uses all eight slots, and four modules to achieve a more impressive memory overclocking is much easier than eight. Slots located in pairs on both sides of the CPU socket, all the contacts within them are covered with 15 micron layer of gold.

Frequency modules can reach 4600 MHz, and support for XMP (Extreme Memory Profile) 2.0 standard will simplify the achievement of this indicator, the benefit of DDR4 kits with this nominal frequency is already available. By the way, on the company’s website published lists of certified for this card sets of RAM, including therefore the memory with a frequency of 4600 MHz (G. Skill F4-4600CL19D-16GTZKKC). We add that the power supply system of each pair of dual channel slots.

PCI Express slots on the ASRock OC Formula X299 seven, with five of them, made in the form factor of x16, have a metal shell that further emphasizes these slots and shielding their contacts from electromagnetic radiation. In addition, in the first and fifth reels well as the contacts inside are gold plated layer with a thickness of 15 µm.

When installed on the processor Board 44 with a PCI-E supported the creation of the multiprocessor graphic configurations with four graphics cards for GPU AMD or NVIDIA in the mode x8/x8/x8/x8, and two video cards will work in conjunction full speed x16/x16. In turn, with a CPU with 28 PCI-E can work four graphics cards on AMD GPU in the mode x8/x8/x8/x4 or three on the NVIDIA GPU in the mode x8/x8/x8 and two cards will always work in mode x16/x8. Finally, when you install a processor Board with 16 PCI-E will be available modes are x16 or x8/x8.

For the distribution of PCI-E on the Board meets a huge array of multiplexers NXP supplies (22), part of which is located on the opposite side of the PCB.

Additionally commutes the PCI-Express controller ASM1184e production ASMedia.

To the periphery of the PCB has one slot PCI Express 3.0 x4 slot with an open end and a single slot PCI Express 2.0 x1.

Crystal Express chipset Intel X299 contact with the heatsink via thermal pads and nothing special.

Is it only possible to note that the PCB Board exactly on the perimeter of the chipset is soldered 19 LEDs RGB-lighting.

Board is equipped with from eight SATA 3 ports, six of which are implemented by the chipset Intel Express X299. It supports the creation of RAID-arrays levels 0, 1, 5, 10 and Intel Optane Memory 15 Intel Rapid Storage, Intel Smart Response, NCQ, AHCI and Hot Plug.

Two additional ports are implemented by controller ASMedia ASM1061. The meaning of their presence on the Board aimed at overclocking, we are not clear.

X299 ASRock OC Formula gave two-port Ultra M. 2 with a capacity of up to 32 Gbit/s, both support drives with PCI Express x4 Gen 3 and SATA 3.

The length of the drives in both ports can be any (from 30 to 110 mm), but the drawback is the radiators are absent, although the problem of overheating of high-speed SSD and decrease their performance today is quite acute.

Continuing the theme drives note the presence on the Board of the connector Virtual RAID On CPU (VROC1).

It is designed to create Hyper-speed RAID-arrays NVMe SSD connected directly to the processor.

15 total number of USB ports to eight external and seven internal. Six ports are USB 3.1 Gen1: four displayed on the rear panel and two are connected to an internal connector on the Board. Another six ports are USB 2.0: two displayed on the rear panel and four connected to two internal connectors on the motherboard.

All of these ports are implemented by the chipset. Two additional controller ASMedia ASM3142 allowed to add three high-speed USB 3.1 Gen2 throughput to 10 Gbps.

Two such port can be found on the rear panel (connectors Type-A and Type-C) and another port located on the PCB and is intended for connecting a cable from the front panel of the system unit. In General, the number of USB ports and their distribution on ASRock OC Formula X299 can be called perfect.

The Board was equipped with two Gigabit network controllers: Intel WGI219-V and Intel WGI211-AT.

Both controllers and their connectors are protected against lightning and electrostatic discharges (Lightning/ESD Protection), and supports Wake-On-LAN Dual LAN with Teaming and energy-efficient Ethernet 802.3 az.

Despite the obvious overclocking focus X299 ASRock OC Formula, the sound of her given due consideration. The basis of the sound channel lies popular 7.1 channel audio codec Realtek ALC1220.

To increase the purity of the sound, it added Japanese audio capacitors of Nichicon Fine Gold Series and headphone amplifier TI NE5532 Premium with output to front panel (support headphones with impedance up to 600 Ohms).

In addition, left and right audio channels located in different layers of the PCB, and the whole area of the audio components are separated from the rest of the Board non-conductive strips.

Such hardware optimization, according to the developers, allowed to achieve the ratio of “signal to noise” on the linear audio output 120 dB, and on the linear input 113 dB. At the software level they are complemented by technology Purity Sound 4, DTS Connect, Premium Blu-ray audio, Surge Protection and DTS Connect.

Monitoring and fan control on the Board vested immediately to two controllers Super I/O Nuvoton NCT6683D and NCT6791D.

 

In addition, on the reverse side of the Board soldered two extra controller Winbond W83795ADG.

Each controller can monitor up to 21 voltages, 8 fans and 6 temperature sensors. But it is strange that on the Board we can only find 5 connectors to connect and control the fans via PWM or voltage. In our opinion, for a motherboard of this class and orientation of these connectors should not be less than seven.

But motherboard is equipped with a comprehensive set of overclocking buttons and switches, and four diagnostic LEDs.

In addition, on the bottom edge of the PCB has an indicator POST-codes, which you can use to determine the cause of the loading error or system failure.

X299 ASRock OC Formula contains two 128-bit BIOS.

Switching between primary and backup microchip implemented the good old jumper. Will add that updating the BIOS can be used the BIOS Flashback button on the rear panel of the Board. And it does not require any CPU, no RAM, no graphics card — only the Board itself when the USB drive with FAT32 file system and update the BIOS.

As we mentioned above, the Board highlighted area of the chipset. The illumination color and its mode of operation are configured in the BIOS and in the corporate application ASRock RGB LED.

To extend the backlight for the whole system block will help two RGB connector, to which you can connect led strip to limit current 3 And each length is two meters.

Cooling of the circuit elements of the VRM on ASRock OC Formula X299 implemented two massive radiators, connected by heat pipe. Remote radiator goes on the backboard, and further is cooled by external air flow.

On a barely heated the chipset installed flat aluminum heatsink with thermal pad.

SOURCE

Advertisement
Code: VZWDEAL. Enter this coupon code at checkout to get $100 discount on Samsung Galaxy Note 8. Includes free shipping. Restrictions may apply. Device payment purchase required.
Samsung J7 V just $5 mo. New device payment purchase req'd. Plus, free shipping.
Continue Reading
Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *

PC / Laptop

Microarchitecture Zen 2: that’s why we are waiting for Ryzen 3000

Advertisement
Click this link to get the Moto Z2 Force for just $31.50/month. Unlimited and device payment activation required. Includes free shipping. Restrictions may apply.

In two weeks we, apparently, expecting a miracle. Such a conclusion can be made, if to summarize all the assumptions expressed by the user in anticipation of the upcoming announcement of Ryzen processors of the third generation. But even the most bold statements about that in the second half of the year in the market of processors for PC we will see a change of leader (in performance), has not been entirely groundless. At the beginning of the year, at CES 2019, AMD promised that its next-generation processors will increase specific performance (at constant frequency) at least 15 %. And now we have learned that this will make a noticeable increase in clock frequencies, dramatically increasing the number of cores and reduced heat dissipation.

Each of these promises separately, it seems at least very brave. But all at once?! However, all this is possible. Held in the framework of the exhibition E3 2019 special event Next Horizon, AMD explained in detail how it happened that the microarchitecture Zen 2, which originally was supposed to be a trivial translation of Zen on the rails 7-nm process technology, could be a real breakthrough, having the chance to turn the whole CPU market.

Since the release of the first processor microarchitecture Zen took a little over two years. During this time, AMD has managed to release the intermediate generation microarchitecture, Zen+. However, we saw almost no improvement. The essence of the past the updates were actually reduced to a transition from 14-nm to 12-nm production technology, and only. New microarchitecture Zen 2 meeting which awaits us in July, again implies a change in the manufacturing process — from 12 nm to 7 nm with a simultaneous change of production-contractor: now CPU, the company will produce not GlobalFoundries, and TSMC. But that’s not all: along with the process technology changes dramatically and a lot of other things.

To understand how Ryzen 3000 will be unlike their predecessors, just look at any photo of these processors with the removed heat-dissipating cover. One glance is enough to understand that AMD are moving away from the use of monolithic semiconductor crystal. The kernel they are distributed across multiple semiconductor crystals – capleton, some chiplet will be submitted and all the controllers I / o. It should be added that simultaneously with the introduction of radical changes in the construction of AMD reworked the internal structure of the cores and made sure to address the major bottlenecks of previous CPU microarchitecture Zen and Zen+.

In addition, with the advent of Ryzen 3000 changes will affect the whole ecosystem in which to operate such processors. Compatibility of new products with traditional Socket AM4 with it will remain, but completely all their benefits may be felt only in the newer motherboards that will support PCI Express 4.0.

All the numerous improvements and optimizations made in the new generation Zen 2, clearly deserve more than a mere enumeration. Therefore, following the event, AMD’s Next Horizon, which is able to be the representative of our website, we decided to prepare a separate detailed material and elaborate on why the Zen 2 is really cool.

#7 nm technology is the key to everything

The goals set by the company AMD while working on a new microarchitecture Zen 2, was quite evident. The main objective was to improve the performance of processors for both the desktop and server segment, with the compulsory preservation of continuity and compatibility with existing platforms. In other words, it was about the future scalability of existing CPU families Ryzen and EPYC comprehensive and improving their consumer qualities.

A solid Foundation for the design of a Zen 2 was to adapt the new process. In the transition from 14 – to 12-nm standards, which occurred in April last year, processors Ryzen only slightly won the clock frequency and was able fairly to slightly increase its specific capacity. But a new process technology with a resolution of 7 nm was supposed to catalyze a much more significant progress in improving the whole set of consumer characteristics. Due to the fact that long-standing manufacturing partner AMD, GlobalFoundries, abandoned the development of the 7-nm technology, the chip maker had to shift to cooperation with TSMC. And in the end, AMD has made the right decision. Speaking in favor of this number: the basic CPU building block — Quad-complex CCX (Core Complex) with L3-cache 8 GB MB — the production of 12-nm GlobalFoundries, had an area of 60 mm2. A similar complex Zen 2 enhanced with four cores and twice more capacious, 16-megabyte L3-cache, manufactured on TSMC for 7-nm process, occupies almost half the area of 31,3 mm2.

The total CPU crystal (chiplet) Zen 2, as before, is formed of two CCX. That is, it contains eight cores and a cache memory of the third level capacity of 32 MB. The total area of such crystal is only 74 mm2, which is significantly less than 213 mm2, which is the processor chip design, Zen/Zen+, for example, the same Ryzen 7 2700X. Such a noticeable gain in density of transistors has opened the doors for developers AMD opportunities for the improvement of the microarchitecture, which could be carried out without any substantial damage for the cost of the new processors.

At the beginning of this year, AMD announced that the microarchitecture Zen 2 will provide a 15 percent performance advantage compared to the Zen+ due to one only micro-improvements, that is, at the same clock frequency. However, a lot of advantages given and new advanced semiconductor process. For example, at identical energy consumption for Zen 2 promised at least 1.25 times higher performance than predecessors, and with the same performance, the new processors should be almost twice cheaper. Furthermore, AMD does not hesitate even to say that in some situations the advantage of the new processors Zen 2 will be more than 75% compared with the previous Zen+ of the same class and more than 45 % compared to the equivalent solutions of a competitor.

Of course, all these calculations have yet to be be tested independent tests and reviews, which will be released July 7. In the framework of the event AMD is actively operated indicators Cinebench R20, which suggests that if you compare the Zen 2 and Intel with the same number of cores, the AMD wins as single-threaded and multi-threaded performance and power consumption and price.

Just one example: according to AMD, senior Ryzen 3800X OCTA core 7 with a price of $400 is very close to a 500 dollar eight-core Core i9-9900K in single-threaded and multithreaded rendering, but its power consumption is comparable with the consumption of Core i7-9700K.

#Kernel Zen 2: “tik” and “tak” at the same time

According to the original plan, microarchitecture Zen 2 was supposed to be a simple transference of the old Zen design to new process technology. But later, analyzing the weaknesses of its first generation of processors Zen and Zen+, AMD engineers decided to bend and the underlying microarchitecture. And I must say, this plan apparently worked perfectly. Despite the fact that in Zen 2, there are no drastic alterations, the increase in IPC (average number of executed per cycle instructions) by 15 % — a perfect illustration of the fact that everything was done correctly.

At the same time, you need to understand that Zen 2 — microarchitecture very similar to the original Zen/Zen+. All the basic elements of a processor core remained unchanged, and the alterations relate only to improve the efficiency of existing function blocks. Accordingly, the internal configuration of the kernel has not changed: it is able to decode up to four instructions and execute up to six instructions per clock. In addition, remained unchanged support SMT technology: each core Zen 2 can execute two threads simultaneously.

What has changed? As usually happens when working on the refinement of existing microarchitectures, the first place of application of forces engineers unit fetching instructions and predicting transitions. However, the changes are not very obvious, because the basis of this unit continues to lie “neural” algorithm based on the perceptron. Although in General this scheme does not give very impressive results when working with a buffer the objectives of the branch of the first level it provides good energy efficiency, therefore, hence, to abandon it and just added more multi-stage statistical mechanism TAGE (Tagged geometric) working with buffer purposes of branching the second level.

At the same time was increased and the size of the buffer goals of the branch. Table of first level in Zen 2 includes 512 entries instead of 256, and the second level – 7K instead of 4K records. With regard to the zero level, the corresponding buffer, as before, includes 16 entries, but an array of addresses of indirect transitions has expanded to 1K entries. In other words, the new microarchitecture transitions are predicted clearly better than the original Zen/Zen+. This means that situation when the processor needs to completely reset the Executive pipeline because of the incorrectly predicted transition will happen much less frequently.

Another improvement is the Zen 2 was the fact that AMD decided to significantly reallocate resources to caching instructions. The micro-operation cache that stores already-decoded x86 instructions has been doubled to 4096 entries. This classic statement cache of the first level, which keeps the team prior to their decoding, on the contrary, decreased. While the earlier volume was 64 KB, with 4-channel associative, Zen 2, he was cut to 32 Kbytes, while increasing the degree of associativity to 8.

Simulations of AMD, demonstrated that such changes have a positive impact on performance. And judging by what happened to the growth of the IPC, it really is. Interestingly, as a result of changes in the size of the cache memory, the Zen 2 become the processor with the largest cache micro-operations. For example, in the Skylake microarchitecture this cache is 1.5 To operations, while at the Sunny Cove Intel engineers just extended it to 2.25 To operations.

Changes in the input part of the Executive pipeline does not entail any significant changes in the organization of the work of planners. As before, the Zen decoder 2 is able to supply four instructions per clock cycle together with the cache micro-operation, which can do up to eight related instructions, they fill a queue of micro-operations from which the user choose two schedulers: one for integer operations and another for operations with floating point numbers. In this case the integer scheduler can submit to the execution of six micro-operations per clock, and veselinovsky – four.

But a noticeable change in the microarchitecture occurred at the stage of execution of instructions. If to speak about the execution of integer instructions, here — bargain to increase the size of the buffers (like the scheduler, so the register file and reorder buffer) by about 10-15 % — there are additional generating block addresses (AGU). In sum, it means that the number of Executive ports in the Zen 2 has increased from six to seven: four ports for arithmetical and logical operations (ALU) and three port – operations for generating addresses (AGU). As a result, the microarchitecture Zen 2 can initiate two 256-bit reads and one 256-bit write operation every clock cycle. Last version of micro was, for obvious reasons, is limited to only two such operations per clock, and only a width of 128 bits.

But more importantly, in Zen 2, AMD has doubled the throughput of the block floating point operations. He was now fully 256-bit, which means the possibility of direct enforcement AVX2 instructions. In the original architecture of Zen/Zen+ such teams, working with 256-bit registers, before executing crashed onto a pair of 128-bit instructions and were processed in two steps, therefore, from Zen 2 you can expect a doubling in the pace of work with AVX2 code. The execution units in the FPU remained old. There are two devices for the operations of addition and two of multiplication that gives Zen 2 the ability to simultaneously execute two 256-bit FMA-team. There is a very useful ability, a new microarchitecture to initiate a 256-bit forwarding operations data: as a result, the performance of the AVX2 code can occur without any delay. Moreover, in Zen 2 AMD was able to ensure that the processing of AVX2 instructions can be carried out without any reduction in clock frequency, as is the case in Intel.

Along the way, AMD reported that it was able to increase the speed of the multiplications of floating point numbers from four to three cycles. Ultimately, this also contributes to increase the performance of processors with a new microarchitecture.

As follows from the above, microarchitecture Zen 2 was a bit “wider” Zen in the sense of ability of parallel execution of instructions. But at the same time she became “wider” in the sense of working with data. Although the subsystem of the cache memory, a data not structurally changed, she got a bus with more capacity, which allow to obtain the necessary data, without delaying the implementation of AVX2 commands. More specifically, it means that L1 data cache retained size 32 KB per core 8 way set associativity, and the L2 cache, as before, has a volume of 512 KB per core 8 way set associativity, but now the cache can handle two 256-bit reads and one 256-bit write operation per clock cycle at level L1, and one 256-bit read and write per clock cycle at the L2 level. The latency of the cache memory has not changed and is 4 cycles for L1 and 12 clock cycles for L2.

Despite the immutability of the structure of the cache memory, the Zen 2 was improved L2 TLB (buffer address translation). In the first generation of processors Zen the size of this table was 1.5 K, now it increased to 2K, and the latency at the same below. But most importantly, now the L2 TLB supports page 1 Gbyte, which in previous versions of the microarchitecture had not been implemented.

Another notable change in the Zen 2 was the doubling of the size of the cache memory of the third level. In new processors of its size is not 8, but 16 MB on each Quad CCX. So AMD tried to compensate for the dismemberment of the processor into several independent crystals. Developers Zen 2 believe that the growth in the volume of L3 cache will reduce the amount of data transfer between the chipset core and capleton with the memory controller. Maybe so, but do not forget that the increase of the cache memory is almost always accompanied by an increased latency. And she had L3 cache in the Zen 2 is really increased to 40 cycles, while in Zen processors L3 cache had a latency of approximately 5 cycles below.

#From the core to the CCX and CCD, and further to the CPU

We have already mentioned that the design of the processors Ryzen 3000 is markedly different from what was arranged all the past Ryzen. However, CCX-complexes collected from the cores 2 Zen exactly the same as before. In one unit CCX merged 4 cores and 16 MB of shared cache in the third level.

CCX pair within the 7-nm semiconductor crystal and generates CPU chipset, received the acronym CCD (Core Complex Die). In addition to cores and caches, in CCD-chiplet also includes a bus controller Infinity Fabric, by which it shall be ensured connection CCD required for any Ryzen 3000 capleton IO.

In coplete input / output (I/O) processors generation Zen 2 are the so-called extra-nuclear components as well as elements of the North bridge and SoC. In it, among other things, the memory controller and bus controller PCI Express 4.0. Also in the I/O coplete implemented and two of the tires Infinity Fabric required for connection with the CCD chipsetati.

Depending on what processor family Ryzen 3000 it is, it can consist of either two or three chipsetov. In processors with eight cores and less used one CCD-ciple and one I/O-chiplet. In processors with cores more than eight CCD-chipsetov becomes two. However, you need to understand that the processor is still a single entity. Due to the fact that in any Ryzen 3000 memory controller is in I/O-Deplete and he is only one, either kernel can smoothly access any of its areas: no-NUMA configurations, which spoiled the lives of the owners of processors Threadripper, in the case of Zen 2 will not.

It is worth mentioning that the Zen 2 is not the first attempt to go to layout multi-chip processors. Previously, manufacturers had resorted to such an approach. For example, was based on two semiconductor crystal Quad-core Core 2 Quad, and before the same technique was used in the creation of a dual core Pentium D. But then the producers still went on to have a monolithic structure processors, as it was more effective as the number of cores and transferring the processor components of the North bridge. However, the new Ryzen 3000, which includes two or three ciplet, – not a step back. On the contrary, it is the transition to the next level because of AMD new generation of processors is not a simple extensive, increasing the number of cores by adding additional crystals and uses a much more intelligent approach, introducing the use of chipley with different features and combining them into a single entity the specialized high-speed bus Infinity Fabric.

The advantages of using a multi-chip layout is quite obvious. First and foremost, it allows you to reduce costs. Production of chipsetov having a relatively small die area, much simpler than the production of large monolithic processor. Smaller crystals not only allow you to obtain a higher yield of chips, but also more effective placed on a circular semiconductor substrate, which further reduces the amount of waste. In the end, it Chipita configuration allowed AMD to create a very complex processors Ryzen 3000 is relatively inexpensive, despite the fact that their production is organized at the facilities of TSMC’s most advanced and new to industry process technology with the norms of 7 nm.

The distribution functions of the processor in various capleton allowed AMD to save money and even in one aspect. New process technology was not necessarily to use in the manufacture of all parts of the processors. “Thin” advanced standards are important to processor cores, because they directly affect the frequency potential and energy consumption, but there is no need to use them to craft more simple chiplet responsible for the functions of input / output. The I/O chiplet Ryzen in 3000 is made the old-fashioned way – in factories GlobalFoundries for 12-nm process used in the manufacture of Ryzen processors of the second generation.

However, you need to keep in mind that Chipita design gives rise to certain difficulties. For example, in modern processors, very high demands are placed on how connect and interact with each other in different parts of the CPU. To implement such a bus when mnogoshipovyh the layout is a bit trickier. However, this problem was solved by engineers of AMD. Processors Ryzen first and second generations, although they were based on monolithic kernel, used for connection the CCX and the memory controller, North bridge and elements of the SoC specialized tyre Infinity Fabric. New Ryzen 3000 processors used the second version of this bus: it is responsible for data transfer between all chipsetati.

Frankly, to how to operate the Infinity Fabric, had previously been well-founded claims: it is not always able to provide the required level of performance when interacting processor cores with L3 cache and memory controller. In processors Ryzen 3000 AMD has tried to correct the main shortcomings of the Infinity Fabric.

First, this bus has been expanded twice: now its width is 512 bits, which means a doubling of the capacity and the transfer of 32 bytes per clock in each direction. The developers claim that this step they went in the first place because of the emergence of Ryzen in 3000 support PCI Express 4.0, but it is obvious that a more productive bus, which connects all key components are CPU, will play a positive role in many other cases.

Secondly, Infinity Fabric is now “unleashed” with the memory controller frequency. Earlier the frequency of this bus was synchronized with the memory clock, which on the one hand, leads to a strong dependence of the performance of processors Ryzen speed assigned to the DDR4 SDRAM, and the other – let overclocking memory above 3466-3600 MHz. Now the tyre Infinity Fabric will be able to work with the memory controller not only synchronous, but less than half relative to the frequency with the use of divider 2:1. It is — at least theoretically — means a much greater freedom in the choice of speed of memory, though AMD continues to insist that the synchronous mode to Infinity Fabric will still provide better performance, and more optimal with Ryzen 3000 to use modules DDR4-3600 with low timings.

However, it is already known that the memory in Socket AM4-systems, processors Ryzen 3000, will do much to disperse.

For example, AMD showed working memory module in the mode DDR4-5100 in the system built on Socket AM4-motherboard MSI MEG X570 Godlike.

SOURCE

Continue Reading

PC / Laptop

Which processor is needed for GeForce RTX 2060 1660 and GeForce GTX Ti: Ryzen vs AMD Intel Core

Advertisement
Click this link to get the Moto Z2 Force for just $31.50/month. Unlimited and device payment activation required. Includes free shipping. Restrictions may apply.

In this article we will talk about what is often called the potential of the GPU, or, to speak more correctly, on processorepiemonte in games. On our website, and in other sources, you can find a lot of reviews of processors and graphics cards that explore the relative performance of different types of CPU and GPU. However, the question of what types of processors and graphics better suited to each other, often remains unanswered. Meanwhile, the buyers are forced to look for the answer on it: having a fixed amount, they should optimally allocate it between the processor and the graphics card, and here on this subject there is a clear shortage of some ready and well-reasoned prescriptions.

It is worth Recalling that during the reign on the market with Quad core processor was a popular theory with the conditional name “the potential revealed”, in which it was assumed that for each card there is a ceiling in processor performance, above which rise does not make sense – all the same frame rates in games then have will not grow. The explanation of this effect was based on the assumption that at some point the card stops to display the time frames with the speed with which they are preparing for her CPU, and at this point you can stop chasing faster CPU – better performance to achieve still does not work.

But later in the manifest fallacy of this theory has convinced many of her followers. The fact that the CPU and GPU in modern games are responsible for different stages of the training image. The CPU handles the reaction of the player, recalculation of internal game logic and behavior of the secondary characters, as well as modeling of the whole game environment and physics of the environment. In addition, one of the most important tasks of the CPU in most games is also flow control and transmission of necessary information to the GPU. The GPU is thus engaged exclusively on visualization based on the data received from the CPU the data it builds a picture, which then appears on the screen. Obviously, this is largely the successive stages of one process, so ultimately the frame rate in any case should affect the power of the graphics card and CPU.

However, this does not mean that by increasing the CPU power, you can compensate for a weak GPU, and Vice versa. The optimal ratio between performance Central and graphics processor exists precisely because these components meet in the games for different things. Therefore, in order to obtain adequate performance of the system and deal with sudden FPS dips, if you have any specific game situations, with its design should seek to maximize the characteristics of both GPU and CPU. The limit here in most cases is allocated for the purchase of the equipment budget, which makes selection of suitable processors and graphics cards in the optimization problem with multiple criteria.

Proponents of the theory of “potential” can bring here the argument that in practice at some point, gaming performance with increasing CPU power to grow almost stops. But, if you do not take into account any exorbitant cases with the installation of ultra-high resolution in which the performance of the SRI securely masked behind a lack of GPU performance, it will be connected not with the fact that above a turn of the performance of the processor becomes quite important. In reality, the fact is that “CPU power” is too abstract and collective term, which many people associate with a model number or price of the chip. In fact, it consists of many factors such as number of cores, clock speed, amount and speed of the cache memory, the speed of the memory controller and so on. More powerful processors better less powerful only for some part of these parameters, while from the point of view of other characteristics of any improvement when driving on the lineup up may not be observed. The result is some of the features in the various families of processors can become a bottleneck, which does not allow them to show higher performance in games, despite the fact that the other options are much better.

A good illustration for the given thesis can be the situation with the gaming performance of the members of the family Ryzen. Even the most senior and the most expensive models of AMD processors almost always give significantly lower frame rate in comparison with what provide offers from Intel, and to fix it until AMD could not increase the frequency or increase number of cores or roomy L3-cache. Performance Ryzen, obviously, depends on some other characteristics such as the speed of the memory subsystem, latency, or inter-core interaction in single-threaded performance. In other words, if the power increase of processors does not increase the number of FPS in games, it’s just talking about what we felt the bottleneck of the architecture and not ran into a limit that is predefined by the system-installed graphics card.

Unfortunately, all these arguments systematically lead us to the conclusion that the selection of a balanced combination of CPU and video card is a very trivial task. After all, no universal table that describes the performance of all possible combinations of configurations of CPU and GPU does not exist in nature. While there was such a fanatical researchers, not frightened would be a huge number of options to be included in such a comparison. And we also do not belong to them. Therefore, under the present experimental material, we will reply only to private question about which processor is better to choose NVIDIA’s latest generation mid – RTX 2060 and GeForce GeForce GTX Ti 1660. And then, if the results of this study will be useful to our audience, we will conduct similar tests and some other common graphics cards.

#Why GeForce RTX 2060 1660 and GeForce GTX Ti

Video card average level is one of the most popular options for use in modern gaming systems. Performance is enough for to run modern games with maximum quality settings in the standard Full HD resolution, which, according to statistics collected by the digital distribution system Steam, choose two-thirds of the total number of players.

It is therefore not surprising that, according to the same statistics, the most popular discrete graphics card is still the GeForce GTX 1060 – a mid-level solution from the previous generation of NVIDIA accelerators. Now replaced Pascal Turing come, and if you start from the positioning, it is 2060 and RTX GeForce GeForce GTX Ti is 1660 should gradually take the place of the most common graphics cards.

It is quite natural that now GeForce RTX 2060 1660 and GeForce GTX Ti are the three accelerators with the fastest growing shares. Only last month the user base of these cards increased by almost 40 %. In absolute terms, the share of owners GeForce RTX 2060 1660 and the GeForce GTX Ti is still not too noticeable, but the background of how a growing number of systems with other graphics cards of the family of Turing, no question remains that these GPUs will soon become the most popular choice of the gamers.

It should be noted that the positions of the GeForce RTX 2060 in this case look a bit better, although this card and a quarter as much. However, buyers apparently willing to pay $70 more for the possession of a special RT-kernel, allows the graphics hardware to accelerate algorithms for ray tracing.

#Optimal processor for GeForce RTX 2060 1660 and GeForce GTX Ti: I advise usually

The lack of detailed and thorough tests of processorepiemonte popular graphics cards has led to the fact that buyers have developed a number of empirical approaches to how to relate spending on basic components of the game system. The most popular rule of this kind suggests that the price of the video card and the price of the processor should be as two to one, that is, in a balanced system the graphics card should be roughly twice as expensive as the CPU.

If you apply this rule to video cards, which we are going to talk about today, that is GeForce RTX 2060 1660 and GeForce GTX Ti with manufacturer’s recommended price of $349 and $279, respectively, it turns out that they need to look for processors that stand about $175 and $140. In the price list Intel for these amounts are available Core i5-and Core i3 9400-9300 and AMD, with a similar budget, you can choose considerably cheapened recently Ryzen Ryzen and 5 2600 5 2500X.

Almost the same recommendations formulated in his “Computer of the month” and our resident expert, Sergey Plotnikov. For several months in optimal Assembly 3DNews uses the GeForce RTX 2060 the system with which it is proposed to install processors Ryzen 5 2600X or Core i5-9400F.

In other words, almost all estimations indicate that for medium level graphics cards need a six-core processor, but not necessarily senior – will go and the easier option. However, convincing illustrations, how fair are the assumptions still did not exist. That’s why we undertook detailed tests GeForce RTX 2060 1660 and GeForce GTX Ti in combination with different processors AMD and Intel. Try to use a practical approach and understand what the CPU is the best choice for medium gaming configurations.

#Description of test systems and test methodologies

To study processorepiemonte GeForce RTX 2060 1660 and GeForce GTX Ti was chosen graphic cards in the performance of the NVIDIA (Founders Edition) and Gigabyte (1660 GTX Ti OC). The tests were conducted in two resolutions relevant to these GPU – 1080p and 2560p. Paired with these video cards we tried to test the widest possible range of processors for platforms LGA 1151v2 and Socket AM4. Therefore, tests were selected for major and minor modifications within each class of CPU that made it possible to gather very heterogeneous and representative company of a variety of Core ninth-generation and second-generation Ryzen with the number of cores from two to eight nominal frequencies from 2.9 GHz to 4.0 GHz and the amount of L3 cache from 4 to 16 MB.

In the end, the list involved in the testing of components were as follows:

  • Processors:
    • AMD Ryzen 7 2700X (Pinnacle Ridge, 8 cores + SMT, 3,7-4,3 GHz, 16 MB L3);
    • AMD Ryzen 5 2600X (Pinnacle Ridge, 6 cores + SMT, the 3.6-4.2 GHz, 16 MB L3);
    • AMD Ryzen 5 2500X (Pinnacle Ridge, 4 cores + SMT, 3,6-4,0 GHz, 8 MB L3);
    • AMD Ryzen 3 2300X (Pinnacle Ridge, 4 cores, 3.5-4.0 GHz, 8 MB L3);
    • Intel Core i9-9900K (Refresh Coffee Lake, 8 cores + HT, 3,6-5.0 GHz, 16 MB L3);
    • Intel Core i7-9700K (Refresh Coffee Lake, 8 cores, the 3.6-4.9 GHz, 12 MB L3);
    • Intel Core i5-9600K (Lake Coffee Refresh, 6 cores, 3.7 V-4.6 GHz, 9 MB L3);
    • Intel Core i5-9400F (Lake Coffee Refresh, 6 cores, a 2.9-to 4.1 GHz, 9 MB L3);
    • Intel Core i3-9350KF (Lake Coffee Refresh, 4 cores, 4.0 to 4.6 GHz, 8 MB L3);
    • Intel Core i3-8100 (Coffee Lake, 4 cores, 3.6 GHz, 6 MB L3);
    • Pentium Gold G5600 (Coffee Lake, 2 cores + HT, 3.9 GHz, 4 MB L3).
  • CPU cooler: Noctua NH-U14S.
  • Motherboard:
    • ASRock X470 Taichi (Socket AM4, AMD X470);
    • ASRock Z390 Taichi (LGA1151v2, Intel Z390).
    • Memory: 2 x 8 GB DDR4-SDRAM 3466, 16-16-16-36 (G. Skill Trident Z RGB F4-3466C16D-16GTZR).
  • Graphics card:
    • NVIDIA GeForce RTX 2060 (TU106, 1365/14000 MHz, 6 GB GDDR6 192-bit);
    • Gigabyte GeForce GTX Ti OC 1660 (TU116, 1500/12000 MHz, 6 GB GDDR6 192-bit).
  • Disk subsystem: Samsung 960 PRO 1TB (MZ-V6P1T0BW).
  • Power supply: Thermaltake Toughpower DPS G RGB Titanium 1000W (80 Plus Titanium, 1000 watts).

All Intel CPUs were tested with enabled Multi-Core Enhancements, that is, without any restrictions on energy consumption. We are aware that this mode is somewhat at odds with the specifications of Intel, but most users Willy-nilly uses the processors that way. The fact is that without exception, all motherboard manufacturers will activate the Multi-Core Enhancements by default, and some even hide the settings to disable it, and any shift in this trend is not expected.

Testing was performed in the operating system Microsoft Windows 10 Enterprise (v1809) Build 17763.503 installed patches against the vulnerabilities of Meltdown and the Spectre, and using the following set of drivers:

  • AMD Chipset Driver 19.10.0429;
  • Intel Chipset Driver 10.1.1.45;
  • Intel Management Engine Interface Driver 11.7.0.1017;
  • NVIDIA GeForce 430.64 Driver.

To check gaming performance of the platforms used the following games and settings:

  • Assassin’s Creed Odyssey. The 1920 × 1080 Resolution: Graphics Quality = Ultra High. The Resolution Of 2560 × 1440: Graphics Quality = Ultra High.
  • Ashes of the Singularity. Resolution 1920 × 1080: DirectX 12, Quality Profile = Extreme. The Resolution Of 2560 × 1440: DirectX 12, Quality Profile = Extreme.
  • Civilization VI: the Gathering Storm. Resolution 1920 × 1080: DirectX 12, MSAA = 4x, Performance Impact = Ultra, Memory Impact = Ultra. The resolution of 2560 × 1440: DirectX 12, MSAA = 4x, Performance Impact = Ultra, Memory Impact = Ultra.
  • Far Cry New Dawn. The 1920 × 1080 resolution: Graphics Quality = Ultra, HD Textures = On, Anti-Aliasing = TAA, Motion Blur = On. The resolution of 2560 × 1440: Graphics Quality = Ultra, HD Textures = On, Anti-Aliasing = TAA, Motion Blur = On.
  • Grand Theft Auto V. the Resolution of 1920 × 1080: DirectX Version = DirectX 11, FXAA = Off MSAA = x4, NVIDIA TXAA = Off, Population Density = Maximum Population Variety = Maximum Distance Scaling = Maximum Texture Quality = Very High, Shader Quality = Very High, Shadow Quality = Very High Reflection Quality = Ultra, Reflection MSAA = x4, Water Quality = Very High Particles Quality = Very High, Grass Quality = Ultra, Soft Shadow = Softest, Post FX = Ultra In-Game Depth Of Field Effects = On Anisotropic Filtering = x16 Ambient Occlusion = High, Tessellation = Very High, Long Shadows = On, High Resolution Shadows = On, High Detail Streaming While Flying = On, Extended Distance Scaling = Maximum Extended Shadows Distance = Maximum. The resolution of 2560 × 1440: DirectX Version = DirectX 11, FXAA = Off MSAA = x4, NVIDIA TXAA = Off, Population Density = Maximum Population Variety = Maximum Distance Scaling = Maximum Texture Quality = Very High, Shader Quality = Very High, Shadow Quality = Very High Reflection Quality = Ultra, Reflection MSAA = x4, Water Quality = Very High Particles Quality = Very High, Grass Quality = Ultra, Soft Shadow = Softest, Post FX = Ultra In-Game Depth Of Field Effects = On Anisotropic Filtering = x16 Ambient Occlusion = High, Tessellation = Very High, Long Shadows = On, High Resolution Shadows = On, High Detail Streaming While Flying = On, Extended Distance Scaling = Maximum Extended Shadows Distance = Maximum.
  • Hitman 2. Resolution 1920 × 1080: DirectX 12, Super Sampling = 1.0, Level of Detail = Ultra, Anti-Aliasing = FXAA, Texture Quality = High Texture Filter = Anisotropic 16x, SSAO = On, Shadow Maps = Ultra Shadow Resolution = High. The resolution of 2560 × 1440: DirectX 12, Super Sampling = 1.0, Level of Detail = Ultra, Anti-Aliasing = FXAA, Texture Quality = High Texture Filter = Anisotropic 16x, SSAO = On, Shadow Maps = Ultra Shadow Resolution = High.
  • Kingdom Come: Deliverance. Resolution 1920 × 1080: Overall Image Quality = Ultra High. The Resolution Of 2560 × 1440: Overall Image Quality = Ultra High.
  • Metro Exodus. Resolution 1920 × 1080: DirectX 12, Quality = Ultra, Texture Filtering = AF 16X, Motion Blur = Normal, Tesselation = Full, Advanced PhysX = Off, Hairworks = Off, Ray Trace = Off, DLSS = Off. The resolution of 2560 × 1440: DirectX 12, Quality = Ultra, Texture Filtering = AF 16X, Motion Blur = Normal, Tesselation = Full, Advanced PhysX = Off, Hairworks = Off, Ray Trace = Off, DLSS = Off.
  • Shadow of the Tomb Raider. Resolution 1920 × 1080: DirectX12, Preset = Highest, Anti-Aliasing = TAA. The resolution of 2560 × 1440: DirectX12, Preset = Highest, Anti-Aliasing = TAA.
  • The Witcher 3: Wild Hunt. The 1920 × 1080 Resolution: Graphics Preset = Ultra Postprocessing Preset = High. The Resolution Of 2560 × 1440: Graphics Preset = Ultra Postprocessing Preset = High.
  • Total War: Warhammer II. Resolution 1920 × 1080: DirectX 12, Quality = Ultra. The Resolution Of 2560 × 1440: DirectX 12, Quality = Ultra.
  • Watch Dogs 2. The 1920 × 1080 resolution: Field of View = 70°, Pixel Density = 1.00, Graphics Quality = Ultra, Extra Details = 100%. The resolution of 2560 × 1440: Field of View = 70°, Pixel Density = 1.00, Graphics Quality = Ultra, Extra Details = 100%.
  • World War Z 1920 × 1080: DirectX 11, Visual Quality Preset = Ultra. The Resolution Of 2560 × 1440: DirectX11, Visual Quality Preset = Ultra.

In all gaming tests as the outcome is the average number of frames per second and the 0.01-quantile (first percentile) for the values of FPS. The use of 0.01-quantile instead of the minimum FPS due to the desire to clear the results from the random bursts of productivity that was triggered not directly associated with the operation of the main components of the platform causes.

SOURCE

Advertisement
Samsung J7 V just $5 mo. New device payment purchase req'd. Plus, free shipping.
Available in blue, yellow, pink, and green, this convenient speaker comes with a suction cup to stick to the walls of your shower and is completely waterproof! The speaker features Play/Stop, Call/End Call, Next, Back and Power buttons so you can easily control your phone outside the shower from ins
Continue Reading

PC / Laptop

Overview of ASRock Z390 Steel Legend: simplicity is not to the detriment of

Advertisement
Code: VZWDEAL. Enter this coupon code at checkout to get $100 discount on Samsung Galaxy Note 8. Includes free shipping. Restrictions may apply. Device payment purchase required.

Until April this year, the company ASRock has released 15 motherboard on chipset Intel Express Z390. One of them was as advanced level pattern Z390 Taichi Ultimate, and very simple and affordable kind of Z390 Pro4. In other words, fans of ASRock to pick up cost according to the specifications, form factor and the wallet did not work. However, in mid-April, the company announced a new model – ASRock Z390 Steel Legend, part of a series of “Steel of legends”, where now there are three boards, two of which are based on chipset Intel B450.

The company is positioning the boards in this series as the basis for gaming systems, since these products have improved reliability, improved cooling and is based on durable components. This warranty period is still limited to three years rather than five, as the products of competitors with similar positioning. Let’s see, why do we need ASRock Z390 Steel Legend, and to whom it is interesting?

#Specifications and cost

Supported processors Intel Core i9 / Core i7 / Core i5 / Core i3 / Pentium / Celeron
performed LGA1151v2 eighth and ninth generation microarchitecture Core
Chipset Intel Z390 Express
Memory subsystem 4 × DDR4 DIMM UN-buffered memory up to 128 GB;
dual channel mode memory;
support modules with frequency of 4266(O. C.)/4133(O. C.)/4000(O. C.)/3866(O. C.)/3800(O. C.)/
3733(O. C.)/3600(O. C.)/3200(O. C.)/3000(O. C.)/2933(O. C.)/2800(O. C.)/2666/2400/2133 MHz;
modules support for ECC UDIMM memory (does not work in ECC);
15-micron gold-plated contacts in the connectors;
support for Intel XMP 2.0 (Extreme Memory Profile)
GUI The integrated graphics core processor allows you to use the HDMI port is version 1.4 and Display Port version 1.2;
supports resolutions up to 4K inclusive (4096 × 2304 at 60 Hz);
supports Auto Lip Sync, Deep Color (12bpc), xvYCC and HBR (High Bit Rate Audio) via HDMI 1.4 Port (you need a compatible HDMI monitor is required);
support for the HDCP 2.2 with HDMI 1.4 and DisplayPort 1.2 Ports
Connectors for expansion boards 2 PCI Express 3.0 x16 modes x16, x16/x4;
3 PCI Express x1 slots, Gen 3
The scalability of the video AMD 2-way CrossFireX Technology
The storage interface Intel Z390 Express:
– 6 × SATA III throughput up to 6 Gbps (supports RAID 0, 1, 5 and 10, Intel Rapid Storage Technology 16, NCQ, AHCI and Hot Plug);
– 2 x Ultra M. 2, bandwidth of each up to 32 GB/s (both connectors support SATA and PCI Express drives, М2_1 length from 30 to 110 mm, М2_2 length from 30 to 80 mm);
– support Intel Optane Memory
Network
interfaces
Intel Gigabit LAN I219-V (10/100/1000 Mbps):
– supports Wake-On-LAN;
– protection from lightning and electrostatic discharges;
– supports energy efficient Ethernet 802.3 az;
– supports PXE
Audio 7.1 CH HD audio codec Realtek ALC1220:
– supports Premium Blu-ray audio;
– protection against power surges;
audio capacitors Nichicon Fine Gold Series;
– 110dB SNR DAC with Differential Amplifier;
– insulation of the printed circuit Board;
– separate layers on the PCB for the left and right channel;
gold – plated audio plugs
USB interface Intel Z390 Express:
– 5 USB 2.0/1.1 ports (2 on back panel, 3 connected to the connectors on the system Board);
– 6 ports USB 3.1 Gen 1 (2 on back panel, 4 connected to the connectors on the system Board);
– 2 ports USB 3.1 Gen 2 (rear panel, Type-A and Type-C).
All ports are protected against electrostatic discharges.
Connectors and buttons on the rear panel Two port USB 3.1 Gen 1 and a combined PS/2 port;
the HDMI and DisplayPort;
single port USB 3.1 Gen 2 Type-A and one USB 3.1 Gen 2 Type-C;
two USB 2.0/1.1 network LAN-socket RJ-45 with led (ACT/LINK LED and SPEED);
optical S/PDIF output interface;
five 3.5-mm 15-mm gold-plated audio connectors
Internal connectors on the PCB 24-pin ATX power connector;
8-pin ATX 12V power;
6 SATA 3;
2 M. 2;
4-pin connector CPU fan with PWM support power up to 1A (12 W);
4-pin connector for pumps DLC power up to 2A (24 W);
3 4-pin connectors for case fans with PWM support;
connector for addressable RGB LED-lines;
2 connector for RGB LED-lines;
a group of connectors for the front panel;
audio connector for the front panel;
SPI connector TPM;
COM connector;
the power led and speaker connector;
Thunderbolt AIC connector (5-pin);
2 USB 2.0/1.1 connection 3 ports;
2 USB 3.1 Gen 1 for connecting 2 ports
BIOS 128 Mbit AMI UEFI BIOS with multilingual interface and the graphical user interface;
ACPI 6.0 wake-up;
support SM BIOS 2.7;
DRAM, PCH 1.0 V, VCCIO, VCCST, VCCSA, VPPM
Controller I/O iTE I/O Controller Chip IT8688E
Corporate functions, technologies and features ASRock Super Alloy:
– XXL aluminum radiator;
– chokes Premium 60A Power Choke;
capacitors Nichicon 12K Black (100% Japan made polymer capacitors high quality and conductivity);
– shaped PCB Design;
black frosted printed circuit Board;
– High Density Glass Fabric PCB;
Technology ASRock Intel POOL (Planes on Outer Layers);
Steel socket ASRock;
ASRock Full sized radiator for M.2;
ASRock Ultra M. 2 (PCIe Gen3 x4 & SATA3) ASRock andthe indicator POST of the codes;
ASRock Full Spike Protection (all USB, Audio and LAN);
ASRock Live Update & APP Shop
Form factor, dimensions (mm) ATX, 305 × 244
Operating system support Windows 10 x64
The warranty of the manufacturer, years 3
The estimated retail value for you! ~10 000

#Packaging equipment

ASRock Z390 Steel Legend comes in a very large cardboard box, decorated mostly in dark colors. The front side of the package contains only the name of the Board and icons of supported technologies.

 

The reverse side talks about the key features of the product, there you can find the brief characteristics of the Board.

Inside colored sheath inserted box of cardboard, where the pallet is made of polyethylene foam fixed fee, additionally sealed in antistatic bag. On the bottom of the box there were a few screws in the bag, the cover on the rear panel, one SATA cable and instructions with DVD.

 

Of course, any bonuses are not included, since the Board belongs to the budget class and will cost about $ 150, or about ten thousand rubles at the current rate. Warranty – three years.

#Design and features

ASRock Z390 Steel Legend performed at almost black PCB on the front side of which there are three silver radiator. No plastic casings here, which can not but rejoice. The reverse side of the Board, by and large, is empty, which once again confirms its modest budget level.

 

Aluminum radiator large area for power supply circuits of the processor modeled by the casing, so it looks quite original. Echoes and chipset combined with a plate heat spreader of the second M. 2 port. Coupled with another heat sink at the first M. 2, these elements give the Board a modern and even to some extent aggressive look.

 

The elements of design can be attributed to the inscription STEEL LEGEND at the edge of the PCB, which gets highlighted along with the logo of the series.

We add that the dimensions ASRock Z390 Steel Legend are 305 × 244 mm, that is, it refers to the standard ATX.

The particular location of the motherboard components on the PCB shown in the diagram from the instruction manual.

 

On the interface panel displayed only a basic set of connectors. Here you can find a combo PS/2 port, video outputs HDMI and DisplayPort, network LAN-socket, six USB and audio outputs.

To the left there is a mounting bracket for antennas of the wireless communication module, although the module included with the cost there, but the connector for it M. 2 (Key E) in the center of the Board is present — it allows you to set module 2230 WiFi/BT and Intel CNVi.

Despite the low price of the Board, all the radiators are fastened with screws, not plastic studs, so they are removed without difficulty.

Note that the fee is based on the PCB of high density, more resistant to thermal stress and humidity. But the double thickness of copper layers, the product is ASRock, not here. However, it is quite predictable.

Any brand features CPU socket LGA1151 design-v2 does not have the holes for the temperature sensor in its center and no. In this case, it is possible to install any Intel eighth and ninth generation of the Core microarchitecture.

CPU power is organized according to 8-phase scheme with assemblies Dr. MOS, durable capacitors Premium 60A Power Choke and Nichicon 12K. In this case directly on the CPU core only have six phases.

For power management meets PWM controller uP9521P production uPI Semiconductor.

Power to the Board and its components is supplied in two standard housing with 24-and 8-contacts.

 

They have no needles high density or metallic sheath. All standard.

Chipset Intel Z390 here too, the most usual, however, something special he can be, in principle, can not.

ASRock Z390 Steel plastic Legend is equipped with four DIMM slots for memory modules of standard DDR4.

The total amount of RAM on the Board can reach 128 gigabytes, and the maximum frequency of 4266 MHz. Of course, the Board supports XMP profiles, and a list of certified modules it takes a few pages.

In terms of PCI-Express fee, can be called poor. She has only one full PCI Express 3.0 x16, connected to the processor lines. He has a metallic shell to amplify and additional electrical protection.

The second slot of this form factor can only work in x4 mode, therefore, NVIDIA SLI technology is not supported, and the combination of the two AMD graphics cards will work in CrossFireX at x16/x4. In addition, the Board has three PCI Express x1 slots with open ends for the installation of long expansion cards.

Six SATA III ports with a throughput of up to 6GB/s implemented by the chipset. Four ports are located horizontally, and two vertically.

 

High speed storage, there are two Ultra M. 2 port, throughput can reach up to 32 GB/s. it is Convenient that both connectors support both SATA and PCI Express drives, and uncomfortable that М2_1 divides chipset line ports SATA3_0 (if you install a SATA drive) or SATA3_1 (if you install a PCI-E drive), and М2_2 shares lines with SATA3_5 connector.

In port М2_1 you can install drives in length from 30 to 110 mm, and in М2_2 – length from 30 to 80 mm. Feature ASRock Z390 Steel Legend: both M. 2 port is equipped with a plate-radiator with pads. To budget models of motherboards that do not meet often.

All 13 of the USB ports on the motherboard are implemented by the capabilities of the chipset Intel Z390, additional controllers, no. On the back panel, 6 ports, including two high-speed USB 3.1 Gen 2 (Type-A and Type-C) with data transfer rate up to 10 GB/s. Four ports USB 3.1 Gen 1 can be connected to the two connectors on the PCB, and similarly with fees can take the three USB 2.0 ports.

Network controller on ASRock Z390 Steel Legend single Gigabit Intel I219-V.

Claimed protection from lightning and electrostatic discharges, Protocol support PXEand energy efficient Ethernet 802.3 az.

Based on the audio Board lies 7.1 CH HD audio codec Realtek ALC1220, complemented by five audiophile Nichicon Fine Gold audio caps in Japan.

The audio room is isolated from other elements on the PCB of the multiple conductive stripes for the left and right channels are different layers of the PCB, and the connectors for the connectors are covered with 15 micron layer of gold. Except for the last one is more of a marketing move, it’s quite a standard set for budget Board.

For monitoring and fan control on the motherboard is provided by controller Nuvoton NCT6791D.

Only the Board can control six fans with PWM or voltage changes, and one of the connectors is designed to connect energy-consuming pumps cooling system and could provide up to 2 A (24 W). Setting fans available in the BIOS or in the signature Annex A-Tuning.

Unfortunately, the fee is devoid of the indicator POST-codes, and partly to replace it offers four status LEDs CPU/DRAM/VGA/BOOT in the bottom right corner of the PCB.

ASRock Z390 Steel Legend supported proprietary illumination system Polychrome RGB SYNC. On the Board itself highlighted area of the chipset and the entire reverse side of the right edge of the PCB.

To connect led strips lighting on ASRock Z390 Steel Legend has three connectors, including one addressing mode (5 V, 3 A, 15 watts). Backlight control implemented in the BIOS or through the app ASRock RGB LED.

The set of connectors on the bottom edge of the PCB is quite usual and does not stand out with some unique solutions.

In conclusion, we note quite a decent cooling system of fees, consisting of a massive aluminum heatsink on the power circuits, chipset, combined with plate-radiator of the second M. 2, a separate heat spreader for the first M. 2.

After the first inspection ASRock Z390 Steel Legend can be quite a simple Board, with an average power of the power supply system of the processor and a basic set of controllers and functions. All pretty standard and no interesting features. Now look at your BIOS.

SOURCE

Advertisement
Code: VZWDEAL. Enter this coupon code at checkout to get $100 discount on Samsung Galaxy Note 8. Includes free shipping. Restrictions may apply. Device payment purchase required.
Samsung J7 V just $5 mo. New device payment purchase req'd. Plus, free shipping.
Continue Reading

Deals

Advertisement
Samsung J7 V just $5 mo. New device payment purchase req'd. Plus, free shipping.
40801858 Netgear WiFi Cable Modem Router - Refurbished (C3700-100NAR)
40180668 Seagate Barracuda ST2000DM006 - Hard drive - 2 TB - internal - 3.5" - SATA 6Gb/s - 7200 rpm - buffer: 64 MB (ST2000DM006)

Trending